JP4525597B2 - 表面実装型圧電デバイス、及びその製造方法 - Google Patents

表面実装型圧電デバイス、及びその製造方法 Download PDF

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Publication number
JP4525597B2
JP4525597B2 JP2006004481A JP2006004481A JP4525597B2 JP 4525597 B2 JP4525597 B2 JP 4525597B2 JP 2006004481 A JP2006004481 A JP 2006004481A JP 2006004481 A JP2006004481 A JP 2006004481A JP 4525597 B2 JP4525597 B2 JP 4525597B2
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Prior art keywords
component
mounting
insulating substrate
base material
piezoelectric device
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JP2006004481A
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Japanese (ja)
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JP2007189379A5 (enrdf_load_stackoverflow
JP2007189379A (ja
Inventor
匡亨 石川
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Miyazaki Epson Corp
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Epson Toyocom Corp
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JP2006004481A 2006-01-12 2006-01-12 表面実装型圧電デバイス、及びその製造方法 Expired - Fee Related JP4525597B2 (ja)

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JP2006004481A JP4525597B2 (ja) 2006-01-12 2006-01-12 表面実装型圧電デバイス、及びその製造方法

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JP2006004481A JP4525597B2 (ja) 2006-01-12 2006-01-12 表面実装型圧電デバイス、及びその製造方法

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JP2007189379A JP2007189379A (ja) 2007-07-26
JP2007189379A5 JP2007189379A5 (enrdf_load_stackoverflow) 2008-02-28
JP4525597B2 true JP4525597B2 (ja) 2010-08-18

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JP2006004481A Expired - Fee Related JP4525597B2 (ja) 2006-01-12 2006-01-12 表面実装型圧電デバイス、及びその製造方法

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5220584B2 (ja) * 2008-12-27 2013-06-26 京セラクリスタルデバイス株式会社 圧電発振器及びその製造方法
CN111224635B (zh) * 2018-11-27 2024-01-19 京瓷株式会社 压电器件以及电子设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03162676A (ja) * 1989-08-28 1991-07-12 Mitsubishi Electric Corp 液体封止半導体装置
JP2003218178A (ja) * 2002-01-25 2003-07-31 Matsushita Electric Ind Co Ltd 半導体装置および半導体チップ
JP4204873B2 (ja) * 2003-01-22 2009-01-07 東京電波株式会社 圧電発振器の製造方法
JP4091868B2 (ja) * 2003-03-27 2008-05-28 京セラ株式会社 表面実装型温度補償水晶発振器
JP2004304447A (ja) * 2003-03-31 2004-10-28 Kyocera Kinseki Corp 半導体ウエハとそのウエハを用いた圧電発振器の製造方法
JP4524659B2 (ja) * 2005-09-26 2010-08-18 エプソントヨコム株式会社 表面実装型圧電モジュール用パッケージ、及び表面実装型圧電モジュール

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