JP4566052B2 - 恒温維持装置。 - Google Patents

恒温維持装置。 Download PDF

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Publication number
JP4566052B2
JP4566052B2 JP2005110439A JP2005110439A JP4566052B2 JP 4566052 B2 JP4566052 B2 JP 4566052B2 JP 2005110439 A JP2005110439 A JP 2005110439A JP 2005110439 A JP2005110439 A JP 2005110439A JP 4566052 B2 JP4566052 B2 JP 4566052B2
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JP
Japan
Prior art keywords
temperature
cooler
circulating fluid
heater
cooling capacity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2005110439A
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English (en)
Japanese (ja)
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JP2006292204A (ja
Inventor
和重 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ATS Japan Corp
Original Assignee
ATS Japan Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ATS Japan Corp filed Critical ATS Japan Corp
Priority to JP2005110439A priority Critical patent/JP4566052B2/ja
Priority to KR1020050057886A priority patent/KR100646176B1/ko
Priority to US11/386,641 priority patent/US20060225876A1/en
Publication of JP2006292204A publication Critical patent/JP2006292204A/ja
Application granted granted Critical
Publication of JP4566052B2 publication Critical patent/JP4566052B2/ja
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/30—Expansion means; Dispositions thereof
    • F25B41/31—Expansion valves
    • F25B41/34—Expansion valves with the valve member being actuated by electric means, e.g. by piezoelectric actuators
    • F25B41/35—Expansion valves with the valve member being actuated by electric means, e.g. by piezoelectric actuators by rotary motors, e.g. by stepping motors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/04—Refrigeration circuit bypassing means
    • F25B2400/0403—Refrigeration circuit bypassing means for the condenser
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/04—Refrigeration circuit bypassing means
    • F25B2400/0409—Refrigeration circuit bypassing means for the evaporator
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/24—Storage receiver heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/02—Compressor control
    • F25B2600/021—Inverters therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21—Temperatures
    • F25B2700/2117—Temperatures of an evaporator
    • F25B2700/21171—Temperatures of an evaporator of the fluid cooled by the evaporator
    • F25B2700/21172—Temperatures of an evaporator of the fluid cooled by the evaporator at the inlet
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21—Temperatures
    • F25B2700/2117—Temperatures of an evaporator
    • F25B2700/21171—Temperatures of an evaporator of the fluid cooled by the evaporator
    • F25B2700/21173—Temperatures of an evaporator of the fluid cooled by the evaporator at the outlet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
JP2005110439A 2005-04-07 2005-04-07 恒温維持装置。 Active JP4566052B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005110439A JP4566052B2 (ja) 2005-04-07 2005-04-07 恒温維持装置。
KR1020050057886A KR100646176B1 (ko) 2005-04-07 2005-06-30 항온 유지 장치
US11/386,641 US20060225876A1 (en) 2005-04-07 2006-03-23 Constant temperature controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005110439A JP4566052B2 (ja) 2005-04-07 2005-04-07 恒温維持装置。

Publications (2)

Publication Number Publication Date
JP2006292204A JP2006292204A (ja) 2006-10-26
JP4566052B2 true JP4566052B2 (ja) 2010-10-20

Family

ID=37082064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005110439A Active JP4566052B2 (ja) 2005-04-07 2005-04-07 恒温維持装置。

Country Status (3)

