JP4525571B2 - ウェハ保持体およびそれを搭載したヒータユニット、ウェハプローバ - Google Patents
ウェハ保持体およびそれを搭載したヒータユニット、ウェハプローバ Download PDFInfo
- Publication number
- JP4525571B2 JP4525571B2 JP2005338255A JP2005338255A JP4525571B2 JP 4525571 B2 JP4525571 B2 JP 4525571B2 JP 2005338255 A JP2005338255 A JP 2005338255A JP 2005338255 A JP2005338255 A JP 2005338255A JP 4525571 B2 JP4525571 B2 JP 4525571B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holding member
- mounting table
- cooling module
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001816 cooling Methods 0.000 claims description 83
- 238000010438 heat treatment Methods 0.000 claims description 45
- 238000001179 sorption measurement Methods 0.000 claims 2
- 239000000463 material Substances 0.000 description 32
- 238000007747 plating Methods 0.000 description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 24
- 239000010949 copper Substances 0.000 description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 23
- 229910052802 copper Inorganic materials 0.000 description 23
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 22
- 238000012545 processing Methods 0.000 description 20
- 239000000758 substrate Substances 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 12
- 229910052759 nickel Inorganic materials 0.000 description 12
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 11
- 229910010271 silicon carbide Inorganic materials 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 239000002131 composite material Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 239000000523 sample Substances 0.000 description 9
- 239000010935 stainless steel Substances 0.000 description 9
- 229910001220 stainless steel Inorganic materials 0.000 description 9
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 239000003507 refrigerant Substances 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 7
- 239000010937 tungsten Substances 0.000 description 7
- 229910052721 tungsten Inorganic materials 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 238000007751 thermal spraying Methods 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 239000011733 molybdenum Substances 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000010297 mechanical methods and process Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000007779 soft material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 229910001120 nichrome Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010409 ironing Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
2 載置台
3 保持部材
4 支持部材
5 冷却モジュール
6 加熱体
10 穴
11 溝
41 柱状部材
42 平坦部
43 支柱
61 抵抗発熱体
62 絶縁体
Claims (4)
- ウェハを載置するための載置面を有する載置台と、前記載置台を保持する保持部材とから構成されるウェハプローバ用のウェハ保持体において、前記載置台の載置面に被載置物を吸着するための吸着孔が形成されていると共に、前記載置台の載置面と反対側の面に前記保持部材を吸着するための吸着孔が形成されており、前記保持部材の下面側に冷却モジュールと発熱体とを有し、前記保持部材の下部に該保持部材を支持する複数の柱状部材を有する支持部材を備え、前記載置台の熱伝導率をK1、ヤング率をY1、前記保持部材の熱伝導率をK2、ヤング率をY2、前記支持部材の熱伝導率をK3としたとき、K1>K2>K3かつY1<Y2であることを特徴とするウェハプローバ用のウェハ保持体。
- 前記保持部材の下面側に、冷却モジュールを有し、更にその下に発熱体を有することを特徴とする請求項1に記載のウェハプローバ用のウェハ保持体。
- 請求項1又は2に記載したウェハ保持体を備えたことを特徴とするウェハプローバ用のヒータユニット。
- 請求項3に記載のヒータユニットを備えたウェハプローバ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005338255A JP4525571B2 (ja) | 2005-11-24 | 2005-11-24 | ウェハ保持体およびそれを搭載したヒータユニット、ウェハプローバ |
US11/603,233 US20070126457A1 (en) | 2005-11-24 | 2006-11-22 | Wafer holder, and heating unit and wafer prober provided with the wafer holder |
TW095143635A TW200746342A (en) | 2005-11-24 | 2006-11-24 | Wafer holder for wafer prober and heater unit/wafer prober equipped with the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005338255A JP4525571B2 (ja) | 2005-11-24 | 2005-11-24 | ウェハ保持体およびそれを搭載したヒータユニット、ウェハプローバ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007149727A JP2007149727A (ja) | 2007-06-14 |
JP4525571B2 true JP4525571B2 (ja) | 2010-08-18 |
Family
ID=38118065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005338255A Active JP4525571B2 (ja) | 2005-11-24 | 2005-11-24 | ウェハ保持体およびそれを搭載したヒータユニット、ウェハプローバ |
Country Status (3)
Country | Link |
---|---|
US (1) | US20070126457A1 (ja) |
JP (1) | JP4525571B2 (ja) |
TW (1) | TW200746342A (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5061751B2 (ja) * | 2007-06-26 | 2012-10-31 | 住友電気工業株式会社 | ウェハプローバ用ウェハ保持体 |
JP2010114208A (ja) * | 2008-11-05 | 2010-05-20 | Nikon Corp | 冷却装置および接合システム |
JP6003060B2 (ja) * | 2012-01-06 | 2016-10-05 | 住友電気工業株式会社 | ウエハプローバ用ウエハ保持体 |
EP3279929A1 (en) * | 2015-03-31 | 2018-02-07 | Shindengen Electric Manufacturing Co., Ltd. | Pressurization unit |
WO2022123846A1 (ja) | 2020-12-11 | 2022-06-16 | 株式会社巴川製紙所 | 温調ユニット |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001033484A (ja) * | 1999-07-15 | 2001-02-09 | Ibiden Co Ltd | ウエハプローバ |
JP2003163244A (ja) * | 2001-11-28 | 2003-06-06 | Taiheiyo Cement Corp | ウェハプローバ |
JP2004063486A (ja) * | 2002-07-24 | 2004-02-26 | Tokyo Seimitsu Co Ltd | プローバのチャック機構 |
JP2005302855A (ja) * | 2004-04-08 | 2005-10-27 | Sumitomo Electric Ind Ltd | 半導体加熱装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5610529A (en) * | 1995-04-28 | 1997-03-11 | Cascade Microtech, Inc. | Probe station having conductive coating added to thermal chuck insulator |
US6504393B1 (en) * | 1997-07-15 | 2003-01-07 | Applied Materials, Inc. | Methods and apparatus for testing semiconductor and integrated circuit structures |
US6073681A (en) * | 1997-12-31 | 2000-06-13 | Temptronic Corporation | Workpiece chuck |
JP2002043381A (ja) * | 2000-07-19 | 2002-02-08 | Tokyo Electron Ltd | ウエハ温度制御装置 |
JP2004507886A (ja) * | 2000-07-21 | 2004-03-11 | テンプトロニック コーポレイション | 温度制御された自動試験用熱プラットフォーム |
US6771086B2 (en) * | 2002-02-19 | 2004-08-03 | Lucas/Signatone Corporation | Semiconductor wafer electrical testing with a mobile chiller plate for rapid and precise test temperature control |
DE102005001163B3 (de) * | 2005-01-10 | 2006-05-18 | Erich Reitinger | Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer temperierbaren Aufspanneinrichtung |
-
2005
- 2005-11-24 JP JP2005338255A patent/JP4525571B2/ja active Active
-
2006
- 2006-11-22 US US11/603,233 patent/US20070126457A1/en not_active Abandoned
- 2006-11-24 TW TW095143635A patent/TW200746342A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001033484A (ja) * | 1999-07-15 | 2001-02-09 | Ibiden Co Ltd | ウエハプローバ |
JP2003163244A (ja) * | 2001-11-28 | 2003-06-06 | Taiheiyo Cement Corp | ウェハプローバ |
JP2004063486A (ja) * | 2002-07-24 | 2004-02-26 | Tokyo Seimitsu Co Ltd | プローバのチャック機構 |
JP2005302855A (ja) * | 2004-04-08 | 2005-10-27 | Sumitomo Electric Ind Ltd | 半導体加熱装置 |
Also Published As
Publication number | Publication date |
---|---|
US20070126457A1 (en) | 2007-06-07 |
JP2007149727A (ja) | 2007-06-14 |
TW200746342A (en) | 2007-12-16 |
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