TW200746342A - Wafer holder for wafer prober and heater unit/wafer prober equipped with the same - Google Patents

Wafer holder for wafer prober and heater unit/wafer prober equipped with the same

Info

Publication number
TW200746342A
TW200746342A TW095143635A TW95143635A TW200746342A TW 200746342 A TW200746342 A TW 200746342A TW 095143635 A TW095143635 A TW 095143635A TW 95143635 A TW95143635 A TW 95143635A TW 200746342 A TW200746342 A TW 200746342A
Authority
TW
Taiwan
Prior art keywords
wafer
mounting
prober
thermal conductivity
wafer prober
Prior art date
Application number
TW095143635A
Other languages
English (en)
Inventor
Masuhiro Natsuhara
Tomoyuki Awazu
Hirohiko Nakata
Katsuhiro Itakura
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW200746342A publication Critical patent/TW200746342A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095143635A 2005-11-24 2006-11-24 Wafer holder for wafer prober and heater unit/wafer prober equipped with the same TW200746342A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005338255A JP4525571B2 (ja) 2005-11-24 2005-11-24 ウェハ保持体およびそれを搭載したヒータユニット、ウェハプローバ

Publications (1)

Publication Number Publication Date
TW200746342A true TW200746342A (en) 2007-12-16

Family

ID=38118065

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095143635A TW200746342A (en) 2005-11-24 2006-11-24 Wafer holder for wafer prober and heater unit/wafer prober equipped with the same

Country Status (3)

Country Link
US (1) US20070126457A1 (zh)
JP (1) JP4525571B2 (zh)
TW (1) TW200746342A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5061751B2 (ja) * 2007-06-26 2012-10-31 住友電気工業株式会社 ウェハプローバ用ウェハ保持体
JP2010114208A (ja) * 2008-11-05 2010-05-20 Nikon Corp 冷却装置および接合システム
JP6003060B2 (ja) * 2012-01-06 2016-10-05 住友電気工業株式会社 ウエハプローバ用ウエハ保持体
EP3279929A1 (en) * 2015-03-31 2018-02-07 Shindengen Electric Manufacturing Co., Ltd. Pressurization unit
WO2022123846A1 (ja) 2020-12-11 2022-06-16 株式会社巴川製紙所 温調ユニット

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5610529A (en) * 1995-04-28 1997-03-11 Cascade Microtech, Inc. Probe station having conductive coating added to thermal chuck insulator
US6504393B1 (en) * 1997-07-15 2003-01-07 Applied Materials, Inc. Methods and apparatus for testing semiconductor and integrated circuit structures
US6073681A (en) * 1997-12-31 2000-06-13 Temptronic Corporation Workpiece chuck
JP2001033484A (ja) * 1999-07-15 2001-02-09 Ibiden Co Ltd ウエハプローバ
JP2002043381A (ja) * 2000-07-19 2002-02-08 Tokyo Electron Ltd ウエハ温度制御装置
JP2004507886A (ja) * 2000-07-21 2004-03-11 テンプトロニック　コーポレイション 温度制御された自動試験用熱プラットフォーム
JP2003163244A (ja) * 2001-11-28 2003-06-06 Taiheiyo Cement Corp ウェハプローバ
US6771086B2 (en) * 2002-02-19 2004-08-03 Lucas/Signatone Corporation Semiconductor wafer electrical testing with a mobile chiller plate for rapid and precise test temperature control
JP4124622B2 (ja) * 2002-07-24 2008-07-23 株式会社東京精密 プローバのチャック機構
JP4281605B2 (ja) * 2004-04-08 2009-06-17 住友電気工業株式会社 半導体加熱装置
DE102005001163B3 (de) * 2005-01-10 2006-05-18 Erich Reitinger Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer temperierbaren Aufspanneinrichtung

Also Published As

Publication number Publication date
US20070126457A1 (en) 2007-06-07
JP4525571B2 (ja) 2010-08-18
JP2007149727A (ja) 2007-06-14

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