JP4628680B2 - 熱伝導性相転移材料 - Google Patents

熱伝導性相転移材料 Download PDF

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Publication number
JP4628680B2
JP4628680B2 JP2003584171A JP2003584171A JP4628680B2 JP 4628680 B2 JP4628680 B2 JP 4628680B2 JP 2003584171 A JP2003584171 A JP 2003584171A JP 2003584171 A JP2003584171 A JP 2003584171A JP 4628680 B2 JP4628680 B2 JP 4628680B2
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JP
Japan
Prior art keywords
silicone
composition
pcc
component
carbon atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003584171A
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English (en)
Japanese (ja)
Other versions
JP2005522551A (ja
JP2005522551A5 (https=
Inventor
ドラッブ・バグワガー
アンドリュー・モジカ
キマイ・ティ・ニュイェン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Dow Silicones Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp, Dow Silicones Corp filed Critical Dow Corning Corp
Publication of JP2005522551A publication Critical patent/JP2005522551A/ja
Publication of JP2005522551A5 publication Critical patent/JP2005522551A5/ja
Application granted granted Critical
Publication of JP4628680B2 publication Critical patent/JP4628680B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/08—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/005—Modified block copolymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003584171A 2002-04-12 2003-03-18 熱伝導性相転移材料 Expired - Fee Related JP4628680B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/122,526 US6815486B2 (en) 2002-04-12 2002-04-12 Thermally conductive phase change materials and methods for their preparation and use
PCT/US2003/008097 WO2003087221A2 (en) 2002-04-12 2003-03-18 Thermally conductive phase change materials

Publications (3)

Publication Number Publication Date
JP2005522551A JP2005522551A (ja) 2005-07-28
JP2005522551A5 JP2005522551A5 (https=) 2006-02-02
JP4628680B2 true JP4628680B2 (ja) 2011-02-09

Family

ID=28790561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003584171A Expired - Fee Related JP4628680B2 (ja) 2002-04-12 2003-03-18 熱伝導性相転移材料

Country Status (7)

Country Link
US (1) US6815486B2 (https=)
EP (3) EP1509572A2 (https=)
JP (1) JP4628680B2 (https=)
KR (3) KR100987920B1 (https=)
AU (1) AU2003225830A1 (https=)
TW (1) TWI308170B (https=)
WO (1) WO2003087221A2 (https=)

