JP4562868B2 - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

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Publication number
JP4562868B2
JP4562868B2 JP2000195163A JP2000195163A JP4562868B2 JP 4562868 B2 JP4562868 B2 JP 4562868B2 JP 2000195163 A JP2000195163 A JP 2000195163A JP 2000195163 A JP2000195163 A JP 2000195163A JP 4562868 B2 JP4562868 B2 JP 4562868B2
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impurity
film
region
semiconductor
display device
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Japanese (ja)
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JP2002016116A5 (enExample
JP2002016116A (ja
Inventor
敦生 磯部
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Thin Film Transistor (AREA)
  • Recrystallisation Techniques (AREA)
JP2000195163A 2000-06-28 2000-06-28 半導体装置の作製方法 Expired - Fee Related JP4562868B2 (ja)

Priority Applications (1)

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JP2000195163A JP4562868B2 (ja) 2000-06-28 2000-06-28 半導体装置の作製方法

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Application Number Priority Date Filing Date Title
JP2000195163A JP4562868B2 (ja) 2000-06-28 2000-06-28 半導体装置の作製方法

Publications (3)

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JP2002016116A JP2002016116A (ja) 2002-01-18
JP2002016116A5 JP2002016116A5 (enExample) 2007-07-05
JP4562868B2 true JP4562868B2 (ja) 2010-10-13

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JP2000195163A Expired - Fee Related JP4562868B2 (ja) 2000-06-28 2000-06-28 半導体装置の作製方法

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4641717B2 (ja) * 2002-12-16 2011-03-02 株式会社半導体エネルギー研究所 半導体装置の評価方法及び素子基板
JP6579086B2 (ja) * 2016-11-15 2019-09-25 信越半導体株式会社 デバイス形成方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204244A (ja) * 1992-12-28 1994-07-22 Sony Corp 半導体装置の製造方法
JP3146113B2 (ja) * 1994-08-30 2001-03-12 シャープ株式会社 薄膜トランジスタの製造方法および液晶表示装置
JP3998765B2 (ja) * 1997-09-04 2007-10-31 シャープ株式会社 多結晶半導体層の製造方法及び半導体装置の評価方法
US6151119A (en) * 1997-12-19 2000-11-21 Advanced Micro Devices Apparatus and method for determining depth profile characteristics of a dopant material in a semiconductor device
JP3658213B2 (ja) * 1998-11-19 2005-06-08 富士通株式会社 半導体装置の製造方法

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JP2002016116A (ja) 2002-01-18

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