TW200707570A - Washing device and washing method - Google Patents

Washing device and washing method

Info

Publication number
TW200707570A
TW200707570A TW095123871A TW95123871A TW200707570A TW 200707570 A TW200707570 A TW 200707570A TW 095123871 A TW095123871 A TW 095123871A TW 95123871 A TW95123871 A TW 95123871A TW 200707570 A TW200707570 A TW 200707570A
Authority
TW
Taiwan
Prior art keywords
washing
washing tank
treated body
cover
treatment liquid
Prior art date
Application number
TW095123871A
Other languages
English (en)
Chinese (zh)
Other versions
TWI329894B (https=
Inventor
Kazuyoshi Eshima
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200707570A publication Critical patent/TW200707570A/zh
Application granted granted Critical
Publication of TWI329894B publication Critical patent/TWI329894B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW095123871A 2005-06-30 2006-06-30 Washing device and washing method TW200707570A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005192725A JP4672464B2 (ja) 2005-06-30 2005-06-30 洗浄装置および洗浄方法、ならびにコンピュータにより読取可能な記憶媒体

Publications (2)

Publication Number Publication Date
TW200707570A true TW200707570A (en) 2007-02-16
TWI329894B TWI329894B (https=) 2010-09-01

Family

ID=37604354

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095123871A TW200707570A (en) 2005-06-30 2006-06-30 Washing device and washing method

Country Status (6)

Country Link
US (1) US7900640B2 (https=)
EP (1) EP1900448B1 (https=)
JP (1) JP4672464B2 (https=)
DE (1) DE602006013639D1 (https=)
TW (1) TW200707570A (https=)
WO (1) WO2007004485A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI402902B (zh) * 2007-09-27 2013-07-21 大日本網屏製造股份有限公司 基板處理裝置及基板處理方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4630881B2 (ja) * 2007-03-05 2011-02-09 シャープ株式会社 基板洗浄装置
JP2009080035A (ja) * 2007-09-26 2009-04-16 Olympus Corp 分析装置
US20090087566A1 (en) * 2007-09-27 2009-04-02 Masahiro Kimura Substrate treating apparatus and substrate treating method
WO2012085686A2 (en) * 2010-12-20 2012-06-28 Cantrell John W Fluid screen for pot and pan washing machine
DE102012001721A1 (de) * 2012-01-31 2013-08-01 Rena Gmbh Spüleinrichtung zum Abspülen einer Behandlungsflüssigkeit und Verfahren dazu
TWI569351B (zh) * 2015-04-30 2017-02-01 環球晶圓股份有限公司 晶圓旋轉裝置
KR20220000409A (ko) * 2019-05-23 2022-01-03 램 리써치 코포레이션 챔버 컴포넌트 청정도 측정 시스템
CN112058774B (zh) * 2020-08-24 2021-11-30 台州市亿源塑业有限公司 一种湿法刻蚀清洗机构的溢流槽结构
CN115328219B (zh) * 2022-07-26 2025-03-25 海南大学 一种用于柔性机构的电磁驱动控制系统和方法
CN120714987A (zh) * 2024-03-27 2025-09-30 盛美半导体设备(上海)股份有限公司 槽盖及基板液处理槽

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Publication number Priority date Publication date Assignee Title
JP2617610B2 (ja) * 1990-08-16 1997-06-04 山形日本電気株式会社 ウェーハ処理装置
JPH06104234A (ja) * 1992-09-18 1994-04-15 Matsushita Electric Ind Co Ltd 基板洗浄装置
JPH0652143U (ja) * 1992-12-25 1994-07-15 住友シチックス株式会社 洗浄装置
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
DE4336704A1 (de) * 1993-10-27 1995-05-04 Wacker Chemitronic Verfahren und Vorrichtung zur Behandlung von scheibenförmigen Werkstücken mit einer Flüssigkeit
JP3464843B2 (ja) * 1995-03-30 2003-11-10 大日本スクリーン製造株式会社 基板処理装置における基板処理方法および基板処理装置
JP3534211B2 (ja) * 1995-09-29 2004-06-07 富士写真フイルム株式会社 感光性平版印刷版の自動現像装置
JP3336223B2 (ja) * 1997-04-15 2002-10-21 東京エレクトロン株式会社 洗浄システム及び洗浄方法
US6050446A (en) * 1997-07-11 2000-04-18 Applied Materials, Inc. Pivoting lid assembly for a chamber
JP2000031103A (ja) * 1998-07-14 2000-01-28 Sony Corp 洗浄方法、洗浄液置換方法、洗浄装置並びに洗浄槽
JP2001176833A (ja) * 1999-12-14 2001-06-29 Tokyo Electron Ltd 基板処理装置
JP2001338904A (ja) * 2000-05-30 2001-12-07 Konan Koki Kk ウェハの洗浄装置
KR100513397B1 (ko) * 2001-01-12 2005-09-09 삼성전자주식회사 반도체 웨이퍼 세정시스템 및 그 세정액 공급방법
JP2004358283A (ja) * 2003-05-30 2004-12-24 Seiko Epson Corp 薬液処理装置、薬液処理方法および回路基板の製造方法
KR100593669B1 (ko) * 2004-06-21 2006-06-28 삼성전자주식회사 기판 습식 처리용 덮개 및 이를 구비하는 기판 습식처리장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI402902B (zh) * 2007-09-27 2013-07-21 大日本網屏製造股份有限公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
US7900640B2 (en) 2011-03-08
EP1900448A1 (en) 2008-03-19
EP1900448A4 (en) 2009-05-27
DE602006013639D1 (de) 2010-05-27
JP4672464B2 (ja) 2011-04-20
US20090120466A1 (en) 2009-05-14
TWI329894B (https=) 2010-09-01
JP2007007577A (ja) 2007-01-18
EP1900448B1 (en) 2010-04-14
WO2007004485A1 (ja) 2007-01-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees