JP4594273B2 - 構造体及び構造体の製造方法 - Google Patents

構造体及び構造体の製造方法 Download PDF

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Publication number
JP4594273B2
JP4594273B2 JP2006128355A JP2006128355A JP4594273B2 JP 4594273 B2 JP4594273 B2 JP 4594273B2 JP 2006128355 A JP2006128355 A JP 2006128355A JP 2006128355 A JP2006128355 A JP 2006128355A JP 4594273 B2 JP4594273 B2 JP 4594273B2
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JP
Japan
Prior art keywords
crystal grains
substrate
crystal
magnetic
pores
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006128355A
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English (en)
Japanese (ja)
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JP2007299490A5 (enExample
JP2007299490A (ja
Inventor
滋 市原
透 田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2006128355A priority Critical patent/JP4594273B2/ja
Priority to US11/740,539 priority patent/US7579095B2/en
Publication of JP2007299490A publication Critical patent/JP2007299490A/ja
Publication of JP2007299490A5 publication Critical patent/JP2007299490A5/ja
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/855—Coating only part of a support with a magnetic layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3435—Applying energy to the substrate during sputtering
    • C23C14/345—Applying energy to the substrate during sputtering using substrate bias
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5873—Removal of material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5873—Removal of material
    • C23C14/588—Removal of material by mechanical treatment
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851—Coating a support with a magnetic layer by sputtering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/32—Composite [nonstructural laminate] of inorganic material having metal-compound-containing layer and having defined magnetic layer

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Magnetic Record Carriers (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
JP2006128355A 2006-05-02 2006-05-02 構造体及び構造体の製造方法 Expired - Fee Related JP4594273B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006128355A JP4594273B2 (ja) 2006-05-02 2006-05-02 構造体及び構造体の製造方法
US11/740,539 US7579095B2 (en) 2006-05-02 2007-04-26 Differentially oriented patterned magnetic media

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006128355A JP4594273B2 (ja) 2006-05-02 2006-05-02 構造体及び構造体の製造方法

Publications (3)

Publication Number Publication Date
JP2007299490A JP2007299490A (ja) 2007-11-15
JP2007299490A5 JP2007299490A5 (enExample) 2009-06-25
JP4594273B2 true JP4594273B2 (ja) 2010-12-08

Family

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Family Applications (1)

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JP2006128355A Expired - Fee Related JP4594273B2 (ja) 2006-05-02 2006-05-02 構造体及び構造体の製造方法

Country Status (2)

Country Link
US (1) US7579095B2 (enExample)
JP (1) JP4594273B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7794861B2 (en) * 2006-08-11 2010-09-14 Canon Kabushiki Kaisha Patterned media, method of manufacturing magnetic recording medium, and method of manufacturing a base
JP2008282470A (ja) * 2007-05-10 2008-11-20 Yamaguchi Univ パターンドメディアの製造方法
KR101496171B1 (ko) * 2007-12-14 2015-02-27 시게이트 테크놀로지 엘엘씨 자기박막구조체, 자기기록매체 및 그 제조방법
JP2011023080A (ja) * 2009-07-17 2011-02-03 Fuji Electric Device Technology Co Ltd 磁気記録媒体及びその製造方法
JP5670638B2 (ja) * 2010-01-26 2015-02-18 昭和電工株式会社 熱アシスト磁気記録媒体及び磁気記録再生装置
US8625213B1 (en) 2011-03-31 2014-01-07 Seagate Technology Llc Automated cluster size measurement
RU2526236C1 (ru) * 2013-03-22 2014-08-20 Федеральное государственное бюджетное учреждение "Национальный исследовательский центр "Курчатовский институт" Способ формирования магнитной паттернированной структуры в немагнитной матрице
MY164347A (en) * 2014-05-12 2017-12-15 Fuji Electric Co Ltd Method for manufacturing perpendicular magnetic recording medium

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0612649A (ja) * 1991-09-18 1994-01-21 Matsushita Electric Ind Co Ltd 磁気記録媒体
US5851643A (en) * 1993-11-11 1998-12-22 Hitachi, Ltd. Magnetic recording media and magnetic recording read-back system which uses such media
JPH07334832A (ja) * 1994-06-08 1995-12-22 Hitachi Ltd 垂直磁気記録媒体及び磁気記録装置
US6602620B1 (en) * 1998-12-28 2003-08-05 Kabushiki Kaisha Toshiba Magnetic recording apparatus, magnetic recording medium and manufacturing method thereof
JP2002084018A (ja) * 2000-09-08 2002-03-22 Canon Inc 磁気デバイス及びその製造方法、並びに固体磁気メモリ
JP3762277B2 (ja) * 2000-09-29 2006-04-05 キヤノン株式会社 磁気記録媒体及びその製造方法
JP3886802B2 (ja) * 2001-03-30 2007-02-28 株式会社東芝 磁性体のパターニング方法、磁気記録媒体、磁気ランダムアクセスメモリ
US6852431B2 (en) * 2001-10-16 2005-02-08 Canon Kabushiki Kaisha Magnetic recording media and method for manufacturing the same
US20060022342A1 (en) * 2001-10-16 2006-02-02 Canon Kabushiki Kaisha Semiconductor device and method for manufacturing the same
AU2003213353A1 (en) * 2002-03-15 2003-09-29 Canon Kabushiki Kaisha Porous material and process for producing the same
JP4027145B2 (ja) * 2002-04-15 2007-12-26 キヤノン株式会社 垂直磁気記録媒体、磁気記録再生装置及び情報処理装置
JP2004220671A (ja) 2003-01-14 2004-08-05 Hitachi Ltd ｃ軸約４５°傾斜配向Ｌ１０−ＦｅＰｔ系ナノ粒子磁気記録媒体
US7247396B2 (en) * 2003-01-30 2007-07-24 Seagate Technology Llc Highly oriented perpendicular magnetic recording media
WO2005014893A1 (en) * 2003-08-11 2005-02-17 Canon Kabushiki Kaisha Method for production of structure and porous member
US6947235B2 (en) * 2003-12-03 2005-09-20 Hitachi Global Storage Technologies Netherlands B.V. Patterned multilevel perpendicular magnetic recording media
JP4263133B2 (ja) * 2004-04-12 2009-05-13 ヒタチグローバルストレージテクノロジーズネザーランドビーブイ 磁気記録媒体及び磁気記録再生装置
JP4358068B2 (ja) 2004-08-06 2009-11-04 株式会社東芝 磁気記録媒体、及びこれを用いた磁気記録再生装置
JP2006075942A (ja) * 2004-09-09 2006-03-23 Fujitsu Ltd 積層構造体、磁気記録媒体及びその製造方法、磁気記録装置及び磁気記録方法、並びに、該積層構造体を用いた素子

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Publication number Publication date
US20070259210A1 (en) 2007-11-08
US7579095B2 (en) 2009-08-25
JP2007299490A (ja) 2007-11-15

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