TW200715357A - Stage device - Google Patents

Stage device

Info

Publication number
TW200715357A
TW200715357A TW095124692A TW95124692A TW200715357A TW 200715357 A TW200715357 A TW 200715357A TW 095124692 A TW095124692 A TW 095124692A TW 95124692 A TW95124692 A TW 95124692A TW 200715357 A TW200715357 A TW 200715357A
Authority
TW
Taiwan
Prior art keywords
support base
axis
holding member
wafer holding
fixed
Prior art date
Application number
TW095124692A
Other languages
English (en)
Chinese (zh)
Other versions
TWI307916B (cg-RX-API-DMAC7.html
Inventor
Ryuta Nakajima
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of TW200715357A publication Critical patent/TW200715357A/zh
Application granted granted Critical
Publication of TWI307916B publication Critical patent/TWI307916B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Machine Tool Units (AREA)
TW095124692A 2005-07-21 2006-07-06 Stage device TW200715357A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005211724A JP4664142B2 (ja) 2005-07-21 2005-07-21 ステージ装置

Publications (2)

Publication Number Publication Date
TW200715357A true TW200715357A (en) 2007-04-16
TWI307916B TWI307916B (cg-RX-API-DMAC7.html) 2009-03-21

Family

ID=37668843

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095124692A TW200715357A (en) 2005-07-21 2006-07-06 Stage device

Country Status (6)

Country Link
US (1) US7997567B2 (cg-RX-API-DMAC7.html)
JP (1) JP4664142B2 (cg-RX-API-DMAC7.html)
KR (1) KR100909585B1 (cg-RX-API-DMAC7.html)
CN (1) CN101194214B (cg-RX-API-DMAC7.html)
TW (1) TW200715357A (cg-RX-API-DMAC7.html)
WO (1) WO2007010971A1 (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI409905B (zh) * 2007-09-14 2013-09-21 Sumitomo Heavy Industries 載台裝置
TWI414475B (zh) * 2007-05-29 2013-11-11 Orc Mfg Co Ltd Substrate handling device
TWI455791B (zh) * 2008-12-25 2014-10-11 Ulvac Inc 靜電吸盤用之吸盤平板的製造方法
TWI498187B (zh) * 2008-12-31 2015-09-01 Electro Scient Ind Inc 整體平台定位系統和方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4917050B2 (ja) * 2008-01-23 2012-04-18 住友重機械工業株式会社 ステージ装置
JP5137218B1 (ja) * 2011-08-30 2013-02-06 株式会社ソディック 工作機械
CN102501226B (zh) * 2011-10-31 2014-02-19 西安理工大学 一种宏微驱动变形导轨精密回转装置
CN104028944B (zh) * 2013-03-08 2016-08-10 鸿准精密模具（昆山）有限公司 整形装置及其定位机构
US10192773B2 (en) * 2016-06-20 2019-01-29 Nexperia B.V. Semiconductor device positioning system and method for semiconductor device positioning
CN107081607B (zh) * 2017-02-22 2019-01-18 浙江江山福鑫工艺品有限公司 一种加工工件用加工台装置
CN113606440B (zh) * 2021-08-05 2022-08-26 唐山师范学院 一种物联网用计算机支撑台
JP7772215B2 (ja) * 2022-06-15 2025-11-18 株式会社村田製作所 積層装置および積層システム
KR102688248B1 (ko) * 2022-11-29 2024-07-25 이노로보틱스 주식회사 Zt 스테이지

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2903958B2 (ja) * 1993-06-23 1999-06-14 キヤノン株式会社 位置決め装置及びそれを用いた半導体素子の製造方法
JP3196798B2 (ja) * 1993-10-12 2001-08-06 キヤノン株式会社 自重支持装置
JP3164960B2 (ja) * 1994-02-18 2001-05-14 キヤノン株式会社 ステージ装置
US5609332A (en) * 1995-11-14 1997-03-11 Hassell; Clayton Device for lifting and holding cabinets
US5682658A (en) * 1996-03-04 1997-11-04 Utica Enterprises, Inc. Rotary index table assembly
US6485248B1 (en) * 2000-10-10 2002-11-26 Applied Materials, Inc. Multiple wafer lift apparatus and associated method
JP3940277B2 (ja) * 2001-07-13 2007-07-04 住友重機械工業株式会社 ステージ装置
JP3732763B2 (ja) * 2001-07-13 2006-01-11 住友重機械工業株式会社 ステージ装置
JP4223714B2 (ja) * 2001-11-30 2009-02-12 住友重機械工業株式会社 ステージ装置
CN1588556A (zh) * 2004-07-30 2005-03-02 中国科学院上海光学精密机械研究所 五自由度精密定位平台
US7869000B2 (en) * 2004-11-02 2011-01-11 Nikon Corporation Stage assembly with lightweight fine stage and low transmissibility
JP4927338B2 (ja) * 2005-02-21 2012-05-09 住友重機械工業株式会社 ステージ装置及びガントリ型ステージ装置及びステージ装置の制御方法
KR100667598B1 (ko) * 2005-02-25 2007-01-12 주식회사 아이피에스 반도체 처리 장치

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414475B (zh) * 2007-05-29 2013-11-11 Orc Mfg Co Ltd Substrate handling device
TWI409905B (zh) * 2007-09-14 2013-09-21 Sumitomo Heavy Industries 載台裝置
TWI455791B (zh) * 2008-12-25 2014-10-11 Ulvac Inc 靜電吸盤用之吸盤平板的製造方法
TWI498187B (zh) * 2008-12-31 2015-09-01 Electro Scient Ind Inc 整體平台定位系統和方法

Also Published As

Publication number Publication date
KR100909585B1 (ko) 2009-07-24
WO2007010971A1 (ja) 2007-01-25
JP4664142B2 (ja) 2011-04-06
US20080087791A1 (en) 2008-04-17
CN101194214A (zh) 2008-06-04
US7997567B2 (en) 2011-08-16
JP2007027659A (ja) 2007-02-01
TWI307916B (cg-RX-API-DMAC7.html) 2009-03-21
CN101194214B (zh) 2010-09-29
KR20080014989A (ko) 2008-02-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees