JP4634692B2 - レーザ処理方法 - Google Patents

レーザ処理方法 Download PDF

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Publication number
JP4634692B2
JP4634692B2 JP2002560818A JP2002560818A JP4634692B2 JP 4634692 B2 JP4634692 B2 JP 4634692B2 JP 2002560818 A JP2002560818 A JP 2002560818A JP 2002560818 A JP2002560818 A JP 2002560818A JP 4634692 B2 JP4634692 B2 JP 4634692B2
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JP
Japan
Prior art keywords
laser
processing method
laser processing
substrate material
laser system
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Expired - Fee Related
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JP2002560818A
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English (en)
Japanese (ja)
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JP2004526575A5 (enrdf_load_stackoverflow
JP2004526575A (ja
Inventor
ダブリュー ベアード ブライアン
ジェイ ウルフ マイケル
エス ハリス リチャード
ピー ファーイ ケヴィン
チェン ツォウ リャン
アール マクニール トーマス
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
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Publication date
Priority claimed from US09/803,382 external-priority patent/US20020033558A1/en
Application filed by エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド filed Critical エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Publication of JP2004526575A publication Critical patent/JP2004526575A/ja
Publication of JP2004526575A5 publication Critical patent/JP2004526575A5/ja
Application granted granted Critical
Publication of JP4634692B2 publication Critical patent/JP4634692B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
  • Drying Of Semiconductors (AREA)
JP2002560818A 2001-01-31 2002-01-10 レーザ処理方法 Expired - Fee Related JP4634692B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US26555601P 2001-01-31 2001-01-31
US09/803,382 US20020033558A1 (en) 2000-09-20 2001-03-09 UV laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses
PCT/US2002/000867 WO2002060636A1 (en) 2001-01-31 2002-01-10 Ultraviolet laser ablative patterning of microstructures in semiconductors

Publications (3)

Publication Number Publication Date
JP2004526575A JP2004526575A (ja) 2004-09-02
JP2004526575A5 JP2004526575A5 (enrdf_load_stackoverflow) 2005-06-30
JP4634692B2 true JP4634692B2 (ja) 2011-02-16

Family

ID=26951292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002560818A Expired - Fee Related JP4634692B2 (ja) 2001-01-31 2002-01-10 レーザ処理方法

Country Status (7)

Country Link
EP (1) EP1365880A4 (enrdf_load_stackoverflow)
JP (1) JP4634692B2 (enrdf_load_stackoverflow)
CN (1) CN1301178C (enrdf_load_stackoverflow)
CA (1) CA2436736A1 (enrdf_load_stackoverflow)
GB (1) GB2389811B (enrdf_load_stackoverflow)
TW (1) TW525240B (enrdf_load_stackoverflow)
WO (1) WO2002060636A1 (enrdf_load_stackoverflow)

