Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/04—Apparatus for manufacture or treatment
  • H10P72/0402—Apparatus for fluid treatment
  • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
  • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
  • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
  • B08B3/04—Cleaning involving contact with liquid
  • B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed

Definitions

• the present invention relates to a cleaning apparatus and a cleaning method for immersing and cleaning an object to be processed in a chemical solution tank in which a chemical solution for cleaning is stored, and a computer-readable storage medium for executing the method About.
• wafers semiconductor wafers
• Contamination such as particles, organic contaminants, and metal impurities on the surface
• the wafer must be cleaned and removed.
• a wafer cleaning process a method in which a predetermined cleaning solution is stored in a cleaning tank and the wafer is immersed therein is frequently used.
• Such a cleaning process has an advantage that particles adhering to the wafer can be effectively removed.
• Patent Document 1 JP-A-10-289894
• An object of the present invention is to provide a cleaning apparatus and a cleaning method capable of improving the unevenness of the cleaning process by suppressing the dissolution of gas in the chemical liquid stored in the chemical tank.
• Another object of the present invention is to provide a computer-readable storage medium for performing such a cleaning method.
• a cleaning tank storing a processing liquid used for cleaning the target object, a target object holding mechanism for holding the target object in the cleaning tank, A treatment liquid supply mechanism for supplying the treatment liquid to the cleaning tank, and the treatment liquid is supplied to the treatment tank and the treatment object is immersed in the treatment liquid in a state where the treatment object is disposed in the cleaning tank.
• a cleaning apparatus that cleans an object to be processed while overflowing a processing liquid from the cleaning tank cover, a cover that covers the liquid surface of the cleaning tank, a support member that supports the cover, and the cover. Is provided with a follow-up mechanism that moves the cover following the liquid level while the cover is supported by the support member.
• the following mechanism can be configured to operate so as to rise and fall following at least the liquid level.
• the follow-up mechanism can be configured to follow the movement of following the liquid level of the cover.
• an opening / closing mechanism for opening / closing the cover may be further provided.
• the processing liquid supply mechanism selectively supplies a plurality of processing liquids to the cleaning tank, discharges the processing liquid from the cleaning tank, supply and discharge of the processing liquid, and A control mechanism for controlling the opening and closing of the cover, wherein the control mechanism replaces a plurality of processing liquids in the cleaning tank and performs at least a plurality of processes according to a processing sequence of a plurality of processes continuously performed.
• the cover can be controlled to be closed during a certain period.
• the cover may be divided into two divided pieces, and the cover opening / closing mechanism may have two drive mechanisms that open and close the cover by rotating the two divided pieces.
• the following mechanism is A part of the cover opening / closing mechanism may be configured, provided between the two drive mechanisms and the two divided pieces, respectively, and configured to be rotated together with the divided pieces by the drive mechanism. .
• the follow-up mechanism may have a slide mechanism, or may have a parallelogram link mechanism.
• the cover opening / closing mechanism further includes a moving mechanism that moves the cover between a position that allows movement following the liquid level of the cover and a position above the liquid level, and the movement is performed when the cover is opened.
• a mechanism may be configured to raise the force bar.
• the cover is divided into two divided pieces
• the follow-up mechanism constitutes a part of the cover opening / closing mechanism
• the cover opening / closing mechanism includes the two pieces.
• the two rotating members that are attached to the shafts of the two drive mechanisms and rotated by the two drive mechanisms, and the two drive mechanisms
• Each of the two parallelogram links provided as the following mechanism and supporting each of the two divided pieces, and the two rotation members, and the two parallelogram links are attached to the cover.
• Two cylinder mechanisms that move between a position that allows movement following the liquid level and a position above the liquid level, and the two drive mechanisms are configured by the two cylinder mechanisms. In a state where the row quadrilateral link is moved to a position above the liquid level, the two divided pieces are rotated together with the two rotation mechanisms, the two cylinder mechanisms, and the two parallelogram links. It can be set as the structure which opens a cover.