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040217472A1 (en) * 2001-02-16 2004-11-04 Integral Technologies, Inc. Low cost chip carrier with integrated antenna, heat sink, or EMI shielding functions manufactured from conductive loaded resin-based materials
US20030168731A1 (en) * 2002-03-11 2003-09-11 Matayabas James Christopher Thermal interface material and method of fabricating the same
US6791832B2 (en) * 2002-03-26 2004-09-14 Intel Corporation Electronic package
US6791839B2 (en) * 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
CN1330691C (zh) * 2002-07-26 2007-08-08 纳幕尔杜邦公司 改进的热塑性聚合物烹调用品
US8974915B2 (en) * 2004-03-16 2015-03-10 Rensselaer Polytechnic Institute Block copolymer and nanofiller composites
JP4704434B2 (ja) * 2004-10-08 2011-06-15 ダウ・コーニング・コーポレイション 相変化組成物を使用するリトグラフィープロセス及びパターン
WO2006065282A1 (en) 2004-12-16 2006-06-22 Dow Corning Corporation Amide-substituted silicones and methods for their preparation and use
US8907026B2 (en) 2004-12-23 2014-12-09 Dow Corning Corporation Crosslinkable saccharide-siloxane compositions, and networks, coatings and articles formed therefrom
US20060228542A1 (en) * 2005-04-08 2006-10-12 Saint-Gobain Performance Plastics Corporation Thermal interface material having spheroidal particulate filler
JP4534062B2 (ja) 2005-04-19 2010-09-01 ルネサスエレクトロニクス株式会社 半導体装置
JP5122444B2 (ja) 2005-05-23 2013-01-16 ダウ・コーニング・コーポレイション サッカリド−シロキサンコポリマーを含むパーソナルケア組成物
US20070031684A1 (en) 2005-08-03 2007-02-08 Anderson Jeffrey T Thermally conductive grease
US20070032610A1 (en) * 2005-08-08 2007-02-08 General Electric Company Energy responsive composition and associated method
US7761181B2 (en) * 2005-11-29 2010-07-20 The Boeing Company Line replaceable systems and methods
TWI291480B (en) * 2005-12-20 2007-12-21 Ind Tech Res Inst Composition for thermal interface materials
US7820297B2 (en) * 2005-12-23 2010-10-26 3M Innovative Properties Company Multilayer films including thermoplastic silicone block copolymers
US8067094B2 (en) * 2005-12-23 2011-11-29 3M Innovative Properties Company Films including thermoplastic silicone block copolymers
US8404341B2 (en) 2006-01-26 2013-03-26 Outlast Technologies, LLC Microcapsules and other containment structures for articles incorporating functional polymeric phase change materials
US20100012883A1 (en) * 2008-07-16 2010-01-21 Outlast Technologies, Inc. Functional Polymeric Phase Change Materials
US9234059B2 (en) * 2008-07-16 2016-01-12 Outlast Technologies, LLC Articles containing functional polymeric phase change materials and methods of manufacturing the same
US20070173154A1 (en) * 2006-01-26 2007-07-26 Outlast Technologies, Inc. Coated articles formed of microcapsules with reactive functional groups
CN101478973B (zh) * 2006-05-23 2013-08-28 陶氏康宁公司 用于递送活性成分的新型硅氧烷成膜剂
WO2008103219A1 (en) * 2007-02-20 2008-08-28 Dow Corning Coration Filler treating agents based on hydrogen bonding polyorganosiloxanes
EP2188836A2 (en) * 2007-09-11 2010-05-26 Dow Corning Corporation Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
CN101803009B (zh) * 2007-09-11 2012-07-04 陶氏康宁公司 组合物，包括这种组合物的热界面材料,及其制备方法和用途
WO2009063570A1 (ja) * 2007-11-16 2009-05-22 Fujitsu Limited 電子装置及び電子装置の製造方法
DE102008004485A1 (de) 2008-01-14 2009-07-16 Bayerisches Zentrum für Angewandte Energieforschung e.V. Verkapselung von organischen und anorganischen Latentwärmespeichermaterialien
US20090208722A1 (en) * 2008-02-18 2009-08-20 John Francis Timmerman Oriented Members for Thermally Conductive Interface Structures
US20090321922A1 (en) * 2008-06-30 2009-12-31 Ravi Shankar Self-healing thermal interface materials for semiconductor packages
US20100015430A1 (en) * 2008-07-16 2010-01-21 Outlast Technologies, Inc. Heat Regulating Article With Moisture Enhanced Temperature Control
US8221910B2 (en) 2008-07-16 2012-07-17 Outlast Technologies, LLC Thermal regulating building materials and other construction components containing polymeric phase change materials
CN102341474B (zh) 2009-03-02 2014-09-24 霍尼韦尔国际公司 热界面材料及制造和使用它的方法
TWI389272B (zh) * 2009-04-22 2013-03-11 台達電子工業股份有限公司 電子元件之散熱模組及其組裝方法
US8081468B2 (en) * 2009-06-17 2011-12-20 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
US20100321897A1 (en) * 2009-06-17 2010-12-23 Laird Technologies, Inc. Compliant multilayered thermally-conductive interface assemblies
EP2456815B1 (en) 2009-07-24 2014-07-16 Ticona LLC Thermally conductive polymer compositions and articles made therefrom
EP2456814A1 (en) 2009-07-24 2012-05-30 Ticona LLC Thermally conductive thermoplastic resin compositions and related applications
WO2012027073A1 (en) 2010-08-23 2012-03-01 Dow Corning Corporation Saccharide siloxanes stable in aqueous environments and methods for the preparation and use of such saccharide siloxanes
US8673448B2 (en) 2011-03-04 2014-03-18 Outlast Technologies Llc Articles containing precisely branched functional polymeric phase change materials
JP2013254901A (ja) 2012-06-08 2013-12-19 Toshiba Corp シール材およびエッチング装置
US8587945B1 (en) * 2012-07-27 2013-11-19 Outlast Technologies Llc Systems structures and materials for electronic device cooling
US9084764B2 (en) 2012-08-16 2015-07-21 Exert Co. Epidermal cooling
US10373891B2 (en) * 2013-06-14 2019-08-06 Laird Technologies, Inc. Methods for establishing thermal joints between heat spreaders or lids and heat sources
US20140368992A1 (en) * 2013-06-14 2014-12-18 Laird Technologies, Inc. Methods For Establishing Thermal Joints Between Heat Spreaders and Heat Generating Components Using Thermoplastic and/or Self-Healing Thermal Interface Materials
US10174433B2 (en) 2013-12-05 2019-01-08 Honeywell International Inc. Stannous methanesulfonate solution with adjusted pH
JP2015230949A (ja) * 2014-06-04 2015-12-21 三菱電機株式会社 半導体装置及びその製造方法並びに転写シート及びその製造方法
WO2016004565A1 (en) 2014-07-07 2016-01-14 Honeywell International Inc. Thermal interface material with ion scavenger
KR102315902B1 (ko) 2014-11-24 2021-10-22 사빅 글로벌 테크놀러지스 비.브이. 응결-방지 내부 표면을 갖는 인클로져
JP6542891B2 (ja) 2014-12-05 2019-07-10 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． 低い熱インピーダンスを有する高性能熱界面材料
US10003053B2 (en) 2015-02-04 2018-06-19 Global Web Horizons, Llc Systems, structures and materials for electrochemical device thermal management
US10431858B2 (en) 2015-02-04 2019-10-01 Global Web Horizons, Llc Systems, structures and materials for electrochemical device thermal management
US20160315030A1 (en) * 2015-04-24 2016-10-27 Laird Technologies, Inc. Reusable thermoplastic thermal interface materials and methods for establishing thermal joints between heat sources and heat dissipating/removal structures
DE102015118245B4 (de) * 2015-10-26 2024-10-10 Infineon Technologies Austria Ag Elektronische Komponente mit einem thermischen Schnittstellenmaterial, Herstellungsverfahren für eine elektronische Komponente, Wärmeabfuhrkörper mit einem thermischen Schnittstellenmaterial und thermisches Schnittstellenmaterial
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
DE102015223422A1 (de) * 2015-11-26 2017-06-01 Robert Bosch Gmbh Elektrische Vorrichtung mit einer Umhüllmasse
CN106922104A (zh) * 2015-12-24 2017-07-04 北京中石伟业科技股份有限公司 一种易清理的导热相变垫片及其制备方法和系统
US10781349B2 (en) 2016-03-08 2020-09-22 Honeywell International Inc. Thermal interface material including crosslinker and multiple fillers
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US20180030328A1 (en) * 2016-07-26 2018-02-01 Honeywell International Inc. Gel-type thermal interface material
USD911961S1 (en) 2017-04-03 2021-03-02 Latent Heat Solutions, Llc Battery container
CN110663090B (zh) * 2017-05-03 2023-10-10 日立能源瑞士股份公司 稳定化的聚合物组合物
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11472925B2 (en) 2018-03-22 2022-10-18 Momentive Performance Materials Inc. Silicone polymer
US10941251B2 (en) 2018-03-22 2021-03-09 Momentive Performance Materials Inc. Silicone polymer and composition comprising the same
US10968351B2 (en) 2018-03-22 2021-04-06 Momentive Performance Materials Inc. Thermal conducting silicone polymer composition
US11319414B2 (en) 2018-03-22 2022-05-03 Momentive Performance Materials Inc. Silicone polymer
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN115916922A (zh) * 2020-07-16 2023-04-04 罗杰斯公司 导热相变组合物、其制造方法、和包含所述组合物的制品
KR20230077716A (ko) * 2020-09-30 2023-06-01 세키수이 폴리머텍 가부시키가이샤 열전도성 시트, 그 장착 방법 및 제조 방법
CN113004793B (zh) * 2021-03-25 2022-03-29 江西蓝星星火有机硅有限公司 一种导热相变材料及其应用
WO2022239620A1 (ja) * 2021-05-13 2022-11-17 ローム株式会社 パッケージ
WO2022251187A1 (en) * 2021-05-24 2022-12-01 Beam Global Smart phase change composite for passive thermal management
CN115141493B (zh) * 2022-06-28 2023-03-17 中国科学技术大学 一种可压缩高柔性高热容相变导热界面材料的制备方法
US20250016962A1 (en) * 2023-06-30 2025-01-09 Honeywell International Inc. Highly thermally conductive hybrid thermal interface material

