JP4540415B2 - 音響整合部材の製造方法 - Google Patents

音響整合部材の製造方法 Download PDF

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Publication number
JP4540415B2
JP4540415B2 JP2004209277A JP2004209277A JP4540415B2 JP 4540415 B2 JP4540415 B2 JP 4540415B2 JP 2004209277 A JP2004209277 A JP 2004209277A JP 2004209277 A JP2004209277 A JP 2004209277A JP 4540415 B2 JP4540415 B2 JP 4540415B2
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Japan
Prior art keywords
film
acoustic matching
matching member
mold
hole
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JP2004209277A
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Japanese (ja)
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JP2006029982A (ja
JP2006029982A5 (enExample
Inventor
良文 田口
善一 谷垣
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2004209277A priority Critical patent/JP4540415B2/ja
Publication of JP2006029982A publication Critical patent/JP2006029982A/ja
Publication of JP2006029982A5 publication Critical patent/JP2006029982A5/ja
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JP2004209277A 2004-07-16 2004-07-16 音響整合部材の製造方法 Expired - Fee Related JP4540415B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004209277A JP4540415B2 (ja) 2004-07-16 2004-07-16 音響整合部材の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004209277A JP4540415B2 (ja) 2004-07-16 2004-07-16 音響整合部材の製造方法

Publications (3)

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JP2006029982A JP2006029982A (ja) 2006-02-02
JP2006029982A5 JP2006029982A5 (enExample) 2007-06-28
JP4540415B2 true JP4540415B2 (ja) 2010-09-08

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JP2004209277A Expired - Fee Related JP4540415B2 (ja) 2004-07-16 2004-07-16 音響整合部材の製造方法

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8043957B2 (en) 2006-05-17 2011-10-25 Nec Corporation Semiconductor device, method for manufacturing semiconductor device and apparatus for manufacturing semiconductor
US20100256502A1 (en) * 2009-04-06 2010-10-07 General Electric Company Materials and processes for bonding acoustically neutral structures for use in ultrasound catheters

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06101880B2 (ja) * 1986-12-15 1994-12-12 株式会社村田製作所 空中超音波トランスジユ−サの製造方法
NL9400119A (nl) * 1994-01-27 1995-09-01 3P Licensing Bv Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze.
JP2002058099A (ja) * 2000-08-11 2002-02-22 Murata Mfg Co Ltd 音響整合層の製造方法、及びそれを用いて製造された音響整合層、及びそれを用いた超音波センサ、及びそれを用いた電子装置
JP3610945B2 (ja) * 2001-11-30 2005-01-19 松下電器産業株式会社 整合部材の製造方法
JP4082165B2 (ja) * 2002-10-07 2008-04-30 松下電器産業株式会社 整合部材の製造方法およびそれを用いた超音波センサ
JP4140359B2 (ja) * 2002-11-27 2008-08-27 松下電器産業株式会社 超音波振動子用整合部材およびそれを用いた超音波センサ

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