JP4656393B2 - 光源装置 - Google Patents

光源装置 Download PDF

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Publication number
JP4656393B2
JP4656393B2 JP2005046409A JP2005046409A JP4656393B2 JP 4656393 B2 JP4656393 B2 JP 4656393B2 JP 2005046409 A JP2005046409 A JP 2005046409A JP 2005046409 A JP2005046409 A JP 2005046409A JP 4656393 B2 JP4656393 B2 JP 4656393B2
Authority
JP
Japan
Prior art keywords
light
lens
illuminance
source device
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005046409A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006234450A (ja
Inventor
康史 市沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokogawa Electric Corp
Original Assignee
Yokogawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Electric Corp filed Critical Yokogawa Electric Corp
Priority to JP2005046409A priority Critical patent/JP4656393B2/ja
Priority to KR1020050120556A priority patent/KR100698567B1/ko
Priority to TW095104229A priority patent/TWI288237B/zh
Publication of JP2006234450A publication Critical patent/JP2006234450A/ja
Application granted granted Critical
Publication of JP4656393B2 publication Critical patent/JP4656393B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2005046409A 2005-02-23 2005-02-23 光源装置 Expired - Fee Related JP4656393B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005046409A JP4656393B2 (ja) 2005-02-23 2005-02-23 光源装置
KR1020050120556A KR100698567B1 (ko) 2005-02-23 2005-12-09 광원 장치
TW095104229A TWI288237B (en) 2005-02-23 2006-02-08 Illuminator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005046409A JP4656393B2 (ja) 2005-02-23 2005-02-23 光源装置

Publications (2)

Publication Number Publication Date
JP2006234450A JP2006234450A (ja) 2006-09-07
JP4656393B2 true JP4656393B2 (ja) 2011-03-23

Family

ID=37042284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005046409A Expired - Fee Related JP4656393B2 (ja) 2005-02-23 2005-02-23 光源装置

Country Status (3)

Country Link
JP (1) JP4656393B2 (zh)
KR (1) KR100698567B1 (zh)
TW (1) TWI288237B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8159659B2 (en) * 2006-11-15 2012-04-17 Japan Electronic Materials Corp. Optical device inspecting apparatus
DE102007045525A1 (de) * 2007-09-24 2009-04-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bildsensor
KR100942252B1 (ko) * 2008-01-21 2010-02-16 이상근 반도체 웨이퍼 검사용 투광기
JP6208440B2 (ja) * 2012-05-30 2017-10-04 アークレイ株式会社 気泡低減装置、クロマトグラフィ装置、気泡低減方法、及び気泡低減プログラム
CN103543304B (zh) * 2012-07-13 2016-05-18 旺矽科技股份有限公司 高频探针卡
WO2024127516A1 (ja) * 2022-12-13 2024-06-20 株式会社インターアクション 光学モジュールおよび検査装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0571732U (ja) * 1992-01-10 1993-09-28 株式会社ニコン 照明補助装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0125740B1 (ko) * 1993-02-11 1998-04-01 김광호 공기조화기의 운전제어장치 및 그 방법
KR101820040B1 (ko) * 2016-08-03 2018-02-28 한빛이디에스(주) 부분 방전 펄스 측정 장치 및 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0571732U (ja) * 1992-01-10 1993-09-28 株式会社ニコン 照明補助装置

Also Published As

Publication number Publication date
TWI288237B (en) 2007-10-11
KR20060094017A (ko) 2006-08-28
TW200630601A (en) 2006-09-01
JP2006234450A (ja) 2006-09-07
KR100698567B1 (ko) 2007-03-21

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