JP4667524B2 - 流体チャンバのアレイを備えるチャック・システム - Google Patents

流体チャンバのアレイを備えるチャック・システム Download PDF

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Publication number
JP4667524B2
JP4667524B2 JP2009504203A JP2009504203A JP4667524B2 JP 4667524 B2 JP4667524 B2 JP 4667524B2 JP 2009504203 A JP2009504203 A JP 2009504203A JP 2009504203 A JP2009504203 A JP 2009504203A JP 4667524 B2 JP4667524 B2 JP 4667524B2
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Japan
Prior art keywords
fluid
chamber
chambers
substrate
chuck
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JP2009504203A
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English (en)
Japanese (ja)
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JP2009532899A (ja
JP2009532899A5 (enExample
Inventor
チェララ，アンシュマン
チョイ，ビュン−ジン
ラド，パンカジ・ビイ
シャックルトン，スティーブン・シイ
Original Assignee
モレキュラー・インプリンツ・インコーポレーテッド
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Publication of JP2009532899A5 publication Critical patent/JP2009532899A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009504203A 2006-04-03 2007-03-26 流体チャンバのアレイを備えるチャック・システム Active JP4667524B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US78877706P 2006-04-03 2006-04-03
PCT/US2007/007487 WO2007126767A2 (en) 2006-04-03 2007-03-26 Chucking system comprising an array of fluid chambers

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010248309A Division JP2011077529A (ja) 2006-04-03 2010-11-05 流体チャンバのアレイを備えるチャック・システム

Publications (3)

Publication Number Publication Date
JP2009532899A JP2009532899A (ja) 2009-09-10
JP2009532899A5 JP2009532899A5 (enExample) 2010-04-22
JP4667524B2 true JP4667524B2 (ja) 2011-04-13

Family

ID=38656006

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2009504203A Active JP4667524B2 (ja) 2006-04-03 2007-03-26 流体チャンバのアレイを備えるチャック・システム
JP2010248309A Pending JP2011077529A (ja) 2006-04-03 2010-11-05 流体チャンバのアレイを備えるチャック・システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010248309A Pending JP2011077529A (ja) 2006-04-03 2010-11-05 流体チャンバのアレイを備えるチャック・システム

Country Status (6)

Country Link
EP (1) EP2007566A4 (enExample)
JP (2) JP4667524B2 (enExample)
KR (1) KR20090004910A (enExample)
CN (1) CN101415535A (enExample)
TW (1) TWI352874B (enExample)
WO (1) WO2007126767A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10739674B2 (en) 2015-12-03 2020-08-11 Canon Kabushiki Kaisha Imprint apparatus and method for producing article
US11106129B2 (en) 2018-04-06 2021-08-31 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and method of manufacturing article

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4854383B2 (ja) * 2006-05-15 2012-01-18 アピックヤマダ株式会社 インプリント方法およびナノ・インプリント装置
US8215946B2 (en) * 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
US8652393B2 (en) * 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
US8913230B2 (en) * 2009-07-02 2014-12-16 Canon Nanotechnologies, Inc. Chucking system with recessed support feature
JP5875250B2 (ja) * 2011-04-28 2016-03-02 キヤノン株式会社 インプリント装置、インプリント方法及びデバイス製造方法
JP5893303B2 (ja) * 2011-09-07 2016-03-23 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
EP3078462A1 (en) * 2013-12-03 2016-10-12 Harmotec Co., Ltd. Holding device, holding system, control method, and conveyance device
JP6333031B2 (ja) * 2014-04-09 2018-05-30 キヤノン株式会社 インプリント装置および物品の製造方法
US10620532B2 (en) 2014-11-11 2020-04-14 Canon Kabushiki Kaisha Imprint method, imprint apparatus, mold, and article manufacturing method
JP6940944B2 (ja) * 2016-12-06 2021-09-29 キヤノン株式会社 インプリント装置、及び物品製造方法
JP7710350B2 (ja) 2021-09-28 2025-07-18 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244269A (ja) * 1992-09-07 1994-09-02 Mitsubishi Electric Corp 半導体製造装置並びに半導体製造装置におけるウエハ真空チャック装置及びガスクリーニング方法及び窒化膜形成方法
JP2000195927A (ja) * 1998-12-28 2000-07-14 Sony Corp 真空チャック装置
JP2001127144A (ja) * 1999-08-19 2001-05-11 Canon Inc 基板吸着保持方法、基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイス製造方法
US6809802B1 (en) * 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
JP2001127145A (ja) * 1999-08-19 2001-05-11 Canon Inc 基板吸着保持方法、基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイス製造方法
MY133312A (en) 2002-11-13 2007-11-30 Molecular Imprints Inc A chucking system and method for modulation shapes of substrates

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10739674B2 (en) 2015-12-03 2020-08-11 Canon Kabushiki Kaisha Imprint apparatus and method for producing article
US11106129B2 (en) 2018-04-06 2021-08-31 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and method of manufacturing article

Also Published As

Publication number Publication date
KR20090004910A (ko) 2009-01-12
WO2007126767A3 (en) 2008-07-31
CN101415535A (zh) 2009-04-22
TW200813619A (en) 2008-03-16
EP2007566A2 (en) 2008-12-31
JP2009532899A (ja) 2009-09-10
WO2007126767A2 (en) 2007-11-08
EP2007566A4 (en) 2010-10-13
JP2011077529A (ja) 2011-04-14
TWI352874B (en) 2011-11-21

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