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1117771A (en) * 1963-07-23 1968-06-26 Union Carbide Corp Organosilicon compositions
US4193885A (en) 1977-08-02 1980-03-18 Dow Corning Corporation Method for preparing a thermal-stability additive and a thermally stabilized methylpolysiloxane and compositions therefrom
US4299715A (en) 1978-04-14 1981-11-10 Whitfield Fred J Methods and materials for conducting heat from electronic components and the like
US4282346A (en) 1979-02-02 1981-08-04 Emery Industries, Inc. Preparation of copolyamide from dicarboxylic acid mixture, piperazine and polyoxyalkylene diamine
US4501861A (en) 1982-11-01 1985-02-26 Monsanto Company Thermoplastic polyamide compositions
US4517342A (en) 1983-06-23 1985-05-14 General Electric Company Heat curable compositions
US4558110A (en) 1985-02-01 1985-12-10 General Electric Company Crystalline silicone-imide copolymers
JPS61204227A (ja) * 1985-03-08 1986-09-10 Toshiba Silicone Co Ltd ポリシロキサン−ポリアミド系マルチブロツク共重合体及びその製造方法
US4604442A (en) 1985-03-29 1986-08-05 General Electric Company Organopolysiloxane-polyamide block polymers and method for making
US4631329A (en) 1985-11-29 1986-12-23 Dow Corning Corporation Moisture resistant polyurethanes derived from non-aromatic diisocyanates
FR2605326A1 (fr) * 1986-10-20 1988-04-22 Rhone Poulenc Multi Tech Composition potentiellement adhesive electriquement conductrice.
FR2606784B1 (fr) * 1986-11-14 1989-03-03 Rhone Poulenc Multi Tech Composition potentiellement adhesive electriquement conductrice
US4793555A (en) 1988-04-22 1988-12-27 Dow Corning Corporation Container, method and composition for controlling the release of a volatile liquid from an aqueous mixture
US4959752A (en) * 1988-10-24 1990-09-25 Digital Equipment Corporation Electronic module RFI/EMI shielding
US5183874A (en) * 1990-10-18 1993-02-02 Technical Development Associates Polyorganosiloxane-polyamide block copolymers
JP2542152B2 (ja) 1991-10-30 1996-10-09 ゼネラル・エレクトリック・カンパニイ 熱可塑性シリコ―ン−ポリフェニレンエ―テルブロック共重合体の製造法
US5298589A (en) 1992-07-16 1994-03-29 Temple University-Of The Commonwealth System Of Higher Education Highly functionalized polycyclosiloxanes and their polymerization into thermally reversible living rubbers
JP3367074B2 (ja) * 1992-10-28 2003-01-14 日立化成工業株式会社 導電性ペースト組成物
JP2775378B2 (ja) * 1993-05-21 1998-07-16 株式会社巴川製紙所 ポリシロキサン−芳香族ポリアミド系共重合体の製造方法
US6197859B1 (en) 1993-06-14 2001-03-06 The Bergquist Company Thermally conductive interface pads for electronic devices
US5919441A (en) * 1996-04-01 1999-07-06 Colgate-Palmolive Company Cosmetic composition containing thickening agent of siloxane polymer with hydrogen-bonding groups
AU723258B2 (en) 1996-04-29 2000-08-24 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US6286212B1 (en) 1996-05-29 2001-09-11 Manford L. Eaton Thermally conductive material and method of using the same
US5930893A (en) 1996-05-29 1999-08-03 Eaton; Manford L. Thermally conductive material and method of using the same
US5950066A (en) * 1996-06-14 1999-09-07 The Bergquist Company Semisolid thermal interface with low flow resistance
