JP4653797B2 - フォトマスクレイアウトパターン - Google Patents
フォトマスクレイアウトパターン Download PDFInfo
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- JP4653797B2 JP4653797B2 JP2007288567A JP2007288567A JP4653797B2 JP 4653797 B2 JP4653797 B2 JP 4653797B2 JP 2007288567 A JP2007288567 A JP 2007288567A JP 2007288567 A JP2007288567 A JP 2007288567A JP 4653797 B2 JP4653797 B2 JP 4653797B2
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- Japan
- Prior art keywords
- pattern
- line
- line pattern
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- photomask
- Prior art date
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- 238000000034 method Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 238000012937 correction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011295 pitch Substances 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000011960 computer-aided design Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
2、12、14a、14b スペースパターン
3 直線スペースパターン
4 ハマーヘッド形補助パターン
10 H字型パターン
10a 第一ラインパターン
10b 第二ラインパターン
10c 中間領域
20a 第三ラインパターン
20b 第四ラインパターン
100 フォトマスクレイアウトパターン
102 不透明ライン
104 スペースパターン
Claims (7)
- 第一ラインパターンと、上記第一ラインパターンと平行に設けられている第二ラインパターンと、上記第一ラインパターンと上記第二ラインパターンを接続する中間領域とを含むH字型パターンを有するフォトマスクレイアウトパターンであって、中間領域内には複数の密集ラインパターンと複数のスペースパターンが設けられ、
前記密集ラインパターンと前記スペースパターンが前記中間領域を透過する光により露光されないように、前記密集ラインパターンと前記スペースパターンのピッチは、露光装置の解像能力より小さくされていることを特徴とするフォトマスクレイアウトパターン。 - 前記密集ラインパターンと前記スペースパターンのピッチは130nmよりも小さいことを特徴とする請求項1記載のフォトマスクレイアウトパターン。
- 前記第一ラインパターン、前記第二ラインパターン、及び前記密集ラインパターンは不透明であることを特徴とする請求項1記載のフォトマスクレイアウトパターン。
- 前記スペースパターンは透明であることを特徴とする請求項1記載のフォトマスクレイアウトパターン。
- 前記密集ラインパターンは、前記第一ラインパターン及び前記第二ラインパターンと直交することを特徴とする請求項1記載のフォトマスクレイアウトパターン。
- 前記第一ラインパターンと前記第二ラインパターンは線幅が同じであることを特徴とする請求項1記載のフォトマスクレイアウトパターン。
- 前記第一ラインパターンと前記第二ラインパターンの線幅は0.11μmであることを特徴とする請求項1記載のフォトマスクレイアウトパターン。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096126908A TWI346249B (en) | 2007-07-24 | 2007-07-24 | Photomask layout pattern |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009031716A JP2009031716A (ja) | 2009-02-12 |
JP4653797B2 true JP4653797B2 (ja) | 2011-03-16 |
Family
ID=40176016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007288567A Active JP4653797B2 (ja) | 2007-07-24 | 2007-11-06 | フォトマスクレイアウトパターン |
Country Status (4)
Country | Link |
---|---|
US (1) | US7776496B2 (ja) |
JP (1) | JP4653797B2 (ja) |
DE (1) | DE102007049923B4 (ja) |
TW (1) | TWI346249B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009271261A (ja) * | 2008-05-02 | 2009-11-19 | Powerchip Semiconductor Corp | 回路構造とそれを定義するためのフォトマスク |
TWI418952B (zh) | 2010-03-15 | 2013-12-11 | Au Optronics Corp | 曝光機台、圖案化薄膜的形成方法、圖案化光阻層的形成方法、主動元件陣列基板以及圖案化薄膜 |
US8313992B2 (en) | 2010-10-04 | 2012-11-20 | Sandisk Technologies Inc. | Method of patterning NAND strings using perpendicular SRAF |
JP5017442B2 (ja) * | 2010-10-29 | 2012-09-05 | 株式会社東芝 | 半導体装置 |
TWI454954B (zh) * | 2012-01-06 | 2014-10-01 | Yao Ching Tseng | Mask pattern layout method |