• a cleaning tank storing a processing liquid used for cleaning the target object, a target object holding mechanism for holding the target object in the cleaning tank,
• a cleaning process is performed using a cleaning apparatus that includes a processing liquid supply mechanism that supplies a processing liquid to the cleaning tank, a processing liquid discharge mechanism that discharges the processing liquid from the cleaning tank, and a cover that covers the liquid level of the cleaning tank.
• a cleaning method for performing treatment disposing a target object in the cleaning tank, supplying a processing liquid to the processing tank in which the target object is disposed, and immersing the target object in the processing liquid; Cleaning the target object while overflowing the processing liquid from the cleaning tank, and cleaning the target object while cleaning the target object while overflowing the processing liquid.
• a cleaning method is provided that follows the surface.
• the cover can be opened and closed, and in the cleaning tank, a plurality of treatment liquids are alternately replaced to perform a plurality of treatments continuously. Depending on the sequence, the cover can be closed during at least some periods of the plurality of processes.
• a cleaning tank that operates on a computer and stores a processing liquid used for cleaning the target object, and a target object that holds the target object in the cleaning tank.
• a cleaning apparatus comprising: a holding mechanism; a processing liquid supply mechanism that supplies a processing liquid to the cleaning tank; a processing liquid discharge mechanism that discharges the processing liquid from the cleaning tank; and a cover that covers a liquid surface of the cleaning tank.
• a computer-readable storage medium storing a control program for controlling, wherein the control program arranges an object to be processed in the cleaning tank at the time of execution, and the process in which the object to be processed is arranged.
• the liquid level of the washing tank is changed. Since the covering cover, the supporting member for supporting the cover, and the follower mechanism for moving the covering following the liquid surface in a state where the cover is supported by the supporting member, the liquid surface is provided during the cleaning process. Since the pressure bar can be closely attached to the processing liquid and the gas can be prevented from coming into contact with the processing liquid as much as possible, the dissolution of the gas in the processing liquid can be reduced and the unevenness of the cleaning process can be reduced. it can.
• the cover when the cover can be opened and closed and a plurality of treatment liquids can be supplied to the cleaning tank, a plurality of treatment liquids are replaced in the cleaning tank and a plurality of treatments are continuously performed.
• the influence of the dissolution of gas on the cleaning process is controlled by closing the cover during at least a part of the period of the plurality of processes. In the case of processing where liquid disturbance is a concern due to covering the It is possible to open the bar and close the cover only when the gas dissolution has a significant effect on the cleaning process.
• FIG. 1 is a plan view showing a cleaning apparatus according to an embodiment of the present invention.
• FIG. 2 is a cross-sectional view taken along line A—A in FIG.
• FIG. 3 is a sectional view taken along line BB in FIG.
• FIGS. 4 is a cross-sectional view showing the configuration of a slide mechanism that is a component of the rotation mechanism of the cleaning device shown in FIGS.
• FIG. 5 is a front view schematically showing a state in which the cover covers the liquid surface in the cleaning apparatus shown in FIGS.
• FIG. 6 is a front view schematically showing a state in which the cover is opened in the cleaning apparatus shown in FIGS.
• FIG. 7 is a diagram of air piping for driving the drive mechanism in the cover opening / closing mechanism of the cleaning apparatus shown in FIGS. 1 to 3 and a diagram of N gas introduced into the casing.
• FIG. 8 is a schematic diagram showing supply and discharge of processing liquid and control of the cleaning apparatus in the cleaning apparatus according to the embodiment of the present invention.
• FIG. 9 is a diagram for explaining an example of a cleaning processing sequence and a force bar opening / closing operation in the cleaning apparatus of the embodiment of the present invention.
• FIG. 10 is a flowchart of the cleaning process in the cleaning apparatus of one embodiment of the present invention.
• FIG. 11 is a diagram for explaining another example of the cover opening / closing operation during the processing sequence shown in FIG. 9.
• FIG. 12 is a partial sectional side view showing a modification of the cover opening / closing mechanism.