Country Link
US (1) US20060225876A1 (ko)
JP (1) JP4566052B2 (ko)
KR (1) KR100646176B1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009174802A (ja) * 2008-01-25 2009-08-06 Okamura Corp 冷凍・冷蔵設備の集中管理システム
KR100876185B1 (ko) 2008-05-02 2008-12-31 주식회사 에이알 에너지 절약형 항온항습기와 그의 현열 냉각방법 및 냉각제습방법
US20100078156A1 (en) * 2008-09-29 2010-04-01 Power Integration Consulting, Inc. System and method for cooling an electrical device in a closed air volume
JP5641709B2 (ja) * 2009-04-23 2014-12-17 キヤノン株式会社 デバイス製造装置およびデバイス製造方法
JP5084794B2 (ja) * 2009-07-22 2012-11-28 住友重機械工業株式会社 クライオポンプ、及びクライオポンプの監視方法
JP5191969B2 (ja) 2009-09-30 2013-05-08 三菱重工コンプレッサ株式会社 ガス処理装置
US20120225395A1 (en) * 2011-03-01 2012-09-06 Haggerty Sean E Method and system for limiting water boiler heat input
CN102322715A (zh) * 2011-09-22 2012-01-18 合肥美的荣事达电冰箱有限公司 制冷系统的控制装置和具有其的制冷设备
CN102374711A (zh) * 2011-10-08 2012-03-14 合肥美的荣事达电冰箱有限公司 制冷系统和具有该制冷系统的冰箱
KR102207295B1 (ko) * 2014-02-12 2021-01-26 엘지전자 주식회사 냉장고, 냉장고의 온수공급시스템, 및 냉장고의 온수공급방법
TWI669492B (zh) 2015-06-05 2019-08-21 日商伸和控制工業股份有限公司 Environmental test device
CN105004110B (zh) * 2015-07-21 2018-01-30 三河同飞制冷股份有限公司 数控机床用带有热蒸汽补偿的变频温控系统
JP6537986B2 (ja) * 2016-01-26 2019-07-03 伸和コントロールズ株式会社 温度制御システム
US10731903B2 (en) * 2017-05-01 2020-08-04 Temptronic Corporation System and method for device under test cooling using digital scroll compressor
JP2021009590A (ja) * 2019-07-02 2021-01-28 株式会社Kelk 温度制御システム及び温度制御方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH024166A (ja) * 1988-06-21 1990-01-09 Daikin Ind Ltd 液体冷却装置の温度制御装置
JPH0989436A (ja) * 1995-09-25 1997-04-04 Shinwa Controls Kk ブラインの供給装置
JP2001165058A (ja) * 1999-12-14 2001-06-19 Daikin Ind Ltd 液体冷却装置の温度制御装置
JP2004502918A (ja) * 2000-07-11 2004-01-29 テンプトロニック　コーポレイション 冷媒を向け、循環温度制御流体を回収する、傾斜偏向面付き熱交換器を有するチャック
JP2004169933A (ja) * 2002-11-15 2004-06-17 Tokyo Electron Ltd 処理装置用のチラー制御方法及びチラー制御装置
JP2004198001A (ja) * 2002-12-17 2004-07-15 Daikin Ind Ltd 冷凍装置
JP2004353916A (ja) * 2003-05-28 2004-12-16 Takasago Thermal Eng Co Ltd 温度制御方法及び空調機

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH024166A (ja) * 1988-06-21 1990-01-09 Daikin Ind Ltd 液体冷却装置の温度制御装置
JPH0989436A (ja) * 1995-09-25 1997-04-04 Shinwa Controls Kk ブラインの供給装置
JP2001165058A (ja) * 1999-12-14 2001-06-19 Daikin Ind Ltd 液体冷却装置の温度制御装置
JP2004502918A (ja) * 2000-07-11 2004-01-29 テンプトロニック　コーポレイション 冷媒を向け、循環温度制御流体を回収する、傾斜偏向面付き熱交換器を有するチャック
JP2004169933A (ja) * 2002-11-15 2004-06-17 Tokyo Electron Ltd 処理装置用のチラー制御方法及びチラー制御装置
JP2004198001A (ja) * 2002-12-17 2004-07-15 Daikin Ind Ltd 冷凍装置
JP2004353916A (ja) * 2003-05-28 2004-12-16 Takasago Thermal Eng Co Ltd 温度制御方法及び空調機

Also Published As

Publication number Publication date
KR100646176B1 (ko) 2006-11-14
KR20060106557A (ko) 2006-10-12
US20060225876A1 (en) 2006-10-12
JP2006292204A (ja) 2006-10-26

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