CN107706103B (zh) * | 2017-10-20 | 2019-11-26 | 上海华力微电子有限公司 | 一种多晶硅层桥接断路的解决方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002061505A1 (fr) * | 2001-01-31 | 2002-08-08 | Nikon Corporation | Masque, procede de mesure de caracteristique optique, procede de reglage d'un appareil d'exposition, procede d'exposition et procede de fabrication du dispositif |
JP2005010635A (ja) * | 2003-06-20 | 2005-01-13 | Seiko Epson Corp | フォトマスク及び半導体装置の製造方法並びに光近接効果補正方法 |
JP2006126614A (ja) * | 2004-10-29 | 2006-05-18 | Toshiba Corp | マスクパターンデータ生成方法、フォトマスクの製造方法、及び半導体デバイスの製造方法 |
US20080138588A1 (en) * | 2006-12-06 | 2008-06-12 | Uwe Paul Schroeder | Masks and methods of manufacture thereof |
JP2009109859A (ja) * | 2007-10-31 | 2009-05-21 | Dainippon Printing Co Ltd | 階調マスクの欠陥修正方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5821014A (en) * | 1997-02-28 | 1998-10-13 | Microunity Systems Engineering, Inc. | Optical proximity correction method for intermediate-pitch features using sub-resolution scattering bars on a mask |
EP1241525B1 (en) | 2001-03-14 | 2004-12-15 | ASML MaskTools B.V. | An optical proximity correction method utilizing ruled ladder bars as sub-resolution assist features |
DE102004047263B4 (de) * | 2004-09-24 | 2010-04-22 | Qimonda Ag | Verfahren zum Erzeugen eines Abbildungsfehler vermeidenden Maskenlayouts für eine Maske |
KR100614651B1 (ko) * | 2004-10-11 | 2006-08-22 | 삼성전자주식회사 | 회로 패턴의 노광을 위한 장치 및 방법, 사용되는포토마스크 및 그 설계 방법, 그리고 조명계 및 그 구현방법 |
US7662721B2 (en) * | 2006-03-15 | 2010-02-16 | Infineon Technologies Ag | Hard mask layer stack and a method of patterning |
US7727687B2 (en) * | 2006-06-15 | 2010-06-01 | Synopsys, Inc. | Method and apparatus for determining whether a sub-resolution assist feature will print |
-
2007
- 2007-07-24 TW TW096126908A patent/TWI346249B/zh active
- 2007-08-30 US US11/847,345 patent/US7776496B2/en active Active
- 2007-10-18 DE DE102007049923A patent/DE102007049923B4/de active Active
- 2007-11-06 JP JP2007288567A patent/JP4653797B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002061505A1 (fr) * | 2001-01-31 | 2002-08-08 | Nikon Corporation | Masque, procede de mesure de caracteristique optique, procede de reglage d'un appareil d'exposition, procede d'exposition et procede de fabrication du dispositif |
JP2005010635A (ja) * | 2003-06-20 | 2005-01-13 | Seiko Epson Corp | フォトマスク及び半導体装置の製造方法並びに光近接効果補正方法 |
JP2006126614A (ja) * | 2004-10-29 | 2006-05-18 | Toshiba Corp | マスクパターンデータ生成方法、フォトマスクの製造方法、及び半導体デバイスの製造方法 |
US20080138588A1 (en) * | 2006-12-06 | 2008-06-12 | Uwe Paul Schroeder | Masks and methods of manufacture thereof |
JP2009109859A (ja) * | 2007-10-31 | 2009-05-21 | Dainippon Printing Co Ltd | 階調マスクの欠陥修正方法 |
Also Published As
Publication number | Publication date |
---|---|
DE102007049923B4 (de) | 2010-10-28 |
TW200905377A (en) | 2009-02-01 |
JP2009031716A (ja) | 2009-02-12 |
TWI346249B (en) | 2011-08-01 |
US20090029267A1 (en) | 2009-01-29 |
US7776496B2 (en) | 2010-08-17 |
DE102007049923A1 (de) | 2009-02-05 |
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