JP4664142B2 - ステージ装置 - Google Patents

ステージ装置 Download PDF

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Publication number
JP4664142B2
JP4664142B2 JP2005211724A JP2005211724A JP4664142B2 JP 4664142 B2 JP4664142 B2 JP 4664142B2 JP 2005211724 A JP2005211724 A JP 2005211724A JP 2005211724 A JP2005211724 A JP 2005211724A JP 4664142 B2 JP4664142 B2 JP 4664142B2
Authority
JP
Japan
Prior art keywords
axis
support base
holding member
stage
supported
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005211724A
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English (en)
Japanese (ja)
Other versions
JP2007027659A (ja
Inventor
龍太 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP2005211724A priority Critical patent/JP4664142B2/ja
Priority to TW095124692A priority patent/TW200715357A/zh
Priority to CN2006800204661A priority patent/CN101194214B/zh
Priority to PCT/JP2006/314356 priority patent/WO2007010971A1/ja
Priority to KR1020077028483A priority patent/KR100909585B1/ko
Publication of JP2007027659A publication Critical patent/JP2007027659A/ja
Priority to US11/984,170 priority patent/US7997567B2/en
Application granted granted Critical
Publication of JP4664142B2 publication Critical patent/JP4664142B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Machine Tool Units (AREA)
JP2005211724A 2005-07-21 2005-07-21 ステージ装置 Expired - Lifetime JP4664142B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005211724A JP4664142B2 (ja) 2005-07-21 2005-07-21 ステージ装置
TW095124692A TW200715357A (en) 2005-07-21 2006-07-06 Stage device
CN2006800204661A CN101194214B (zh) 2005-07-21 2006-07-20 载物台装置
PCT/JP2006/314356 WO2007010971A1 (ja) 2005-07-21 2006-07-20 ステージ装置
KR1020077028483A KR100909585B1 (ko) 2005-07-21 2006-07-20 스테이지장치
US11/984,170 US7997567B2 (en) 2005-07-21 2007-11-14 Stage apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005211724A JP4664142B2 (ja) 2005-07-21 2005-07-21 ステージ装置

Publications (2)

Publication Number Publication Date
JP2007027659A JP2007027659A (ja) 2007-02-01
JP4664142B2 true JP4664142B2 (ja) 2011-04-06

Family

ID=37668843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005211724A Expired - Lifetime JP4664142B2 (ja) 2005-07-21 2005-07-21 ステージ装置

Country Status (6)

Country Link
US (1) US7997567B2 (cg-RX-API-DMAC7.html)
JP (1) JP4664142B2 (cg-RX-API-DMAC7.html)
KR (1) KR100909585B1 (cg-RX-API-DMAC7.html)
CN (1) CN101194214B (cg-RX-API-DMAC7.html)
TW (1) TW200715357A (cg-RX-API-DMAC7.html)
WO (1) WO2007010971A1 (cg-RX-API-DMAC7.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4976922B2 (ja) * 2007-05-29 2012-07-18 株式会社オーク製作所 基板搬送装置
JP4750090B2 (ja) * 2007-09-14 2011-08-17 住友重機械工業株式会社 ステージ装置
JP4917050B2 (ja) * 2008-01-23 2012-04-18 住友重機械工業株式会社 ステージ装置
WO2010073514A1 (ja) * 2008-12-25 2010-07-01 株式会社アルバック 静電チャック用のチャックプレートの製造方法
US8084896B2 (en) * 2008-12-31 2011-12-27 Electro Scientific Industries, Inc. Monolithic stage positioning system and method
JP5137218B1 (ja) * 2011-08-30 2013-02-06 株式会社ソディック 工作機械
CN102501226B (zh) * 2011-10-31 2014-02-19 西安理工大学 一种宏微驱动变形导轨精密回转装置
CN104028944B (zh) * 2013-03-08 2016-08-10 鸿准精密模具（昆山）有限公司 整形装置及其定位机构
US10192773B2 (en) * 2016-06-20 2019-01-29 Nexperia B.V. Semiconductor device positioning system and method for semiconductor device positioning
CN107081607B (zh) * 2017-02-22 2019-01-18 浙江江山福鑫工艺品有限公司 一种加工工件用加工台装置
CN113606440B (zh) * 2021-08-05 2022-08-26 唐山师范学院 一种物联网用计算机支撑台
JP7772215B2 (ja) * 2022-06-15 2025-11-18 株式会社村田製作所 積層装置および積層システム
KR102688248B1 (ko) * 2022-11-29 2024-07-25 이노로보틱스 주식회사 Zt 스테이지

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2903958B2 (ja) * 1993-06-23 1999-06-14 キヤノン株式会社 位置決め装置及びそれを用いた半導体素子の製造方法
JP3196798B2 (ja) * 1993-10-12 2001-08-06 キヤノン株式会社 自重支持装置
JP3164960B2 (ja) * 1994-02-18 2001-05-14 キヤノン株式会社 ステージ装置
US5609332A (en) * 1995-11-14 1997-03-11 Hassell; Clayton Device for lifting and holding cabinets
US5682658A (en) * 1996-03-04 1997-11-04 Utica Enterprises, Inc. Rotary index table assembly
US6485248B1 (en) * 2000-10-10 2002-11-26 Applied Materials, Inc. Multiple wafer lift apparatus and associated method
JP3940277B2 (ja) * 2001-07-13 2007-07-04 住友重機械工業株式会社 ステージ装置
JP3732763B2 (ja) * 2001-07-13 2006-01-11 住友重機械工業株式会社 ステージ装置
JP4223714B2 (ja) * 2001-11-30 2009-02-12 住友重機械工業株式会社 ステージ装置
CN1588556A (zh) * 2004-07-30 2005-03-02 中国科学院上海光学精密机械研究所 五自由度精密定位平台
US7869000B2 (en) * 2004-11-02 2011-01-11 Nikon Corporation Stage assembly with lightweight fine stage and low transmissibility
JP4927338B2 (ja) * 2005-02-21 2012-05-09 住友重機械工業株式会社 ステージ装置及びガントリ型ステージ装置及びステージ装置の制御方法
KR100667598B1 (ko) * 2005-02-25 2007-01-12 주식회사 아이피에스 반도체 처리 장치

Also Published As

Publication number Publication date
KR100909585B1 (ko) 2009-07-24
WO2007010971A1 (ja) 2007-01-25
US20080087791A1 (en) 2008-04-17
CN101194214A (zh) 2008-06-04
US7997567B2 (en) 2011-08-16
JP2007027659A (ja) 2007-02-01
TWI307916B (cg-RX-API-DMAC7.html) 2009-03-21
TW200715357A (en) 2007-04-16
CN101194214B (zh) 2010-09-29
KR20080014989A (ko) 2008-02-15

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