JP4672464B2 - 洗浄装置および洗浄方法、ならびにコンピュータにより読取可能な記憶媒体 - Google Patents

洗浄装置および洗浄方法、ならびにコンピュータにより読取可能な記憶媒体 Download PDF

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Publication number
JP4672464B2
JP4672464B2 JP2005192725A JP2005192725A JP4672464B2 JP 4672464 B2 JP4672464 B2 JP 4672464B2 JP 2005192725 A JP2005192725 A JP 2005192725A JP 2005192725 A JP2005192725 A JP 2005192725A JP 4672464 B2 JP4672464 B2 JP 4672464B2
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JP
Japan
Prior art keywords
cover
cleaning
liquid level
cleaning tank
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005192725A
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English (en)
Japanese (ja)
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JP2007007577A (ja
Inventor
和善 江嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2005192725A priority Critical patent/JP4672464B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to PCT/JP2006/312879 priority patent/WO2007004485A1/ja
Priority to EP06767496A priority patent/EP1900448B1/en
Priority to AT06767496T priority patent/ATE464131T1/de
Priority to US11/922,480 priority patent/US7900640B2/en
Priority to DE602006013639T priority patent/DE602006013639D1/de
Priority to TW095123871A priority patent/TW200707570A/zh
Publication of JP2007007577A publication Critical patent/JP2007007577A/ja
Application granted granted Critical
Publication of JP4672464B2 publication Critical patent/JP4672464B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0402Apparatus for fluid treatment
    • H10P72/0406Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/048Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2005192725A 2005-06-30 2005-06-30 洗浄装置および洗浄方法、ならびにコンピュータにより読取可能な記憶媒体 Expired - Fee Related JP4672464B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2005192725A JP4672464B2 (ja) 2005-06-30 2005-06-30 洗浄装置および洗浄方法、ならびにコンピュータにより読取可能な記憶媒体
EP06767496A EP1900448B1 (en) 2005-06-30 2006-06-28 Washing device and washing method
AT06767496T ATE464131T1 (de) 2005-06-30 2006-06-28 Waschvorrichtung und waschverfahren
US11/922,480 US7900640B2 (en) 2005-06-30 2006-06-28 Cleaning apparatus including cleaning tank with improved cover
PCT/JP2006/312879 WO2007004485A1 (ja) 2005-06-30 2006-06-28 洗浄装置および洗浄方法
DE602006013639T DE602006013639D1 (de) 2005-06-30 2006-06-28 Waschvorrichtung und waschverfahren
TW095123871A TW200707570A (en) 2005-06-30 2006-06-30 Washing device and washing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005192725A JP4672464B2 (ja) 2005-06-30 2005-06-30 洗浄装置および洗浄方法、ならびにコンピュータにより読取可能な記憶媒体

Publications (2)

Publication Number Publication Date
JP2007007577A JP2007007577A (ja) 2007-01-18
JP4672464B2 true JP4672464B2 (ja) 2011-04-20

Family

ID=37604354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005192725A Expired - Fee Related JP4672464B2 (ja) 2005-06-30 2005-06-30 洗浄装置および洗浄方法、ならびにコンピュータにより読取可能な記憶媒体

Country Status (6)

Country Link
US (1) US7900640B2 (https=)
EP (1) EP1900448B1 (https=)
JP (1) JP4672464B2 (https=)
DE (1) DE602006013639D1 (https=)
TW (1) TW200707570A (https=)
WO (1) WO2007004485A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4630881B2 (ja) * 2007-03-05 2011-02-09 シャープ株式会社 基板洗浄装置
JP2009080035A (ja) * 2007-09-26 2009-04-16 Olympus Corp 分析装置
JP5179282B2 (ja) * 2007-09-27 2013-04-10 大日本スクリーン製造株式会社 基板処理装置及び基板処理方法
US20090087566A1 (en) * 2007-09-27 2009-04-02 Masahiro Kimura Substrate treating apparatus and substrate treating method
WO2012085686A2 (en) * 2010-12-20 2012-06-28 Cantrell John W Fluid screen for pot and pan washing machine
DE102012001721A1 (de) * 2012-01-31 2013-08-01 Rena Gmbh Spüleinrichtung zum Abspülen einer Behandlungsflüssigkeit und Verfahren dazu
TWI569351B (zh) * 2015-04-30 2017-02-01 環球晶圓股份有限公司 晶圓旋轉裝置
KR20220000409A (ko) * 2019-05-23 2022-01-03 램 리써치 코포레이션 챔버 컴포넌트 청정도 측정 시스템
CN112058774B (zh) * 2020-08-24 2021-11-30 台州市亿源塑业有限公司 一种湿法刻蚀清洗机构的溢流槽结构
CN115328219B (zh) * 2022-07-26 2025-03-25 海南大学 一种用于柔性机构的电磁驱动控制系统和方法
CN120714987A (zh) * 2024-03-27 2025-09-30 盛美半导体设备(上海)股份有限公司 槽盖及基板液处理槽

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2617610B2 (ja) * 1990-08-16 1997-06-04 山形日本電気株式会社 ウェーハ処理装置
JPH06104234A (ja) * 1992-09-18 1994-04-15 Matsushita Electric Ind Co Ltd 基板洗浄装置
JPH0652143U (ja) * 1992-12-25 1994-07-15 住友シチックス株式会社 洗浄装置
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
DE4336704A1 (de) * 1993-10-27 1995-05-04 Wacker Chemitronic Verfahren und Vorrichtung zur Behandlung von scheibenförmigen Werkstücken mit einer Flüssigkeit
JP3464843B2 (ja) * 1995-03-30 2003-11-10 大日本スクリーン製造株式会社 基板処理装置における基板処理方法および基板処理装置
JP3534211B2 (ja) * 1995-09-29 2004-06-07 富士写真フイルム株式会社 感光性平版印刷版の自動現像装置
JP3336223B2 (ja) * 1997-04-15 2002-10-21 東京エレクトロン株式会社 洗浄システム及び洗浄方法
US6050446A (en) * 1997-07-11 2000-04-18 Applied Materials, Inc. Pivoting lid assembly for a chamber
JP2000031103A (ja) * 1998-07-14 2000-01-28 Sony Corp 洗浄方法、洗浄液置換方法、洗浄装置並びに洗浄槽
JP2001176833A (ja) * 1999-12-14 2001-06-29 Tokyo Electron Ltd 基板処理装置
JP2001338904A (ja) * 2000-05-30 2001-12-07 Konan Koki Kk ウェハの洗浄装置
KR100513397B1 (ko) * 2001-01-12 2005-09-09 삼성전자주식회사 반도체 웨이퍼 세정시스템 및 그 세정액 공급방법
JP2004358283A (ja) * 2003-05-30 2004-12-24 Seiko Epson Corp 薬液処理装置、薬液処理方法および回路基板の製造方法
KR100593669B1 (ko) * 2004-06-21 2006-06-28 삼성전자주식회사 기판 습식 처리용 덮개 및 이를 구비하는 기판 습식처리장치

Also Published As

Publication number Publication date
US7900640B2 (en) 2011-03-08
EP1900448A1 (en) 2008-03-19
TW200707570A (en) 2007-02-16
EP1900448A4 (en) 2009-05-27
DE602006013639D1 (de) 2010-05-27
US20090120466A1 (en) 2009-05-14
TWI329894B (https=) 2010-09-01
JP2007007577A (ja) 2007-01-18
EP1900448B1 (en) 2010-04-14
WO2007004485A1 (ja) 2007-01-11

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