JP4624217B2 - 回路基板の製造方法 - Google Patents

回路基板の製造方法 Download PDF

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Publication number
JP4624217B2
JP4624217B2 JP2005255048A JP2005255048A JP4624217B2 JP 4624217 B2 JP4624217 B2 JP 4624217B2 JP 2005255048 A JP2005255048 A JP 2005255048A JP 2005255048 A JP2005255048 A JP 2005255048A JP 4624217 B2 JP4624217 B2 JP 4624217B2
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JP
Japan
Prior art keywords
conductive
conductive metal
conduction
plating
circuit wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2005255048A
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English (en)
Japanese (ja)
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JP2007067341A (ja
Inventor
猛 國府田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
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Nippon Mektron KK
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Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP2005255048A priority Critical patent/JP4624217B2/ja
Priority to TW095131176A priority patent/TW200721929A/zh
Priority to CN2006101422241A priority patent/CN1925725B/zh
Publication of JP2007067341A publication Critical patent/JP2007067341A/ja
Application granted granted Critical
Publication of JP4624217B2 publication Critical patent/JP4624217B2/ja
Anticipated expiration legal-status Critical
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  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2005255048A 2005-09-02 2005-09-02 回路基板の製造方法 Expired - Lifetime JP4624217B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005255048A JP4624217B2 (ja) 2005-09-02 2005-09-02 回路基板の製造方法
TW095131176A TW200721929A (en) 2005-09-02 2006-08-24 Method for manufacturing circuit substrate
CN2006101422241A CN1925725B (zh) 2005-09-02 2006-09-01 电路基板的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005255048A JP4624217B2 (ja) 2005-09-02 2005-09-02 回路基板の製造方法

Publications (2)

Publication Number Publication Date
JP2007067341A JP2007067341A (ja) 2007-03-15
JP4624217B2 true JP4624217B2 (ja) 2011-02-02

Family

ID=37818110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005255048A Expired - Lifetime JP4624217B2 (ja) 2005-09-02 2005-09-02 回路基板の製造方法

Country Status (3)

Country Link
JP (1) JP4624217B2 (enrdf_load_stackoverflow)
CN (1) CN1925725B (enrdf_load_stackoverflow)
TW (1) TW200721929A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100962371B1 (ko) * 2008-07-02 2010-06-10 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN101783332B (zh) * 2009-01-16 2012-01-25 日月光半导体制造股份有限公司 线路板及其制备工艺
CN102427670A (zh) * 2011-11-08 2012-04-25 汕头超声印制板（二厂）有限公司 一种印刷电路板的减薄铜层方法
CN104105361B (zh) * 2014-05-07 2018-08-31 深圳市环基实业有限公司 一种电路板选择性电镀导电孔的方法
CN108235598B (zh) * 2017-12-13 2019-10-18 深南电路股份有限公司 一种特殊的镀金焊盘制造方法
US12004305B2 (en) * 2018-12-20 2024-06-04 Resonac Corporation Wiring board and production method for same
CN111712065B (zh) * 2020-07-08 2022-08-12 高德(江苏)电子科技股份有限公司 一种避免软硬结合板孔铜断裂的加工工艺
JPWO2022097481A1 (enrdf_load_stackoverflow) * 2020-11-05 2022-05-12

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3250579B2 (ja) * 1993-01-14 2002-01-28 住友電気工業株式会社 歪補正回路
JP3142270B2 (ja) * 1998-04-01 2001-03-07 三井金属鉱業株式会社 プリント配線板の製造方法
KR100749444B1 (ko) * 1998-09-18 2007-08-17 훈츠만 어드밴스트 머티리얼스(스위처랜드)게엠베하 에칭된 회로의 제조방법
JP2000282245A (ja) * 1999-03-30 2000-10-10 Ebara Udylite Kk コンディショナー組成物およびこれを利用するＰｄ−Ｓｎコロイド触媒の吸着量増大方法
CN1494120A (zh) * 2002-10-28 2004-05-05 华泰电子股份有限公司 集成电路封装基板的金属电镀方法
JP4133560B2 (ja) * 2003-05-07 2008-08-13 インターナショナル・ビジネス・マシーンズ・コーポレーション プリント配線基板の製造方法およびプリント配線基板

Also Published As

Publication number Publication date
TW200721929A (en) 2007-06-01
TWI357291B (enrdf_load_stackoverflow) 2012-01-21
CN1925725B (zh) 2010-11-03
CN1925725A (zh) 2007-03-07
JP2007067341A (ja) 2007-03-15

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