JP4583956B2 - 面状光源装置の製造方法 - Google Patents
面状光源装置の製造方法 Download PDFInfo
- Publication number
- JP4583956B2 JP4583956B2 JP2005034302A JP2005034302A JP4583956B2 JP 4583956 B2 JP4583956 B2 JP 4583956B2 JP 2005034302 A JP2005034302 A JP 2005034302A JP 2005034302 A JP2005034302 A JP 2005034302A JP 4583956 B2 JP4583956 B2 JP 4583956B2
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- JP
- Japan
- Prior art keywords
- light source
- substrate
- source device
- unit
- planar light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
Description
2 光源基板
3 単位基板
4 基板
5a、5b 光源
6 定電流回路
7a,7b コネクタ
11 接続部
12a,12b 切欠き
13 突起部
21 基幹配線
31 分岐配線
41 直流電源
51 面状光源集合体
Claims (8)
- 基板と、該基板上に形成された光源とを備えた複数の単位基板が、少なくとも一方向に互いに隣接して配列され、接続部を介して一体に形成されている光源基板と、該光源基板の面内方向に敷設された少なくとも1本の基幹配線であって、各々は該接続部を介して隣接する該単位基板間を延び、すべての該単位基板を連結するように互いに接続されている基幹配線と、該各単位基板内で該基幹配線から分岐して、該光源に駆動電力を供給する分岐配線とを有し、すべての前記単位基板は、互いに共通の位置に、前記基幹配線と接続されて、前記駆動電力の供給を受けるコネクタを有している面状光源集合体を準備するステップと、
前記面状光源集合体を1以上の所定の前記接続部で切断するステップと、
いずれかの前記基幹配線に電源を接続するステップと、
を有している、面状光源装置の製造方法。 - 前記複数の単位基板は、格子状に互いに隣接して配列されている、請求項1に記載の面状光源装置の製造方法。
- すべての前記単位基板は、互いに共通する2以上の位置に前記コネクタを有している、請求項1または2に記載の面状光源装置の製造方法。
- 前記駆動電力を発生させる電源装置を、少なくとも一つの前記コネクタに接続するステップを含む、請求項1から3のいずれか1項に記載の面状光源装置の製造方法。
- 前記接続部は、前記単位基板の一般部よりも切断強度が小さい、請求項1から4のいずれか1項に記載の面状光源装置の製造方法。
- 前記接続部は、前記単位基板の一般部よりも肉厚が小さい、請求項5に記載の面状光源装置の製造方法。
- 前記光源は、複数の色の光源からなり、
前記基幹配線および前記分岐配線は前記複数の色ごとに設けられている、
請求項1から6のいずれか1項に記載の面状光源装置の製造方法。 - 前記光源は発光ダイオードである、請求項1から7のいずれか1項に記載の面状光源装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005034302A JP4583956B2 (ja) | 2005-02-10 | 2005-02-10 | 面状光源装置の製造方法 |
US11/346,388 US8523391B2 (en) | 2005-02-10 | 2006-02-03 | Flat light source apparatus with separable unit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005034302A JP4583956B2 (ja) | 2005-02-10 | 2005-02-10 | 面状光源装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006221966A JP2006221966A (ja) | 2006-08-24 |
JP4583956B2 true JP4583956B2 (ja) | 2010-11-17 |
Family
ID=36984133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005034302A Active JP4583956B2 (ja) | 2005-02-10 | 2005-02-10 | 面状光源装置の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8523391B2 (ja) |
JP (1) | JP4583956B2 (ja) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080049164A1 (en) * | 2006-08-22 | 2008-02-28 | Samsung Electronics Co., Ltd., | Backlight assembly, manufacturing method thereof, and liquid crystal display device |
ES1063895Y (es) * | 2006-09-28 | 2007-03-16 | Sakma Electronica Ind S A | Dispositivo modular de iluminacion |
CN101529150A (zh) * | 2006-10-20 | 2009-09-09 | 株式会社康天慈 | 挠性发光体 |
JP2008159394A (ja) * | 2006-12-22 | 2008-07-10 | Koha Co Ltd | 取付けユニットおよび面状発光装置 |
JP4862667B2 (ja) * | 2007-01-24 | 2012-01-25 | ソニー株式会社 | 光源モジュール及び光源装置 |
EP2000736A1 (de) * | 2007-06-05 | 2008-12-10 | Alcan Technology & Management Ltd. | Flächige Beleuchtungseinrichtung |
JP4981598B2 (ja) * | 2007-09-14 | 2012-07-25 | パナソニック株式会社 | 照明システム |
DE102008059552A1 (de) * | 2008-11-28 | 2010-06-02 | Osram Opto Semiconductors Gmbh | Leuchtdiodenmodul und Leuchtdiodenbauteil |
JP5872455B2 (ja) | 2009-04-28 | 2016-03-01 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 照明ユニット |
DE102009032984B3 (de) * | 2009-07-14 | 2011-03-03 | Osram Gesellschaft mit beschränkter Haftung | Biegbare Leuchtmodule und Verfahren zum Herstellen von biegbaren Leuchtmodulen |
JP5397112B2 (ja) * | 2009-09-14 | 2014-01-22 | 船井電機株式会社 | バックライト装置及び表示装置 |
WO2011067978A1 (ja) * | 2009-12-02 | 2011-06-09 | シャープ株式会社 | 照明装置および表示装置 |
WO2012033550A1 (en) * | 2010-09-10 | 2012-03-15 | Robe Lighting Inc | Circuit board for an led luminaire |
