JP4538474B2 - インバータ装置 - Google Patents

インバータ装置 Download PDF

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Publication number
JP4538474B2
JP4538474B2 JP2007203754A JP2007203754A JP4538474B2 JP 4538474 B2 JP4538474 B2 JP 4538474B2 JP 2007203754 A JP2007203754 A JP 2007203754A JP 2007203754 A JP2007203754 A JP 2007203754A JP 4538474 B2 JP4538474 B2 JP 4538474B2
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JP
Japan
Prior art keywords
capacitor
electrode side
positive
negative electrode
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007203754A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008004953A5 (enExample
JP2008004953A (ja
Inventor
光一 八幡
欣也 中津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Priority to JP2007203754A priority Critical patent/JP4538474B2/ja
Publication of JP2008004953A publication Critical patent/JP2008004953A/ja
Publication of JP2008004953A5 publication Critical patent/JP2008004953A5/ja
Application granted granted Critical
Publication of JP4538474B2 publication Critical patent/JP4538474B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Inverter Devices (AREA)
JP2007203754A 2007-08-06 2007-08-06 インバータ装置 Expired - Fee Related JP4538474B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007203754A JP4538474B2 (ja) 2007-08-06 2007-08-06 インバータ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007203754A JP4538474B2 (ja) 2007-08-06 2007-08-06 インバータ装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003127641A Division JP4055643B2 (ja) 2003-05-06 2003-05-06 インバータ装置

Publications (3)

Publication Number Publication Date
JP2008004953A JP2008004953A (ja) 2008-01-10
JP2008004953A5 JP2008004953A5 (enExample) 2008-02-21
JP4538474B2 true JP4538474B2 (ja) 2010-09-08

Family

ID=39009032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007203754A Expired - Fee Related JP4538474B2 (ja) 2007-08-06 2007-08-06 インバータ装置

Country Status (1)

Country Link
JP (1) JP4538474B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5292823B2 (ja) * 2008-01-22 2013-09-18 日産自動車株式会社 電力変換装置
JP5352113B2 (ja) * 2008-04-22 2013-11-27 トヨタ自動車株式会社 インバータモジュール
JP5184218B2 (ja) * 2008-06-02 2013-04-17 本田技研工業株式会社 コンデンサ搭載型インバータユニット
DE102009017621B3 (de) * 2009-04-16 2010-08-19 Semikron Elektronik Gmbh & Co. Kg Vorrichtung zur Verringerung der Störabstrahlung in einem leistungselektronischen System
JP5289348B2 (ja) * 2010-01-22 2013-09-11 三菱電機株式会社 車載用電力変換装置
JP5652370B2 (ja) * 2011-03-30 2015-01-14 株式会社デンソー 電力変換装置
WO2016027557A1 (ja) 2014-08-22 2016-02-25 三菱電機株式会社 電力変換装置
US10790758B2 (en) * 2018-03-08 2020-09-29 Chongqing Jinkang New Energy Vehicle Co., Ltd. Power converter for electric vehicle drive systems
JP7279847B2 (ja) * 2020-03-05 2023-05-23 富士電機株式会社 電力変換装置
CN114551391A (zh) * 2022-01-17 2022-05-27 致瞻科技(上海)有限公司 一种低电磁干扰的功率半导体模块的封装架构

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60171754A (ja) * 1984-02-17 1985-09-05 Sumitomo Electric Ind Ltd 回路素子付半導体チツプキヤリア
JPH01108751A (ja) * 1987-10-21 1989-04-26 Nec Corp 集積回路装置
JPH1189248A (ja) * 1997-09-02 1999-03-30 Denso Corp 電力制御装置
EP1231639B1 (en) * 2000-08-18 2008-10-22 Mitsubishi Denki Kabushiki Kaisha Power module
JP2003110090A (ja) * 2001-07-09 2003-04-11 Daikin Ind Ltd パワーモジュールおよび空気調和機

Also Published As

Publication number Publication date
JP2008004953A (ja) 2008-01-10

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