JP4551474B2 - 半導体集積回路 - Google Patents

半導体集積回路 Download PDF

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Publication number
JP4551474B2
JP4551474B2 JP2008522264A JP2008522264A JP4551474B2 JP 4551474 B2 JP4551474 B2 JP 4551474B2 JP 2008522264 A JP2008522264 A JP 2008522264A JP 2008522264 A JP2008522264 A JP 2008522264A JP 4551474 B2 JP4551474 B2 JP 4551474B2
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Japan
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unit
valid
block
power
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JP2008522264A
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Japanese (ja)
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JPWO2008001461A1 (ja
Inventor
誠一 西島
巌 杉山
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Fujitsu Ltd
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Fujitsu Ltd
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0008—Arrangements for reducing power consumption
    • H03K19/0016—Arrangements for reducing power consumption by using a control or a clock signal, e.g. in order to apply power supply

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Power Sources (AREA)
  • Logic Circuits (AREA)
JP2008522264A 2006-06-30 2006-06-30 半導体集積回路 Expired - Fee Related JP4551474B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/313099 WO2008001461A1 (fr) 2006-06-30 2006-06-30 Circuit intégré à semi-conducteurs

Publications (2)

Publication Number Publication Date
JPWO2008001461A1 JPWO2008001461A1 (ja) 2009-11-26
JP4551474B2 true JP4551474B2 (ja) 2010-09-29

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ID=38845236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008522264A Expired - Fee Related JP4551474B2 (ja) 2006-06-30 2006-06-30 半導体集積回路

Country Status (2)

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JP (1) JP4551474B2 (fr)
WO (1) WO2008001461A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8989100B2 (en) 2011-03-30 2015-03-24 Panasonic Corporation Wireless communication device and semiconductor device
US11994438B2 (en) 2020-09-09 2024-05-28 Kabushiki Kaisha Toshiba Communication device and tire pressure monitoring system

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5228600B2 (ja) * 2008-04-23 2013-07-03 日本電気株式会社 情報通信機器、低消費電力回路及びそれらに用いる消費電力削減方法
JP5703605B2 (ja) * 2010-06-28 2015-04-22 富士通セミコンダクター株式会社 半導体集積回路
US11116263B2 (en) 2013-11-21 2021-09-14 Medline Industries, Inc. Gown for self-donning while maintaining sterility and methods therefor
US20160006433A1 (en) * 2014-07-04 2016-01-07 Semiconductor Energy Laboratory Co.,Ltd. Semiconductor device and electronic device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06196997A (ja) * 1991-08-06 1994-07-15 American Teleph & Telegr Co <Att> データ出力装置とその方法および記憶装置
WO2002065642A1 (fr) * 2001-02-15 2002-08-22 Hitachi,Ltd Circuit integre a semi-conducteurs, systeme de traitement de donnees et appareil de terminal mobile de communication
JP2003124794A (ja) * 2001-10-10 2003-04-25 Sharp Corp 半導体集積回路およびそれを用いた半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06196997A (ja) * 1991-08-06 1994-07-15 American Teleph & Telegr Co <Att> データ出力装置とその方法および記憶装置
WO2002065642A1 (fr) * 2001-02-15 2002-08-22 Hitachi,Ltd Circuit integre a semi-conducteurs, systeme de traitement de donnees et appareil de terminal mobile de communication
JP2003124794A (ja) * 2001-10-10 2003-04-25 Sharp Corp 半導体集積回路およびそれを用いた半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8989100B2 (en) 2011-03-30 2015-03-24 Panasonic Corporation Wireless communication device and semiconductor device
US11994438B2 (en) 2020-09-09 2024-05-28 Kabushiki Kaisha Toshiba Communication device and tire pressure monitoring system

Also Published As

Publication number Publication date
WO2008001461A1 (fr) 2008-01-03
JPWO2008001461A1 (ja) 2009-11-26

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