JP4667408B2 - 裏面照射型固体撮像素子の製造方法 - Google Patents

裏面照射型固体撮像素子の製造方法 Download PDF

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JP4667408B2
JP4667408B2 JP2007043771A JP2007043771A JP4667408B2 JP 4667408 B2 JP4667408 B2 JP 4667408B2 JP 2007043771 A JP2007043771 A JP 2007043771A JP 2007043771 A JP2007043771 A JP 2007043771A JP 4667408 B2 JP4667408 B2 JP 4667408B2
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state imaging
imaging device
substrate
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manufacturing
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JP2008210846A5 (enExample
JP2008210846A (ja
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眞司 宇家
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Fujifilm Corp
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Fujifilm Corp
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JP2007043771A 2007-02-23 2007-02-23 裏面照射型固体撮像素子の製造方法 Expired - Fee Related JP4667408B2 (ja)

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JP2008210846A5 JP2008210846A5 (enExample) 2010-08-26
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11984526B2 (en) 2019-12-12 2024-05-14 Brolis Sensor Technology, Uab Optical device having an out-of-plane arrangement for light emission and detection

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010073520A1 (ja) * 2008-12-26 2010-07-01 パナソニック株式会社 固体撮像デバイスおよびその製造方法
JP2010177569A (ja) * 2009-01-30 2010-08-12 Panasonic Corp 光学デバイス及びその製造方法
JP5353356B2 (ja) * 2009-03-25 2013-11-27 凸版印刷株式会社 固体撮像素子及びその製造方法
JP5572979B2 (ja) * 2009-03-30 2014-08-20 ソニー株式会社 半導体装置の製造方法
JP5482025B2 (ja) * 2009-08-28 2014-04-23 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP5834386B2 (ja) * 2010-08-20 2015-12-24 ソニー株式会社 光学センサ、レンズモジュール、およびカメラモジュール
JP2012204403A (ja) 2011-03-23 2012-10-22 Toshiba Corp 固体撮像装置及びその製造方法
US8716823B2 (en) * 2011-11-08 2014-05-06 Aptina Imaging Corporation Backside image sensor pixel with silicon microlenses and metal reflector
JP2013175540A (ja) * 2012-02-24 2013-09-05 Nikon Corp 固体撮像装置および固体撮像装置の製造方法
JP6166640B2 (ja) * 2013-10-22 2017-07-19 キヤノン株式会社 固体撮像装置、その製造方法及びカメラ
CN117253885A (zh) * 2017-10-06 2023-12-19 浜松光子学株式会社 光检测装置
JP7364343B2 (ja) * 2019-02-26 2023-10-18 浜松ホトニクス株式会社 光検出装置の製造方法、及び光検出装置
US12094910B2 (en) * 2019-09-30 2024-09-17 Nikon Corporation Imaging element and imaging device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7265402B2 (en) * 2001-11-05 2007-09-04 Zycube Co., Ltd. Solid-state image sensor including a microlens
JP4383959B2 (ja) * 2003-05-28 2009-12-16 キヤノン株式会社 光電変換装置およびその製造方法
JP4551638B2 (ja) * 2003-08-01 2010-09-29 富士フイルム株式会社 固体撮像装置の製造方法
JP2005056998A (ja) * 2003-08-01 2005-03-03 Fuji Photo Film Co Ltd 固体撮像装置およびその製造方法
KR100782463B1 (ko) * 2005-04-13 2007-12-05 (주)실리콘화일 3차원 구조를 갖는 이미지 센서의 분리형 단위화소 및 그제조방법
JP2006351855A (ja) * 2005-06-16 2006-12-28 Renesas Technology Corp 固体撮像素子とその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11984526B2 (en) 2019-12-12 2024-05-14 Brolis Sensor Technology, Uab Optical device having an out-of-plane arrangement for light emission and detection

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