• FIG. 13 is a front view showing a modification of the cover opening / closing mechanism.
• FIG. 14 is a partial cross-sectional side view showing a state in which the cover located on the liquid surface is raised in a modification of the cover opening / closing mechanism.
• FIG. 15 is a front view showing a state where the cover located on the liquid surface is raised in a modification of the cover opening / closing mechanism.
• FIG. 16 shows a drive mechanism that is a rotary actuator in a modification of the cover opening / closing mechanism. And a piping diagram of air for driving the cylinder mechanism and a piping diagram of N gas introduced into the casing.
• FIG. 17 is a front view showing a state in which the cover is opened in a modified example of the cover opening / closing mechanism.
• FIG. 1 is a plan view showing a cleaning apparatus according to an embodiment of the present invention
• FIG. 2 is a sectional view taken along line AA
• FIG. 3 is a sectional view taken along line BB.
• the cleaning apparatus of the present embodiment has a housing 1 and a cleaning tank 2 provided therein, and a predetermined processing liquid is stored in the cleaning tank 2. Then, as will be described later, a predetermined processing liquid is supplied to the cleaning tank 2 through a nozzle 3 (see FIGS. 2 and 3) functioning as a processing liquid supply mechanism provided in the cleaning tank 2 as well as a predetermined supply source.
• a nozzle 3 functioning as a processing liquid supply mechanism provided in the cleaning tank 2 as well as a predetermined supply source.
• a plurality of, for example, 50 wafers W are held by the wafer holding member 4.
• the wafer holding member 4 extends upward along the inner wall of the wafer holding unit 5 that holds the wafer W in the horizontal direction while holding the wafer W, and the edge force of the wafer holding unit 5 to hold the wafer.
• a support part 6 that supports the part 5, and the wafer holding part 5 is moved up and down via the support part 6 by a driving mechanism (not shown), so that the wafer W can be taken in and out of the cleaning tank 2. .
• the transfer of the wafer W to the wafer holding member 4 is performed by an appropriate transfer device.
• the wafer holding unit 5 includes a first holding bar 5a that holds the vicinity of the lower end of the wafer W, and a second holding bar 5b that holds the wafer W slightly above it. A plurality of grooves for holding the wafer W are formed in the two holding rods 5a and 5b.
• a cover 10 is provided on the liquid level of the cleaning tank 2 so as to be able to follow the liquid level and to be opened and closed.
• the cover 10 is divided into two divided pieces 10a and 10b at the center.
• the cover 10 is opened and closed by rotating the split pieces 10a and 10b by the force bar opening and closing mechanism 20. It is.
• the split pieces 10a and 10b are formed with their mating surfaces diagonally so that they do not interfere with each other when closed and no gaps are formed! /
• the cover opening / closing mechanism 20 includes a casing 13, drive mechanisms 12a and 12b capable of individually driving the divided pieces 10a and 10b, and slide mechanisms 14a and 14b (see FIGS. 2 and 4). have.
• the drive mechanisms 12a and 12b are composed of rotary actuators.
• the drive mechanisms 12a and 12b are respectively provided with rotatable shafts 16a and 16b, and the slide mechanisms 14a and 14b are rotatably connected via the shafts 16a and 16b, respectively.
• the divided pieces 10a and 10b are fixed to the upper portions of the slide mechanisms 14a and 14b via support plates 15a and 15b, respectively.
• the cover 10 is made of, for example, fluorine-based resin and is in a state of floating on the surface of the processing liquid.
• the cover 10 can follow the liquid level in the washing tank 2 by sliding the slide mechanisms 14a and 14b. That is, the slide mechanisms 14a and 14b also function as a mechanism for causing the cover 10 to follow the liquid level.
• the cover 10 is for preventing gas from dissolving in the processing liquid and causing unevenness in the cleaning process, and preferably covers the liquid surface of the cleaning tank 2 in a wide range as much as possible. However, it is necessary to overflow the treatment liquid from the washing tank 2, and if a cover exists in the overflow portion, the overflow will be hindered. Further, it is necessary to secure a space for the support member 6 of the wafer holding member 4.
