JP4574302B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4574302B2
JP4574302B2 JP2004267800A JP2004267800A JP4574302B2 JP 4574302 B2 JP4574302 B2 JP 4574302B2 JP 2004267800 A JP2004267800 A JP 2004267800A JP 2004267800 A JP2004267800 A JP 2004267800A JP 4574302 B2 JP4574302 B2 JP 4574302B2
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Japan
Prior art keywords
probe
wafer
cleaning
semiconductor device
manufacturing
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Expired - Fee Related
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JP2004267800A
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Japanese (ja)
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JP2006086244A (ja
JP2006086244A5 (https=
Inventor
淳逸 小川
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Renesas Electronics Corp
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Renesas Electronics Corp
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Priority to JP2004267800A priority Critical patent/JP4574302B2/ja
Publication of JP2006086244A publication Critical patent/JP2006086244A/ja
Publication of JP2006086244A5 publication Critical patent/JP2006086244A5/ja
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Publication of JP4574302B2 publication Critical patent/JP4574302B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2004267800A 2004-09-15 2004-09-15 半導体装置の製造方法 Expired - Fee Related JP4574302B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004267800A JP4574302B2 (ja) 2004-09-15 2004-09-15 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004267800A JP4574302B2 (ja) 2004-09-15 2004-09-15 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2006086244A JP2006086244A (ja) 2006-03-30
JP2006086244A5 JP2006086244A5 (https=) 2007-10-25
JP4574302B2 true JP4574302B2 (ja) 2010-11-04

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ID=36164508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004267800A Expired - Fee Related JP4574302B2 (ja) 2004-09-15 2004-09-15 半導体装置の製造方法

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JP (1) JP4574302B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009115720A (ja) * 2007-11-08 2009-05-28 Japan Electronic Materials Corp プローブのクリーニング方法およびプローブのクリーニング装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840836A (ja) * 1981-09-03 1983-03-09 Seiko Epson Corp 半導体装置の製造方法
JPH0442944A (ja) * 1990-06-06 1992-02-13 Matsushita Electron Corp 半導体装置
JP2004228314A (ja) * 2003-01-22 2004-08-12 Renesas Technology Corp パッドを有する半導体装置

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Publication number Publication date
JP2006086244A (ja) 2006-03-30

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