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US6676878B2 (en) 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
US6949449B2 (en) * 2003-07-11 2005-09-27 Electro Scientific Industries, Inc. Method of forming a scribe line on a ceramic substrate
US7985942B2 (en) 2004-05-28 2011-07-26 Electro Scientific Industries, Inc. Method of providing consistent quality of target material removal by lasers having different output performance characteristics
US20060108327A1 (en) * 2004-11-23 2006-05-25 Chng Kiong C Method of manufacturing a microstructure
DE102005042072A1 (de) * 2005-06-01 2006-12-14 Forschungsverbund Berlin E.V. Verfahren zur Erzeugung von vertikalen elektrischen Kontaktverbindungen in Halbleiterwafern
JP2007067082A (ja) * 2005-08-30 2007-03-15 Disco Abrasive Syst Ltd ウエーハの穿孔方法
DE102005042074A1 (de) 2005-08-31 2007-03-08 Forschungsverbund Berlin E.V. Verfahren zur Erzeugung von Durchkontaktierungen in Halbleiterwafern
US7767595B2 (en) * 2006-10-26 2010-08-03 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
CN101041415B (zh) * 2006-11-07 2010-08-11 东南大学 硅片上制作纳米孔的方法
JP2008155274A (ja) * 2006-12-26 2008-07-10 Disco Abrasive Syst Ltd ウエーハの加工方法
KR101041140B1 (ko) * 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 방법
CN101850981A (zh) * 2010-06-23 2010-10-06 东北林业大学 一种激光烧蚀制备氧化硅纳米泡沫的方法
JP5860219B2 (ja) * 2011-03-10 2016-02-16 株式会社ディスコ レーザー加工装置
TW201716167A (zh) * 2011-08-18 2017-05-16 奧寶科技有限公司 用於電路之檢測/維修/再檢測系統及雷射寫入系統
CN102956239A (zh) * 2011-08-29 2013-03-06 新科实业有限公司 磁头、磁头折片组合以及磁盘驱动单元
CN103567642B (zh) * 2012-08-08 2017-07-11 赛恩倍吉科技顾问（深圳）有限公司 蓝宝石切割装置
CN103962727B (zh) * 2013-01-28 2018-03-02 深圳市裕展精密科技有限公司 蓝宝石切割装置
US10118250B1 (en) 2017-09-15 2018-11-06 International Business Machines Corporation In-situ laser beam position and spot size sensor and high speed scanner calibration, wafer debonding method
CN108326435B (zh) * 2017-12-29 2022-08-30 大族激光科技产业集团股份有限公司 一种模具钢的激光打标方法
CN108637472B (zh) * 2018-06-05 2023-12-08 昆山宝锦激光拼焊有限公司 一种天窗激光焊接线平台
CN108637473B (zh) * 2018-06-05 2023-12-08 昆山宝锦激光拼焊有限公司 一种天窗板一次定位焊接成型的装置
IT201900006740A1 (it) * 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
JP2023026921A (ja) * 2021-08-16 2023-03-01 株式会社ディスコ ウエーハの加工方法

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US4473737A (en) * 1981-09-28 1984-09-25 General Electric Company Reverse laser drilling
US4534804A (en) * 1984-06-14 1985-08-13 International Business Machines Corporation Laser process for forming identically positioned alignment marks on the opposite sides of a semiconductor wafer
JP2621599B2 (ja) * 1990-07-05 1997-06-18 日本電気株式会社 コンタクトホール形成装置及び方法
US5611946A (en) * 1994-02-18 1997-03-18 New Wave Research Multi-wavelength laser system, probe station and laser cutter system using the same
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
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JPH11773A (ja) * 1997-06-11 1999-01-06 Nec Corp レーザ加工装置およびその方法
JP3532100B2 (ja) * 1997-12-03 2004-05-31 日本碍子株式会社 レーザ割断方法
JP3395141B2 (ja) * 1998-03-02 2003-04-07 住友重機械工業株式会社 レーザ加工装置
US6032997A (en) * 1998-04-16 2000-03-07 Excimer Laser Systems Vacuum chuck
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JP2000164535A (ja) * 1998-11-24 2000-06-16 Mitsubishi Electric Corp レーザ加工装置
TW482705B (en) * 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
US6472295B1 (en) * 1999-08-27 2002-10-29 Jmar Research, Inc. Method and apparatus for laser ablation of a target material
US6255621B1 (en) * 2000-01-31 2001-07-03 International Business Machines Corporation Laser cutting method for forming magnetic recording head sliders
US6356337B1 (en) * 2000-03-08 2002-03-12 Anvik Corporation Two-sided substrate imaging using single-approach projection optics
DE10026066A1 (de) * 2000-05-25 2001-11-29 Deere & Co Vorrichtung zum Umhüllen eines Rundballens

Also Published As

Publication number Publication date
GB2389811B (en) 2004-10-27
CA2436736A1 (en) 2002-08-08
CN1527754A (zh) 2004-09-08
GB2389811A (en) 2003-12-24
GB0317853D0 (en) 2003-09-03
EP1365880A4 (en) 2008-04-16
CN1301178C (zh) 2007-02-21
WO2002060636A1 (en) 2002-08-08
TW525240B (en) 2003-03-21
EP1365880A1 (en) 2003-12-03
JP2004526575A (ja) 2004-09-02

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