• the slide mechanism 14a includes a base box 25 fixed to a shaft 16a extending horizontally from the drive mechanism 12a, and a shaft 21 having one end fixed to the support plate 15a and extending into the base box 25.
• a linear bush 22 that is provided in the base box and guides the shaft 21 so as to be linearly movable, a bracket 23 that is provided below the linear bush 22 and stops the shaft 21 in an arbitrary position, and under the bracket 23. And provided with a stopper 24 of a shaft 21 provided.
• the slide mechanism 14b is constructed in exactly the same way!
• the slide mechanisms 14a and 14b are configured in this way, the cover 10 covers the liquid surface, and the cover 10 is lifted by the buoyancy of the processing liquid.
• the slide mechanisms 14a and 14b slide so that the cover 10 moves up and down following the change.
• the slide mechanisms 14a and 14b are configured such that when the cover 10 covers the liquid surface, the driving mechanism is a rotary actuator as shown in FIG. 12a , 12b rotate the shafts 16a, 16b to rotate the divided pieces 10a, 10b of the cover 10 together with the shafts 16a, 16b together with the slide mechanisms 14a, 14b, so that the cover 10 is opened.
• the driving mechanism is a rotary actuator as shown in FIG. 12a , 12b rotate the shafts 16a, 16b to rotate the divided pieces 10a, 10b of the cover 10 together with the shafts 16a, 16b together with the slide mechanisms 14a, 14b, so that the cover 10 is opened.
• the drive mechanism 12a which is a rotary actuator, is driven when air is supplied through a pipe 30 as shown in the piping diagram of FIG. Actual driving is performed by controlling a solenoid valve 31 provided in the pipe by a control unit (not shown).
• the drive mechanism 12b has the same configuration.
• Reference numeral 32 is a regulator. Also, in order to prevent oxidation of the drive unit, N gas passes through the pipe 33 and the casing 13 and
• the slide mechanisms 14a and 14b are introduced into the base box 25.
• a treatment liquid supply pipe 40 for supplying a treatment liquid is connected to the nozzle 3 in the cleaning tank 2.
• a processing liquid supply unit 41 is disposed on the other end side of the processing liquid supply pipe 40.
• the treatment liquid supply unit 41 includes an ammonia supply source 42 for supplying ammonia, a DHF supply source 43 for supplying dilute hydrofluoric acid (DH F), a DIW supply source 44 for supplying pure water (DIW), and isopropyl alcohol (IPA).
• a rinsing liquid supply source 45 for supplying a rinsing liquid such as a processing liquid supply pipe 40 is provided with pipes 46, 47, 48, 49 extending from these respectively on the processing liquid supply pipe 40.
• the processing liquid supply pipe 40 is provided with a pump 57, a damper 58, a heater 59, a filter 60, and an on-off valve 61 in order of upstream force. Then, by operating the pump 57, the predetermined processing liquid is fed toward the cleaning tank 2, the processing liquid is heated to a predetermined temperature by the heater 59, and impurities in the processing liquid are removed by the filter 60, and then the cleaning tank 2 is supplied with the processing solution.
• processing liquid discharge pipes 62 and 63 are connected to the bottom of the cleaning tank 2 and the center of the bottom of the outer tank 8, respectively, and open / close valves 64 and 65 are connected to them.
• Each component of the cleaning apparatus as described above for example, an open / close valve provided in each pipe, a pump 57, a wafer W transfer mechanism, a drive mechanism 12a, 12b for opening / closing the cover, etc. It is connected to a controller (control mechanism) 70 for control.
• a controller control mechanism 70 for control.
• a user interface 71 Connected to the process controller 70 is a user interface 71 that also has a keyboard that allows the process manager to input commands to manage the cleaning equipment, and a display that visualizes and displays the operating status of the cleaning equipment. Being!
