JP4566266B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4566266B2
JP4566266B2 JP2009096178A JP2009096178A JP4566266B2 JP 4566266 B2 JP4566266 B2 JP 4566266B2 JP 2009096178 A JP2009096178 A JP 2009096178A JP 2009096178 A JP2009096178 A JP 2009096178A JP 4566266 B2 JP4566266 B2 JP 4566266B2
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Japan
Prior art keywords
sealing body
lead
semiconductor device
manufacturing
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2009096178A
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English (en)
Japanese (ja)
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JP2009158978A (ja
JP2009158978A5 (https=
Inventor
忠敏 団野
博美 田谷
嘉治 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2009096178A priority Critical patent/JP4566266B2/ja
Publication of JP2009158978A publication Critical patent/JP2009158978A/ja
Publication of JP2009158978A5 publication Critical patent/JP2009158978A5/ja
Application granted granted Critical
Publication of JP4566266B2 publication Critical patent/JP4566266B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2009096178A 2009-04-10 2009-04-10 半導体装置の製造方法 Expired - Lifetime JP4566266B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009096178A JP4566266B2 (ja) 2009-04-10 2009-04-10 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009096178A JP4566266B2 (ja) 2009-04-10 2009-04-10 半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003396996A Division JP2005159103A (ja) 2003-11-27 2003-11-27 半導体装置およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009226011A Division JP4535513B2 (ja) 2009-09-30 2009-09-30 半導体装置

Publications (3)

Publication Number Publication Date
JP2009158978A JP2009158978A (ja) 2009-07-16
JP2009158978A5 JP2009158978A5 (https=) 2009-11-19
JP4566266B2 true JP4566266B2 (ja) 2010-10-20

Family

ID=40962578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009096178A Expired - Lifetime JP4566266B2 (ja) 2009-04-10 2009-04-10 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4566266B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5947107B2 (ja) * 2012-05-23 2016-07-06 ルネサスエレクトロニクス株式会社 半導体装置
JP6986539B2 (ja) * 2019-11-25 2021-12-22 Ｔｏｗａ株式会社 樹脂成形済リードフレームの製造方法、樹脂成形品の製造方法、及びリードフレーム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61220361A (ja) * 1985-03-26 1986-09-30 Matsushita Electric Ind Co Ltd 電子部品の捺印及びフレ−ム切断機
JPH06232195A (ja) * 1993-01-28 1994-08-19 Rohm Co Ltd 半導体装置の製造方法およびリードフレーム
JP3547704B2 (ja) * 2000-06-22 2004-07-28 株式会社三井ハイテック リードフレーム及び半導体装置
JP3660861B2 (ja) * 2000-08-18 2005-06-15 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2003031753A (ja) * 2001-07-19 2003-01-31 Sony Corp 半導体装置及びその製造方法
JP2003158234A (ja) * 2001-11-21 2003-05-30 Hitachi Ltd 半導体装置及びその製造方法
JP3638136B2 (ja) * 2001-12-27 2005-04-13 株式会社三井ハイテック リードフレームおよびこれを用いた半導体装置

Also Published As

Publication number Publication date
JP2009158978A (ja) 2009-07-16

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