JP4557821B2 - 微小粒子の配置装置および方法 - Google Patents

微小粒子の配置装置および方法 Download PDF

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Publication number
JP4557821B2
JP4557821B2 JP2005191621A JP2005191621A JP4557821B2 JP 4557821 B2 JP4557821 B2 JP 4557821B2 JP 2005191621 A JP2005191621 A JP 2005191621A JP 2005191621 A JP2005191621 A JP 2005191621A JP 4557821 B2 JP4557821 B2 JP 4557821B2
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head
inner circle
fine particles
mask
moving
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JP2005191621A
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English (en)
Japanese (ja)
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JP2006019741A (ja
JP2006019741A5 (https=
Inventor
徹 根橋
茂明 川上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Athlete FA Corp
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Athlete FA Corp
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Priority to JP2005191621A priority Critical patent/JP4557821B2/ja
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Publication of JP2006019741A5 publication Critical patent/JP2006019741A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2005191621A 2005-06-30 2005-06-30 微小粒子の配置装置および方法 Expired - Lifetime JP4557821B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005191621A JP4557821B2 (ja) 2005-06-30 2005-06-30 微小粒子の配置装置および方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005191621A JP4557821B2 (ja) 2005-06-30 2005-06-30 微小粒子の配置装置および方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004192364 Division 2004-06-30 2004-06-30

Publications (3)

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JP2006019741A JP2006019741A (ja) 2006-01-19
JP2006019741A5 JP2006019741A5 (https=) 2007-07-26
JP4557821B2 true JP4557821B2 (ja) 2010-10-06

Family

ID=35793645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005191621A Expired - Lifetime JP4557821B2 (ja) 2005-06-30 2005-06-30 微小粒子の配置装置および方法

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JP (1) JP4557821B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408756B (zh) * 2006-07-12 2013-09-11 愛立發股份有限公司 Ball filling device and method
JP4797883B2 (ja) * 2006-08-22 2011-10-19 株式会社デンソー 部品の実装方法
JP4828595B2 (ja) 2007-12-19 2011-11-30 新光電気工業株式会社 導電性ボール除去方法及び導電性ボール除去装置
JP5376827B2 (ja) * 2008-04-30 2013-12-25 アスリートＦａ株式会社 ボール搭載装置およびボール搭載方法
JP5141966B2 (ja) * 2008-05-22 2013-02-13 澁谷工業株式会社 微小ボール配列装置
JP4973633B2 (ja) * 2008-09-24 2012-07-11 株式会社日立プラントテクノロジー ハンダボール印刷装置
JP2014165455A (ja) * 2013-02-27 2014-09-08 Shibuya Kogyo Co Ltd 導電性ボールの搭載状態検査装置
CN115527892A (zh) * 2022-06-24 2022-12-27 江苏长晟半导体科技有限公司 一体式全自动植球机

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3271482B2 (ja) * 1994-08-30 2002-04-02 松下電器産業株式会社 半田ボール搭載装置及び半田ボール搭載方法
JP3606191B2 (ja) * 2000-10-25 2005-01-05 松下電器産業株式会社 導電性ボールの整列装置および搭載装置
JP3854859B2 (ja) * 2001-12-11 2006-12-06 日立ビアメカニクス株式会社 導電性ボール搭載装置
JP3635068B2 (ja) * 2002-03-06 2005-03-30 株式会社日立製作所 バンプ形成装置
JP2004031585A (ja) * 2002-06-25 2004-01-29 Nippon Steel Corp 導電性ボールの搭載装置

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Publication number Publication date
JP2006019741A (ja) 2006-01-19

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