• the process controller 70 has a control program for realizing various processes executed by the cleaning device by the control of the process controller 70, and causes each component to execute processes according to the processing conditions.
• a storage unit 72 storing the program, i.e., recipe, is connected.
• the recipe may be stored in a hard disk or a semiconductor memory, or may be set at a predetermined position in the storage unit 72 while being stored in a portable storage medium such as a CD ROM or DVD.
• the recipe may be appropriately transmitted from another device via, for example, a dedicated line.
• FIG. 9 is a diagram for explaining an example of the processing sequence and cover opening / closing operation
• FIG. 10 is a flowchart of the cleaning processing at this time.
• the cover 10 is opened by the cover opening / closing mechanism 20 (Step 3), and the wafer holding member 5 of the wafer holding member 4 is positioned above the cleaning tank 2, and a plurality of transfer device forces (not shown), For example, 50 wafers W are transferred to the wafer holder 5, the wafer holding member 4 is lowered by a drive mechanism (not shown), and the wafer W is immersed in pure water (DIW) in the cleaning tank 2 (step 4).
• DIW pure water
• the cover 10 is opened by the cover opening / closing mechanism 20, as shown in FIG. 6, the shafts 16a, 16b are rotated by the drive mechanisms 12a, 12b, which are rotary actuators, so that the divided pieces are separated via the slide mechanisms 14a, 14b. Turn 10a and 10b.
• the cover opening / closing mechanism 20 closes the force bar 10 and covers the liquid surface with the cover (step 5).
• the shafts 16a and 16b of the rotary actuators 12a and 12b are rotated to change the state shown in FIG. 6 to the state shown in FIG. In this state, the cover 10 can move following the liquid level of the pure water by the slide mechanisms 14a and 14b.
• cleaning with pure water (DIW) is performed while allowing pure water (DIW) to overflow from the cleaning tank 2 (step 6).
• open / close valves 64 and 65 are opened, and pure water is discharged from cleaning tank 2 and outer tank 8 through treatment liquid discharge pipes 62 and 63 (step 7).
• the opening / closing valve 52 is opened to supply dilute hydrofluoric acid (DH F) into the cleaning tank 2 from the dilute hydrofluoric acid (DHF) supply source 43, and the cleaning process is performed while overflowing dilute hydrofluoric acid (DHF) ( Step 8).
• DH F dilute hydrofluoric acid
• DHF dilute hydrofluoric acid
• DHF dilute hydrofluoric acid
• Step 9 pure water (DIW) is supplied into the washing tank 2 in the same procedure as in Step 1, and washing is performed while overflowing the pure water (D IW) (Step 10).
• DIW pure water
• step 11 pure water (DIW) is discharged from the washing tank 2 and the outer tank 8 in the same procedure as in step 7 (step 11), and then the on-off valve 51 is opened to start the washing tank 2 from the ammonia supply source 42. Ammonia is supplied inside and cleaning is performed while overflowing ammonia (step 12).
• DIW pure water
• step 13 ammonia is discharged from the washing tank 2 and the outer tank 8 in the same procedure as in the step 7 (step 13), and then pure water (DIW) is supplied into the washing tank 2 in the same procedure as in the step 1. Then, the cleaning process is performed while overflowing pure water (DIW) (step 14).
• DIW pure water
• step 16 pure water (DIW) is discharged from the washing tank 2 and the outer tank 8 in the same procedure as in step 7 (see FIG. 15), and then the opening / closing valve 54 is opened to supply the rinsing liquid from the rinsing liquid supply source 45 into the cleaning tank 2, and the rinsing process is performed (step 16).
• DIW pure water
• the cover is opened by the cover opening / closing mechanism 20 (step 17), the wafer holding member 4 is moved above the cleaning tank 2, and a plurality of wafers held by the wafer holding unit 5 are illustrated. Na! Pass to the transport mechanism (process 18).