JP4838378B1 (ja) * | 2010-10-04 | 2011-12-14 | 聡 笹村 | Led照明パネル |
JP5681436B2 (ja) * | 2010-10-12 | 2015-03-11 | シャープ株式会社 | 発光装置および照明装置 |
CN102147064B (zh) * | 2011-01-05 | 2014-03-26 | 深圳市众明半导体照明有限公司 | 一种led模组及照明装置 |
DE102011110799A1 (de) * | 2011-08-22 | 2013-02-28 | Heraeus Materials Technology Gmbh & Co. Kg | Substrat für den Aufbau elektronischer Elemente |
TWI457516B (zh) * | 2012-02-21 | 2014-10-21 | Lextar Electronics Corp | 燈條組合 |
US20130278158A1 (en) * | 2012-03-26 | 2013-10-24 | Cheorwon Plasma Research Institute | Oled lighting module |
US9410665B2 (en) * | 2012-07-16 | 2016-08-09 | The Sloan Company, Inc. | Flexible ribbon LED module |
US9022602B2 (en) * | 2012-08-28 | 2015-05-05 | Osram Sylvania Inc. | Modular multichannel connector system and method |
US8704448B2 (en) * | 2012-09-06 | 2014-04-22 | Cooledge Lighting Inc. | Wiring boards for array-based electronic devices |
CN104871235B (zh) * | 2012-12-10 | 2018-05-01 | 马田专业公司 | 具有自动像素检测的可配置的led像素装置 |
DE102013212671B4 (de) | 2013-06-28 | 2018-07-19 | Itz Innovations- Und Technologiezentrum Gmbh | Variables Decken- bzw. Wandleuchtensystem sowie Grundplatte und Lichtmodul hierfür |
WO2015014408A1 (en) * | 2013-08-02 | 2015-02-05 | Osram Opto Semiconductors Gmbh | Component carrier assemblage for optoelectronic semiconductor components |
US9374859B2 (en) * | 2013-09-11 | 2016-06-21 | Advancetrex Corporation | Lighting interconnection and lighting control module |
JP6809864B2 (ja) * | 2016-10-06 | 2021-01-06 | 株式会社Joled | 回路基板モジュール、及び、フレキシブル表示装置 |
JP7295693B2 (ja) * | 2019-04-26 | 2023-06-21 | コイズミ照明株式会社 | 光源モジュール |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57178488U (ja) * | 1981-07-07 | 1982-11-11 | ||
JP2003168305A (ja) * | 2001-01-25 | 2003-06-13 | Matsushita Electric Ind Co Ltd | 発光ユニット、発光ユニット組合せ体、および照明装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6028193B2 (ja) | 1981-04-24 | 1985-07-03 | 日本電信電話株式会社 | カラ−テレビジョンシステムにおける輝度信号発生装置 |
DE10012734C1 (de) * | 2000-03-16 | 2001-09-27 | Bjb Gmbh & Co Kg | Illuminationsbausatz für Beleuchtungs-, Anzeige- oder Hinweiszwecke sowie Steckverbinder für einen solchen Illuminationsbausatz |
DE10034886A1 (de) * | 2000-07-18 | 2002-02-07 | Osram Opto Semiconductors Gmbh | Optisches Mehrfachbauteil, insbesondere zur Verwendung mit Leuchtdioden |
US6558021B2 (en) * | 2001-08-10 | 2003-05-06 | Leotek Electronics Corporation | Light emitting diode modules for illuminated signs |
JP3968226B2 (ja) | 2001-09-20 | 2007-08-29 | 松下電器産業株式会社 | 発光ユニット用ジョイント基板 |
US6851831B2 (en) * | 2002-04-16 | 2005-02-08 | Gelcore Llc | Close packing LED assembly with versatile interconnect architecture |
JP2004253364A (ja) * | 2003-01-27 | 2004-09-09 | Matsushita Electric Ind Co Ltd | 照明装置 |
US6942360B2 (en) * | 2003-10-01 | 2005-09-13 | Enertron, Inc. | Methods and apparatus for an LED light engine |
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2005
- 2005-02-10 JP JP2005034302A patent/JP4583956B2/ja active Active
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2006
- 2006-02-03 US US11/346,388 patent/US8523391B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57178488U (ja) * | 1981-07-07 | 1982-11-11 | ||
JP2003168305A (ja) * | 2001-01-25 | 2003-06-13 | Matsushita Electric Ind Co Ltd | 発光ユニット、発光ユニット組合せ体、および照明装置 |
Also Published As
Publication number | Publication date |
---|---|
US20060221608A1 (en) | 2006-10-05 |
US8523391B2 (en) | 2013-09-03 |
JP2006221966A (ja) | 2006-08-24 |
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