US5773561A (en) * 1996-08-02 1998-06-30 International Business Machines Corporation Polymer sealants/adhesives and use thereof in electronic package assembly
US5904796A (en) 1996-12-05 1999-05-18 Power Devices, Inc. Adhesive thermal interface and method of making the same
US6051216A (en) * 1997-08-01 2000-04-18 Colgate-Palmolive Company Cosmetic composition containing siloxane based polyamides as thickening agents
US5929164A (en) 1997-11-05 1999-07-27 Dow Corning Corporation Quenching post cure
US5993698A (en) * 1997-11-06 1999-11-30 Acheson Industries, Inc. Electrical device containing positive temperature coefficient resistor composition and method of manufacturing the device
US6096414A (en) * 1997-11-25 2000-08-01 Parker-Hannifin Corporation High dielectric strength thermal interface material
US6442365B1 (en) * 1998-04-08 2002-08-27 Xerox Corporation Thermally conductive fuser belt
JP3444199B2 (ja) 1998-06-17 2003-09-08 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
US5981680A (en) * 1998-07-13 1999-11-09 Dow Corning Corporation Method of making siloxane-based polyamides
JP2941801B1 (ja) 1998-09-17 1999-08-30 北川工業株式会社 熱伝導材
EP1117771B1 (en) 1998-10-02 2003-04-23 Novozymes A/S Solid phytase compositions
US5912805A (en) 1998-11-04 1999-06-15 Freuler; Raymond G. Thermal interface with adhesive
US6165612A (en) * 1999-05-14 2000-12-26 The Bergquist Company Thermally conductive interface layers
US6391442B1 (en) 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material
EP1097957A1 (en) 1999-11-03 2001-05-09 Daikin Industries, Limited Fluorinated thermoplastic elastomers
ATE322978T1 (de) 2000-03-13 2006-04-15 Cryovac Inc Biaxial gereckte und thermofixierte, mehrschichtige, thermoplastische verpackungsfolie
US6433057B1 (en) 2000-03-28 2002-08-13 Dow Corning Corporation Silicone composition and electrically conductive silicone adhesive formed therefrom
US6451295B1 (en) * 2000-08-31 2002-09-17 Colgate-Palmolive Company Clear antiperspirants and deodorants made with siloxane-based polyamides
US6433055B1 (en) * 2000-09-13 2002-08-13 Dow Corning Corporation Electrically conductive hot-melt silicone adhesive composition
MXPA03006498A (es) * 2001-01-22 2003-10-15 Parker Hannifin Corp Entrecara termica de cambio de fase, de liberacion limpia.
JP2002329989A (ja) 2001-05-02 2002-11-15 Shin Etsu Chem Co Ltd 熱軟化性放熱シート
US6620515B2 (en) * 2001-12-14 2003-09-16 Dow Corning Corporation Thermally conductive phase change materials

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AU2003225830A1 (en) 2003-10-27
KR100987916B1 (ko) 2010-10-18
KR20100075699A (ko) 2010-07-02
EP1757659B1 (en) 2012-12-26
EP1757659A3 (en) 2007-05-30
EP1757659A2 (en) 2007-02-28
KR20090086138A (ko) 2009-08-10
TWI308170B (en) 2009-04-01
AU2003225830A8 (en) 2003-10-27
US20030194537A1 (en) 2003-10-16
KR100987920B1 (ko) 2010-10-18
US6815486B2 (en) 2004-11-09
KR20050000392A (ko) 2005-01-03
JP2005522551A (ja) 2005-07-28
TW200307015A (en) 2003-12-01
WO2003087221A2 (en) 2003-10-23
EP1509572A2 (en) 2005-03-02
KR100989031B1 (ko) 2010-10-25
EP1783169A2 (en) 2007-05-09
EP1783169A3 (en) 2007-08-15
WO2003087221A3 (en) 2003-12-04

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