• the liquid level of the cleaning tank 2 is always covered with the force bar 10 except when the wafer W is loaded and unloaded during the above cleaning process, and when the cover 10 is mounted, the slide mechanism Since the cover 10 can move following the liquid level by 14a and 14b, the cover 10 can be kept in contact with the liquid level at all times. Is prevented from touching. Therefore, it is possible to prevent the gas from dissolving in the processing liquid and causing unevenness in the cleaning process. Specifically, since such a cleaning process is typically performed in the air, in the absence of a cover, oxygen in the air dissolves in the processing liquid, which may adversely affect the cleaning process. This is unlikely to occur in this embodiment.
• the cover opening / closing mechanism 20 includes drive mechanisms 12a and 12b that are rotary actuators.
• the drive mechanisms 12a and 12b rotate the shafts 16a and 16b, respectively.
• the slide mechanism 14a and 14b can be opened and closed with a relatively simple mechanism that allows the divided pieces 10a and 10b of the cover 10 to rotate, and the cover mechanism can be opened and closed.
• the slide mechanism that follows to allow the movement to follow the liquid level of the cover is provided, so that the equipment becomes large and the cover 10 becomes obstructed when loading / unloading the wafer W There is no.
• the above is the force shown in the case where the liquid level is covered with the cover 10 during a period other than when the wafer W is loaded and unloaded. It is not always necessary to cover the liquid level with the cover 10 during the entire processing period. In other words, in cases where the liquid level is covered with a cover that has little influence on the cleaning process due to the dissolution of gas, the liquid may be disturbed, so that the process may be performed with the cover open. Good.
• dilute hydrofluoric acid (DHF) has a possibility that the uniformity of the liquid flow may be hindered by providing a cover depending on conditions in which the influence of gas contact is relatively small. Up to the dilute hydrofluoric acid (DHF) treatment in the above treatment sequence may be performed with the cover 10 opened.
• the pure water (DIW) treatment power before the chemical treatment is preferably carried out with the cover closed. This can more effectively prevent the chemical solution from coming into contact with the gas.
• the cover 10 is closed before the pure water (DIW) treatment before the ammonia treatment, and the ammonia in the cleaning tank 2 is prevented from contacting the gas as much as possible during the ammonia treatment.
• FIG. 12 is a partial cross-sectional side view for explaining the configuration of the cover opening / closing mechanism according to this modification
• FIG. 13 is a front view of the cover opening / closing mechanism according to this modification.
• the cover opening / closing mechanism 20 ′ includes a casing 13 and drive mechanisms 12a, 12b configured as rotary actuators, which are arranged in the same manner as the cover opening / closing mechanism 20 described above.
• the vertical movement mechanism 17a, 17b that moves the split pieces 10a, 10b between a position that can follow the liquid level and the position above the liquid level, and the shafts 16a, 16b of the horse motion mechanism 12a, 12b, respectively.
• a rotating member that is attached and supports the vertical movement mechanisms 17a and 17b, and rotates as the shafts 16a and 16b rotate to rotate the divided pieces 10a and 10b via the vertical movement mechanisms 17a and 17b.
• the vertical movement mechanism 17a includes a casing 81 fixed to the upper end of the rotating member 18a, a cylinder mechanism 82 including a piston 83 disposed in the casing 81 and moving in and out in the horizontal direction, and a piston 83, a parallelogram link 84 movably provided by 83, a connecting member 85 for connecting one horizontal link of the parallelogram link 84 and the divided piece 10a of the cover 10, and a flexible covering the parallelogram link 84. And a casing 86 having characteristics.
• the parallelogram link 84 is free as shown in FIGS. 12 and 13, and the segment 10a can move following the liquid level in the cleaning tank 2. It becomes.
• the vertical movement mechanism 17b is configured in exactly the same manner, and the segment 10b can move following the liquid level in the cleaning tank 2 with the parallelogram link 84 free. That is, the parallelogram link 84 also functions as a mechanism for causing the cover 10 to follow the liquid level.
• the solenoid valve 91 provided in the pipe is not shown in the drive mechanism 12a, and the solenoid valve 92 provided in the pipe is not shown in the cylinder mechanism 82 by being controlled by the control unit. This is done by controlling by the control unit.
