JP4691401B2 - 半導体装置用接着剤組成物および半導体装置用接着シート - Google Patents

半導体装置用接着剤組成物および半導体装置用接着シート Download PDF

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Publication number
JP4691401B2
JP4691401B2 JP2005181711A JP2005181711A JP4691401B2 JP 4691401 B2 JP4691401 B2 JP 4691401B2 JP 2005181711 A JP2005181711 A JP 2005181711A JP 2005181711 A JP2005181711 A JP 2005181711A JP 4691401 B2 JP4691401 B2 JP 4691401B2
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JP
Japan
Prior art keywords
adhesive
semiconductor device
adhesive composition
component
mass
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Expired - Lifetime
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JP2005181711A
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English (en)
Japanese (ja)
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JP2007002044A (ja
JP2007002044A5 (enExample
Inventor
正治 小林
一博 高柳
康弘 吉井
洋輔 桃内
友章 神谷
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Tomoegawa Co Ltd
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Tomoegawa Paper Co Ltd
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Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Priority to JP2005181711A priority Critical patent/JP4691401B2/ja
Priority to TW095103025A priority patent/TWI323275B/zh
Priority to KR1020060009848A priority patent/KR100727550B1/ko
Publication of JP2007002044A publication Critical patent/JP2007002044A/ja
Publication of JP2007002044A5 publication Critical patent/JP2007002044A5/ja
Application granted granted Critical
Publication of JP4691401B2 publication Critical patent/JP4691401B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
JP2005181711A 2005-02-04 2005-06-22 半導体装置用接着剤組成物および半導体装置用接着シート Expired - Lifetime JP4691401B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005181711A JP4691401B2 (ja) 2005-06-22 2005-06-22 半導体装置用接着剤組成物および半導体装置用接着シート
TW095103025A TWI323275B (en) 2005-02-04 2006-01-26 Adhesive composition and adhesive sheet for semiconductor device
KR1020060009848A KR100727550B1 (ko) 2005-02-04 2006-02-01 반도체 장치용 접착제 조성물 및 반도체 장치용 접착시트

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005181711A JP4691401B2 (ja) 2005-06-22 2005-06-22 半導体装置用接着剤組成物および半導体装置用接着シート

Publications (3)

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JP2007002044A JP2007002044A (ja) 2007-01-11
JP2007002044A5 JP2007002044A5 (enExample) 2007-06-21
JP4691401B2 true JP4691401B2 (ja) 2011-06-01

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JP2005181711A Expired - Lifetime JP4691401B2 (ja) 2005-02-04 2005-06-22 半導体装置用接着剤組成物および半導体装置用接着シート

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JP (1) JP4691401B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4933281B2 (ja) * 2007-01-17 2012-05-16 日東シンコー株式会社 モーター用絶縁紙
JP5303326B2 (ja) * 2008-06-18 2013-10-02 積水化学工業株式会社 接着フィルム、ダイシング−ダイボンディングテープ及び半導体装置の製造方法
EP2624287A4 (en) 2010-09-30 2015-04-29 Sumitomo Bakelite Co LIQUID MARKET COMPOSITION AND SEMICONDUCTOR DEVICE
KR101799499B1 (ko) * 2014-12-24 2017-12-20 주식회사 엘지화학 반도체 접착용 수지 조성물, 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치
JP6553427B2 (ja) * 2015-06-30 2019-07-31 デクセリアルズ株式会社 補強フレキシブルプリント配線板の製造方法、熱硬化性樹脂組成物及び熱硬化性接着シート

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4578425A (en) * 1985-02-13 1986-03-25 Schenectady Chemicals, Inc. Phenolic resins, carboxylic resins and the elastomers containing adhesive
JPH0619077B2 (ja) * 1987-12-11 1994-03-16 住友ベークライト株式会社 導電性樹脂ペースト
JPH10178053A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート
JPH10176099A (ja) * 1996-12-19 1998-06-30 Toshiba Corp エポキシ樹脂組成物、およびこれを用いた樹脂封止型半導体装置
JP2000164607A (ja) * 1998-11-24 2000-06-16 Hitachi Chem Co Ltd 電子部品用接着部材、電子部品用接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置
JP2001115127A (ja) * 1999-10-19 2001-04-24 Hitachi Chem Co Ltd 導電性接着剤とそれを用いた配線板
JP3621337B2 (ja) * 1999-12-21 2005-02-16 株式会社巴川製紙所 半導体装置用接着剤組成物及び接着シート
JP2003206452A (ja) * 2002-01-10 2003-07-22 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置
JP4031721B2 (ja) * 2002-04-03 2008-01-09 株式会社巴川製紙所 半導体装置製造用接着シート
JP2004018718A (ja) * 2002-06-18 2004-01-22 Mitsui Chemicals Inc 半導体装置用接着剤組成物
JP4547866B2 (ja) * 2003-05-29 2010-09-22 東レ株式会社 半導体用接着剤付きテープおよび半導体接続用基板ならびに半導体装置
JP2005146044A (ja) * 2003-11-12 2005-06-09 Sumitomo Electric Ind Ltd 異方導電性接着剤

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JP2007002044A (ja) 2007-01-11

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