JP4525914B2 - 付加硬化型シリコーンゴム組成物及び粘着ゴムシート - Google Patents

付加硬化型シリコーンゴム組成物及び粘着ゴムシート Download PDF

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Publication number
JP4525914B2
JP4525914B2 JP2005037444A JP2005037444A JP4525914B2 JP 4525914 B2 JP4525914 B2 JP 4525914B2 JP 2005037444 A JP2005037444 A JP 2005037444A JP 2005037444 A JP2005037444 A JP 2005037444A JP 4525914 B2 JP4525914 B2 JP 4525914B2
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JP
Japan
Prior art keywords
parts
silicone rubber
mass
sio
addition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005037444A
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English (en)
Japanese (ja)
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JP2006225420A (ja
Inventor
典行 廻谷
勉 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP2005037444A priority Critical patent/JP4525914B2/ja
Priority to KR1020060014045A priority patent/KR101225391B1/ko
Priority to TW095104939A priority patent/TW200641055A/zh
Publication of JP2006225420A publication Critical patent/JP2006225420A/ja
Application granted granted Critical
Publication of JP4525914B2 publication Critical patent/JP4525914B2/ja
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2005037444A 2005-02-15 2005-02-15 付加硬化型シリコーンゴム組成物及び粘着ゴムシート Expired - Fee Related JP4525914B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005037444A JP4525914B2 (ja) 2005-02-15 2005-02-15 付加硬化型シリコーンゴム組成物及び粘着ゴムシート
KR1020060014045A KR101225391B1 (ko) 2005-02-15 2006-02-14 부가 경화형 실리콘 고무 조성물 및 점착 고무 시트
TW095104939A TW200641055A (en) 2005-02-15 2006-02-14 Addition-curable silicone rubber composition and pressure-sensitive adhesive rubber sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005037444A JP4525914B2 (ja) 2005-02-15 2005-02-15 付加硬化型シリコーンゴム組成物及び粘着ゴムシート

Publications (2)

Publication Number Publication Date
JP2006225420A JP2006225420A (ja) 2006-08-31
JP4525914B2 true JP4525914B2 (ja) 2010-08-18

Family

ID=36987076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005037444A Expired - Fee Related JP4525914B2 (ja) 2005-02-15 2005-02-15 付加硬化型シリコーンゴム組成物及び粘着ゴムシート

Country Status (3)

Country Link
JP (1) JP4525914B2 (enExample)
KR (1) KR101225391B1 (enExample)
TW (1) TW200641055A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100839780B1 (ko) * 2006-01-18 2008-06-19 주식회사 엘지화학 유연성 기판 반송용 점착제
KR100831562B1 (ko) 2006-03-23 2008-05-21 주식회사 엘지화학 유연성 기판 반송용 점착제 조성물
KR100804359B1 (ko) * 2006-12-04 2008-02-15 엘에스전선 주식회사 자동차용 고무호스
JP2008247812A (ja) * 2007-03-30 2008-10-16 Gc Corp シリコーン組成物
JP5243775B2 (ja) * 2007-11-14 2013-07-24 東海ゴム工業株式会社 誘電膜およびそれを用いたアクチュエータ、センサ、トランスデューサ
DE102009011164A1 (de) * 2009-03-04 2010-09-09 Tesa Se Klebeband, insbesondere zur Verklebung von Photovoltaiklaminaten
US9840594B2 (en) 2014-01-31 2017-12-12 Shin-Etsu Chemical Co., Ltd. Organopolysiloxane compound and method for producing the same, and addition-curable silicone composition
JP6733241B2 (ja) 2016-03-18 2020-07-29 信越化学工業株式会社 付加硬化性シリコーンゴム組成物、その製造方法及び硬化物
WO2018079376A1 (ja) * 2016-10-28 2018-05-03 信越化学工業株式会社 耐熱性ミラブル型シリコーンゴム組成物
US11987731B2 (en) 2018-08-10 2024-05-21 Dow Toray Co., Ltd. Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same
WO2020032286A1 (ja) 2018-08-10 2020-02-13 ダウ・東レ株式会社 感圧接着層形成性オルガノポリシロキサン組成物およびその使用
WO2020032287A1 (ja) 2018-08-10 2020-02-13 ダウ・東レ株式会社 感圧接着層形成性オルガノポリシロキサン組成物およびその使用
WO2020039372A1 (en) * 2018-08-23 2020-02-27 3M Innovative Properties Company Tackified and filled silicone adhesive compositions
WO2021029412A1 (ja) 2019-08-13 2021-02-18 ダウ・東レ株式会社 感圧接着層形成性オルガノポリシロキサン組成物およびその使用
CN114341294B (zh) 2019-08-13 2024-05-28 陶氏东丽株式会社 压敏粘接层形成性聚有机硅氧烷组合物及其使用
US20220282141A1 (en) 2019-08-13 2022-09-08 Dow Toray Co., Ltd. Organopolysiloxane composition having pressure-sensitive adhesive layer formation properties, and use of said composition
EP4065641A4 (en) * 2019-11-25 2023-08-02 Dow Silicones Corporation FIRE RETARDANT POLYSILOXANE COMPOSITION

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082886A (en) * 1989-08-28 1992-01-21 General Electric Company Low compression set, oil and fuel resistant, liquid injection moldable, silicone rubber
JP3712054B2 (ja) * 2001-04-13 2005-11-02 信越化学工業株式会社 固体高分子型燃料電池セパレータ用シール材料
JP4140758B2 (ja) * 2002-08-08 2008-08-27 大日本印刷株式会社 オフセット印刷用ブランケット及びオフセット印刷方法
JP3912525B2 (ja) * 2002-12-12 2007-05-09 信越化学工業株式会社 付加硬化型シリコーンゴム組成物及び粘着ゴムシート

Also Published As

Publication number Publication date
JP2006225420A (ja) 2006-08-31
TWI379870B (enExample) 2012-12-21
KR20060092089A (ko) 2006-08-22
TW200641055A (en) 2006-12-01
KR101225391B1 (ko) 2013-01-22

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