JP4540415B2 - 音響整合部材の製造方法 - Google Patents
音響整合部材の製造方法 Download PDFInfo
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- JP4540415B2 JP4540415B2 JP2004209277A JP2004209277A JP4540415B2 JP 4540415 B2 JP4540415 B2 JP 4540415B2 JP 2004209277 A JP2004209277 A JP 2004209277A JP 2004209277 A JP2004209277 A JP 2004209277A JP 4540415 B2 JP4540415 B2 JP 4540415B2
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004209277A JP4540415B2 (ja) | 2004-07-16 | 2004-07-16 | 音響整合部材の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004209277A JP4540415B2 (ja) | 2004-07-16 | 2004-07-16 | 音響整合部材の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006029982A JP2006029982A (ja) | 2006-02-02 |
| JP2006029982A5 JP2006029982A5 (enExample) | 2007-06-28 |
| JP4540415B2 true JP4540415B2 (ja) | 2010-09-08 |
Family
ID=35896524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004209277A Expired - Fee Related JP4540415B2 (ja) | 2004-07-16 | 2004-07-16 | 音響整合部材の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4540415B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8043957B2 (en) | 2006-05-17 | 2011-10-25 | Nec Corporation | Semiconductor device, method for manufacturing semiconductor device and apparatus for manufacturing semiconductor |
| US20100256502A1 (en) * | 2009-04-06 | 2010-10-07 | General Electric Company | Materials and processes for bonding acoustically neutral structures for use in ultrasound catheters |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06101880B2 (ja) * | 1986-12-15 | 1994-12-12 | 株式会社村田製作所 | 空中超音波トランスジユ−サの製造方法 |
| NL9400119A (nl) * | 1994-01-27 | 1995-09-01 | 3P Licensing Bv | Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze. |
| JP2002058099A (ja) * | 2000-08-11 | 2002-02-22 | Murata Mfg Co Ltd | 音響整合層の製造方法、及びそれを用いて製造された音響整合層、及びそれを用いた超音波センサ、及びそれを用いた電子装置 |
| JP3610945B2 (ja) * | 2001-11-30 | 2005-01-19 | 松下電器産業株式会社 | 整合部材の製造方法 |
| JP4082165B2 (ja) * | 2002-10-07 | 2008-04-30 | 松下電器産業株式会社 | 整合部材の製造方法およびそれを用いた超音波センサ |
| JP4140359B2 (ja) * | 2002-11-27 | 2008-08-27 | 松下電器産業株式会社 | 超音波振動子用整合部材およびそれを用いた超音波センサ |
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2004
- 2004-07-16 JP JP2004209277A patent/JP4540415B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006029982A (ja) | 2006-02-02 |
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