JP4646960B2 - 固体撮像素子収納用パッケージ及び撮像装置 - Google Patents
固体撮像素子収納用パッケージ及び撮像装置 Download PDFInfo
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- JP4646960B2 JP4646960B2 JP2007254582A JP2007254582A JP4646960B2 JP 4646960 B2 JP4646960 B2 JP 4646960B2 JP 2007254582 A JP2007254582 A JP 2007254582A JP 2007254582 A JP2007254582 A JP 2007254582A JP 4646960 B2 JP4646960 B2 JP 4646960B2
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- Prior art keywords
- solid
- state imaging
- imaging device
- lid
- insulating base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Description
前記絶縁基体の上面に前記蓋体を被せるとともに前記フックの前記突起部を前記窪み部の前記下端部に嵌合させることにより、前記絶縁基体と前記蓋体とを固定するようになした固体撮像素子収納用パッケージ。
2・・・蓋体
3・・・固体撮像素子
4・・・搭載部
7・・・蓋体固定用の窪み部
9・・・レンズ部材
10・・・フック
Claims (4)
- 上面中央部に固体撮像素子が搭載される搭載部を有するとともに相対向する外周側面に蓋体固定用の窪み部を有する絶縁基体と、
中央部に前記固体撮像素子と対向するようにして配設されるレンズ部材を有するとともに外周部に前記蓋体固定用の窪み部に嵌合するフックを有する蓋体と、を備え、
前記窪み部は上端部と下端部とから成り、該下端部は、窪みの深さが前記上端部より深いとともに、前記固体撮像素子の搭載面よりも下方に設けられており、
前記フックは、前記下端部と嵌合可能な突起部を有しており、
前記絶縁基体の上面に前記蓋体を被せるとともに前記フックの前記突起部を前記窪み部の前記下端部に嵌合させることにより、前記絶縁基体と前記蓋体とを固定するようになした固体撮像素子収納用パッケージ。 - 前記絶縁基体は、前記固体撮像素子の電極が電気的に接続される前記絶縁基体の上面から、前記絶縁基体の内部を介して、前記窪み部よりも下方に位置する前記絶縁基体の下面まで導出される配線導体を備えていることを特徴とする請求項1に記載の固体撮像素子収納用パッケージ。
- 請求項1または請求項2に記載の固体撮像素子収納用パッケージと、固体撮像素子とを備えていることを特徴とする撮像装置。
- 前記固体撮像素子の電極と前記配線導体が、ボンディングワイヤで接続されていることを特徴とする請求項3に記載の撮像装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007254582A JP4646960B2 (ja) | 2007-09-28 | 2007-09-28 | 固体撮像素子収納用パッケージ及び撮像装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007254582A JP4646960B2 (ja) | 2007-09-28 | 2007-09-28 | 固体撮像素子収納用パッケージ及び撮像装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002213586A Division JP4051235B2 (ja) | 2002-07-23 | 2002-07-23 | 固体撮像素子収納用パッケージ及びこれを用いた撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008078668A JP2008078668A (ja) | 2008-04-03 |
JP4646960B2 true JP4646960B2 (ja) | 2011-03-09 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007254582A Expired - Fee Related JP4646960B2 (ja) | 2007-09-28 | 2007-09-28 | 固体撮像素子収納用パッケージ及び撮像装置 |
Country Status (1)
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JP (1) | JP4646960B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5084578B2 (ja) | 2008-03-25 | 2012-11-28 | Necエンベデッドプロダクツ株式会社 | マガジン保持構造及びこれを備えたライブラリ装置 |
US7906372B2 (en) * | 2008-07-09 | 2011-03-15 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd | Lens support and wirebond protector |
KR101051521B1 (ko) * | 2009-09-18 | 2011-07-22 | 삼성전기주식회사 | 카메라 모듈 |
JP5722124B2 (ja) * | 2011-05-31 | 2015-05-20 | 京セラクリスタルデバイス株式会社 | モジュール |
US9086553B2 (en) | 2011-06-27 | 2015-07-21 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical communications device having electrical bond pads that are protected by a protective coating, and a method for applying the protective coating |
EP3001671B1 (en) * | 2013-05-23 | 2018-01-17 | Fujitsu Frontech Limited | Image pickup apparatus |
JP6394161B2 (ja) | 2014-08-06 | 2018-09-26 | 日亜化学工業株式会社 | 発光装置及び光源モジュール |
JP6703029B2 (ja) * | 2018-03-26 | 2020-06-03 | キヤノン株式会社 | 電子モジュールおよび撮像システム |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62190755A (ja) * | 1986-02-17 | 1987-08-20 | Seiko Instr & Electronics Ltd | イメ−ジセンサ |
JPS6366964A (ja) * | 1986-09-05 | 1988-03-25 | Olympus Optical Co Ltd | 固体撮像素子 |
JPH0353844U (ja) * | 1989-09-29 | 1991-05-24 | ||
JPH06120366A (ja) * | 1992-10-06 | 1994-04-28 | Sony Corp | 半導体装置 |
JPH09135010A (ja) * | 1995-11-07 | 1997-05-20 | Konica Corp | ベアチップccdの取付け方法 |
JPH10321827A (ja) * | 1997-05-16 | 1998-12-04 | Sony Corp | 撮像装置及びカメラ |
JP2001102502A (ja) * | 1999-09-27 | 2001-04-13 | Kyocera Corp | イメージセンサ素子収納用パッケージ |
-
2007
- 2007-09-28 JP JP2007254582A patent/JP4646960B2/ja not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62190755A (ja) * | 1986-02-17 | 1987-08-20 | Seiko Instr & Electronics Ltd | イメ−ジセンサ |
JPS6366964A (ja) * | 1986-09-05 | 1988-03-25 | Olympus Optical Co Ltd | 固体撮像素子 |
JPH0353844U (ja) * | 1989-09-29 | 1991-05-24 | ||
JPH06120366A (ja) * | 1992-10-06 | 1994-04-28 | Sony Corp | 半導体装置 |
JPH09135010A (ja) * | 1995-11-07 | 1997-05-20 | Konica Corp | ベアチップccdの取付け方法 |
JPH10321827A (ja) * | 1997-05-16 | 1998-12-04 | Sony Corp | 撮像装置及びカメラ |
JP2001102502A (ja) * | 1999-09-27 | 2001-04-13 | Kyocera Corp | イメージセンサ素子収納用パッケージ |
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JP2008078668A (ja) | 2008-04-03 |
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