JP4597708B2 - Ｆｏｕｐオープナ - Google Patents

Ｆｏｕｐオープナ Download PDF

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Publication number
JP4597708B2
JP4597708B2 JP2005051323A JP2005051323A JP4597708B2 JP 4597708 B2 JP4597708 B2 JP 4597708B2 JP 2005051323 A JP2005051323 A JP 2005051323A JP 2005051323 A JP2005051323 A JP 2005051323A JP 4597708 B2 JP4597708 B2 JP 4597708B2
Authority
JP
Japan
Prior art keywords
foup
door
main structure
port door
opener
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005051323A
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English (en)
Japanese (ja)
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JP2006237370A5 (enExample
JP2006237370A (ja
Inventor
進二 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hirata Corp
Original Assignee
Hirata Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Corp filed Critical Hirata Corp
Priority to JP2005051323A priority Critical patent/JP4597708B2/ja
Priority to US11/359,531 priority patent/US7976262B2/en
Publication of JP2006237370A publication Critical patent/JP2006237370A/ja
Publication of JP2006237370A5 publication Critical patent/JP2006237370A5/ja
Application granted granted Critical
Publication of JP4597708B2 publication Critical patent/JP4597708B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2005051323A 2005-02-25 2005-02-25 Ｆｏｕｐオープナ Expired - Lifetime JP4597708B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005051323A JP4597708B2 (ja) 2005-02-25 2005-02-25 Ｆｏｕｐオープナ
US11/359,531 US7976262B2 (en) 2005-02-25 2006-02-23 FOUP opener

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005051323A JP4597708B2 (ja) 2005-02-25 2005-02-25 Ｆｏｕｐオープナ

Publications (3)

Publication Number Publication Date
JP2006237370A JP2006237370A (ja) 2006-09-07
JP2006237370A5 JP2006237370A5 (enExample) 2008-05-22
JP4597708B2 true JP4597708B2 (ja) 2010-12-15

Family

ID=37044680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005051323A Expired - Lifetime JP4597708B2 (ja) 2005-02-25 2005-02-25 Ｆｏｕｐオープナ

Country Status (2)

Country Link
US (1) US7976262B2 (enExample)
JP (1) JP4597708B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI251858B (en) * 2004-09-17 2006-03-21 Ind Tech Res Inst Six-linkage positioning mechanism
US8915368B2 (en) * 2012-09-20 2014-12-23 Shenzhen China Star Optoelectronics Technology Co., Ltd LCD glass substrate storage tray
KR102186620B1 (ko) * 2013-05-06 2020-12-03 삼성전자주식회사 로드 포트 모듈 및 이를 이용한 기판 로딩 방법
JP6260109B2 (ja) * 2013-05-16 2018-01-17 シンフォニアテクノロジー株式会社 ロードポート装置
JP6856692B2 (ja) * 2019-03-28 2021-04-07 平田機工株式会社 ロードポート

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5985623A (en) * 1995-01-24 1999-11-16 Shin-Etsu Bio, Inc. DNA segments and methods for increasing polysaccharide production
DE59611078D1 (de) * 1995-03-28 2004-10-14 Brooks Automation Gmbh Be- und Entladestation für Halbleiterbearbeitungsanlagen
US5806574A (en) * 1995-12-01 1998-09-15 Shinko Electric Co., Ltd. Portable closed container
US6138721A (en) * 1997-09-03 2000-10-31 Asyst Technologies, Inc. Tilt and go load port interface alignment system
JPH11159218A (ja) * 1997-11-26 1999-06-15 Shin Etsu Polymer Co Ltd 精密基板容器のドアラッチ機構
US6704998B1 (en) * 1997-12-24 2004-03-16 Asyst Technologies, Inc. Port door removal and wafer handling robotic system
US6082951A (en) * 1998-01-23 2000-07-04 Applied Materials, Inc. Wafer cassette load station
JPH11214479A (ja) * 1998-01-23 1999-08-06 Tokyo Electron Ltd 基板処理装置及びその方法並びに基板搬送装置
JPH11220001A (ja) 1998-01-30 1999-08-10 Hitachi Ltd 半導体基板処理装置におけるロードポート及びロードポート搬送台車
US6281516B1 (en) * 1998-07-13 2001-08-28 Newport Corporation FIMS transport box load interface
US6502869B1 (en) * 1998-07-14 2003-01-07 Asyst Technologies, Inc. Pod door to port door retention system
US6261044B1 (en) * 1998-08-06 2001-07-17 Asyst Technologies, Inc. Pod to port door retention and evacuation system
US6168364B1 (en) * 1999-04-19 2001-01-02 Tdk Corporation Vacuum clean box, clean transfer method and apparatus therefor
US6396072B1 (en) * 1999-06-21 2002-05-28 Fortrend Engineering Corporation Load port door assembly with integrated wafer mapper
JP3954287B2 (ja) * 1999-06-28 2007-08-08 東京エレクトロン株式会社 ウェハキャリア用蓋体の着脱装置
JP2001102426A (ja) * 1999-10-01 2001-04-13 Hirata Corp 物品容器開閉・転送装置および物品容器開閉・転送方法
JP3559213B2 (ja) * 2000-03-03 2004-08-25 株式会社半導体先端テクノロジーズ ロードポート及びそれを用いた生産方式
JP2004503080A (ja) * 2000-06-30 2004-01-29 エイジェイエス　オートメイション，　インコーポレイテッド 半導体ウエハ処理装置のための装置および方法
US20020015636A1 (en) * 2000-08-04 2002-02-07 Shinsung Eng Corporation FOUP door opening apparatus of FOUP opener and latch key control method
US20020044859A1 (en) * 2000-08-28 2002-04-18 Shinsung Eng Corporation FOUP loading apparatus for FOUP opener
US6419438B1 (en) * 2000-11-28 2002-07-16 Asyst Technologies, Inc. FIMS interface without alignment pins
JP3699348B2 (ja) * 2000-11-30 2005-09-28 平田機工株式会社 駆動部隔離ｆｏｕｐオープナ
US7021882B2 (en) * 2000-11-30 2006-04-04 Hirata Corporation Drive-section-isolated FOUP opener
JP2002184831A (ja) * 2000-12-11 2002-06-28 Hirata Corp Ｆｏｕｐオープナ
US6533521B1 (en) * 2001-03-29 2003-03-18 Genmark Automation, Inc. Integrated substrate handler having pre-aligner and storage pod access mechanism
EP1315198B1 (en) * 2001-11-21 2006-08-30 RIGHT MFG. Co. Ltd. Pod cover removing-installing apparatus
JP2003203961A (ja) * 2002-01-04 2003-07-18 Hitachi Kokusai Electric Inc 基板処理装置
JP4175560B2 (ja) * 2002-11-13 2008-11-05 平田機工株式会社 容器開閉装置
US6984839B2 (en) * 2002-11-22 2006-01-10 Tdk Corporation Wafer processing apparatus capable of mapping wafers
JP2004296856A (ja) * 2003-03-27 2004-10-21 Hitachi Kokusai Electric Inc 半導体製造装置
JP3902583B2 (ja) * 2003-09-25 2007-04-11 Ｔｄｋ株式会社 可搬式密閉容器内部のパージシステムおよびパージ方法
US7328727B2 (en) * 2004-04-18 2008-02-12 Entegris, Inc. Substrate container with fluid-sealing flow passageway

Also Published As

Publication number Publication date
US20060245849A1 (en) 2006-11-02
JP2006237370A (ja) 2006-09-07
US7976262B2 (en) 2011-07-12

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