WO2002061505A1 - Masque, procede de mesure de caracteristique optique, procede de reglage d'un appareil d'exposition, procede d'exposition et procede de fabrication du dispositif - Google Patents
Masque, procede de mesure de caracteristique optique, procede de reglage d'un appareil d'exposition, procede d'exposition et procede de fabrication du dispositif Download PDFInfo
- Publication number
- WO2002061505A1 WO2002061505A1 PCT/JP2002/000782 JP0200782W WO02061505A1 WO 2002061505 A1 WO2002061505 A1 WO 2002061505A1 JP 0200782 W JP0200782 W JP 0200782W WO 02061505 A1 WO02061505 A1 WO 02061505A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- exposure
- projection
- mask
- optical system
- optical characteristic
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002562015A JPWO2002061505A1 (ja) | 2001-01-31 | 2002-01-31 | マスク、光学特性計測方法、露光装置の調整方法及び露光方法、並びにデバイス製造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001024742 | 2001-01-31 | ||
JP2001-24742 | 2001-01-31 | ||
JP2001-26523 | 2001-02-02 | ||
JP2001026523 | 2001-02-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002061505A1 true WO2002061505A1 (fr) | 2002-08-08 |
Family
ID=26608715
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/000782 WO2002061505A1 (fr) | 2001-01-31 | 2002-01-31 | Masque, procede de mesure de caracteristique optique, procede de reglage d'un appareil d'exposition, procede d'exposition et procede de fabrication du dispositif |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2002061505A1 (fr) |
WO (1) | WO2002061505A1 (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004092865A2 (fr) * | 2003-04-17 | 2004-10-28 | Nippon Kogaku Kk | Procede de selection, procede d'exposition, dispositif de selection, dispositif d'exposition, et procede de fabrication de dispositif |
JP2006515067A (ja) * | 2003-03-17 | 2006-05-18 | フィコム コーポレイション | プローブポジショニング及びボンディング装置並びにプローブボンディング方法 |
JP2006303498A (ja) * | 2005-04-15 | 2006-11-02 | Samsung Electronics Co Ltd | フォトマスクのテストパターンイメージから印刷されたテストフィーチャーを用いるフォトリソグラフィ工程における焦点変化を測定するシステム及び方法 |
JP2009031716A (ja) * | 2007-07-24 | 2009-02-12 | Nanya Technology Corp | フォトマスクレイアウトパターン |
JP2009295735A (ja) * | 2008-06-04 | 2009-12-17 | Seiko Instruments Inc | 半導体装置の製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4908656A (en) * | 1988-01-21 | 1990-03-13 | Nikon Corporation | Method of dimension measurement for a pattern formed by exposure apparatus, and method for setting exposure conditions and for inspecting exposure precision |
JPH09270379A (ja) * | 1996-04-01 | 1997-10-14 | Miyazaki Oki Electric Co Ltd | フォーカス評価用レチクルおよびフォーカス評価方法 |
JPH09270378A (ja) * | 1996-03-29 | 1997-10-14 | Nittetsu Semiconductor Kk | フォトレチクルおよび半導体集積回路ならびにこれらを用いた露光時のウェハ傾き検出方法 |
JPH10319598A (ja) * | 1997-05-21 | 1998-12-04 | Sony Corp | レジスト・パターンおよびその形成方法 |
JPH11297614A (ja) * | 1998-04-09 | 1999-10-29 | Nikon Corp | コマ収差測定装置および該装置を備えた投影露光装置 |
-
2002
- 2002-01-31 JP JP2002562015A patent/JPWO2002061505A1/ja active Pending
- 2002-01-31 WO PCT/JP2002/000782 patent/WO2002061505A1/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4908656A (en) * | 1988-01-21 | 1990-03-13 | Nikon Corporation | Method of dimension measurement for a pattern formed by exposure apparatus, and method for setting exposure conditions and for inspecting exposure precision |
JPH09270378A (ja) * | 1996-03-29 | 1997-10-14 | Nittetsu Semiconductor Kk | フォトレチクルおよび半導体集積回路ならびにこれらを用いた露光時のウェハ傾き検出方法 |
JPH09270379A (ja) * | 1996-04-01 | 1997-10-14 | Miyazaki Oki Electric Co Ltd | フォーカス評価用レチクルおよびフォーカス評価方法 |
JPH10319598A (ja) * | 1997-05-21 | 1998-12-04 | Sony Corp | レジスト・パターンおよびその形成方法 |
JPH11297614A (ja) * | 1998-04-09 | 1999-10-29 | Nikon Corp | コマ収差測定装置および該装置を備えた投影露光装置 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006515067A (ja) * | 2003-03-17 | 2006-05-18 | フィコム コーポレイション | プローブポジショニング及びボンディング装置並びにプローブボンディング方法 |
US7592565B2 (en) | 2003-03-17 | 2009-09-22 | Phicom Corporation | Probe positioning and bonding device and probe bonding method |
WO2004092865A2 (fr) * | 2003-04-17 | 2004-10-28 | Nippon Kogaku Kk | Procede de selection, procede d'exposition, dispositif de selection, dispositif d'exposition, et procede de fabrication de dispositif |
WO2004092865A3 (fr) * | 2003-04-17 | 2004-12-29 | Nippon Kogaku Kk | Procede de selection, procede d'exposition, dispositif de selection, dispositif d'exposition, et procede de fabrication de dispositif |
JP2006303498A (ja) * | 2005-04-15 | 2006-11-02 | Samsung Electronics Co Ltd | フォトマスクのテストパターンイメージから印刷されたテストフィーチャーを用いるフォトリソグラフィ工程における焦点変化を測定するシステム及び方法 |
JP2009031716A (ja) * | 2007-07-24 | 2009-02-12 | Nanya Technology Corp | フォトマスクレイアウトパターン |
JP4653797B2 (ja) * | 2007-07-24 | 2011-03-16 | 南亜科技股▲ふん▼有限公司 | フォトマスクレイアウトパターン |
JP2009295735A (ja) * | 2008-06-04 | 2009-12-17 | Seiko Instruments Inc | 半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2002061505A1 (ja) | 2004-06-03 |
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