• the drive mechanism 12b and the vertical movement mechanism 17b are exactly the same.
• Reference numeral 93 is a regulet. In order to prevent oxidation of the drive unit, N gas is
• the state force of FIG. 16 is also divided by rotating the shafts 16a, 16b of the drive mechanisms 12a, 12b inward and via the rotating members 18a, 18b and the vertical movement mechanisms 17a, 17b. Move the pieces 10a and 10b toward the liquid level to the state shown in Figs. 14 and 15, and then move the piston 83 of the cylinder mechanism 82 of the vertical motion mechanism 17a and 17b forward so that the parallelogram link 84 is free. The divided pieces 10a and 10b are made to follow the liquid level.
• the cover opening / closing mechanism 20 'as described above when the cover 10 is mounted, the cover 10 can move following the liquid level by the parallelogram links 84 of the vertical movement mechanisms 17a and 17b. Therefore, the cover 10 can be kept in contact with the liquid level at all times, and the gas can be prevented from contacting the portion of the liquid level where the cover 10 exists. Because of this, processing It is possible to prevent the gas from dissolving in the liquid and causing unevenness in the cleaning process. Also, the shafts 6a and 16b of the drive mechanisms 12a and 12b are rotated to rotate the divided pieces 10a and 10b of the cover 10 together with the rotating members 18a and 18b and the vertical moving mechanisms 17a and 17b.
• the cover 10 can be opened and closed with simple operation, and the quadrilateral link mechanism that follows to allow the movement to follow the liquid level of the cover is installed as the follower mechanism. However, the cover 10 is not obstructed when loading or unloading the wafer W. Furthermore, when the cover 10 is opened, the divided pieces 10a and 10b of the cover 10 are lifted from the liquid level at one end, and the force also rotates the divided pieces 10a and 10b, so that the processing liquid can be splashed up or the liquid level can be disturbed. Inconvenience can be avoided.
• the cover opening / closing mechanism 20 is provided with a mechanism for moving the divided pieces 10a, 10b upward, and when the cover 10 is opened, the liquid pieces of the divided pieces 10a, 10b of the cover 10 are increased by one liquid level force. It can be done by rubbing the force split pieces 10a, 10b to rotate.
• the force cover showing the cover divided into two types may be constituted by one sheet.
• a force bar opening / closing mechanism, a follow-up mechanism and the like similar to the above-described configuration may be provided only on one side of the cover.
• the cover divided into two may be opened by other methods such as a force slide or folding shown in an example of so-called double doors.
• the number of cover divisions is not limited to two and may be three or more.
• the mechanism for causing the cover to follow the liquid level is not limited to the above example.
• a slide mechanism or a parallelogram link mechanism that is a mechanism that allows the movement to follow the liquid level of the cover is shown as the tracking mechanism.
• Sensor and the tracking mechanism is actively activated based on the liquid level detected by the liquid level sensor.
• the follow-up mechanism is actively controlled based on the monitored value of the processing liquid injection amount or the injection amount value on the recipe. Also good.
• the present invention is suitable for all cleaning processes in which a target object such as a semiconductor wafer is immersed in a cleaning liquid and cleaned while the cleaning liquid is overflowed.

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• Cleaning Or Drying Semiconductors (AREA)
• Cleaning By Liquid Or Steam (AREA)

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• 2005
  • 2005-06-30 JP JP2005192725A patent/JP4672464B2/ja not_active Expired - Fee Related
• 2006
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  • 2006-06-28 US US11/922,480 patent/US7900640B2/en not_active Expired - Fee Related
  • 2006-06-28 EP EP06767496A patent/EP1900448B1/en not_active Not-in-force
  • 2006-06-28 WO PCT/JP2006/312879 patent/WO2007004485A1/ja not_active Ceased
  • 2006-06-30 TW TW095123871A patent/TW200707570A/zh not_active IP Right Cessation

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