JP4542437B2 - 電子部品及びその製造方法 - Google Patents

電子部品及びその製造方法 Download PDF

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Publication number
JP4542437B2
JP4542437B2 JP2005008507A JP2005008507A JP4542437B2 JP 4542437 B2 JP4542437 B2 JP 4542437B2 JP 2005008507 A JP2005008507 A JP 2005008507A JP 2005008507 A JP2005008507 A JP 2005008507A JP 4542437 B2 JP4542437 B2 JP 4542437B2
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JP
Japan
Prior art keywords
metal lid
package
brazing material
electronic component
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005008507A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006196799A (ja
JP2006196799A5 (enExample
Inventor
薫 先灘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Media Devices Ltd
Original Assignee
Fujitsu Media Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Media Devices Ltd filed Critical Fujitsu Media Devices Ltd
Priority to JP2005008507A priority Critical patent/JP4542437B2/ja
Publication of JP2006196799A publication Critical patent/JP2006196799A/ja
Publication of JP2006196799A5 publication Critical patent/JP2006196799A5/ja
Application granted granted Critical
Publication of JP4542437B2 publication Critical patent/JP4542437B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2005008507A 2005-01-17 2005-01-17 電子部品及びその製造方法 Expired - Fee Related JP4542437B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005008507A JP4542437B2 (ja) 2005-01-17 2005-01-17 電子部品及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005008507A JP4542437B2 (ja) 2005-01-17 2005-01-17 電子部品及びその製造方法

Publications (3)

Publication Number Publication Date
JP2006196799A JP2006196799A (ja) 2006-07-27
JP2006196799A5 JP2006196799A5 (enExample) 2007-06-28
JP4542437B2 true JP4542437B2 (ja) 2010-09-15

Family

ID=36802610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005008507A Expired - Fee Related JP4542437B2 (ja) 2005-01-17 2005-01-17 電子部品及びその製造方法

Country Status (1)

Country Link
JP (1) JP4542437B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BRPI0619974B1 (pt) 2005-12-15 2019-02-19 International Business Machines Corporation Identificador de radiofrequência, método e aparelho para autenticação de itens
JP6374675B2 (ja) * 2014-03-05 2018-08-15 太陽誘電株式会社 電子デバイス及びその製造方法
JP6869698B2 (ja) * 2016-11-04 2021-05-12 太陽誘電株式会社 電子デバイス
JP7174242B2 (ja) * 2018-06-15 2022-11-17 日亜化学工業株式会社 半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0266962A (ja) * 1988-08-31 1990-03-07 Mitsui Petrochem Ind Ltd 半導体装置の製造方法
JP2001185986A (ja) * 1999-12-22 2001-07-06 Seiko Epson Corp 圧電振動子及び圧電発振器とこれらの封止方法
JP4710149B2 (ja) * 2001-02-26 2011-06-29 株式会社村田製作所 電子部品パッケージおよびその製造方法
JP2004297554A (ja) * 2003-03-27 2004-10-21 Seiko Epson Corp 圧電発振器及び圧電発振器を利用した携帯電話装置および圧電発振器を利用した電子機器

Also Published As

Publication number Publication date
JP2006196799A (ja) 2006-07-27

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