JP4646715B2 - ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ - Google Patents
ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ Download PDFInfo
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- JP4646715B2 JP4646715B2 JP2005201120A JP2005201120A JP4646715B2 JP 4646715 B2 JP4646715 B2 JP 4646715B2 JP 2005201120 A JP2005201120 A JP 2005201120A JP 2005201120 A JP2005201120 A JP 2005201120A JP 4646715 B2 JP4646715 B2 JP 4646715B2
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- chuck top
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- pedestal
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- 239000002131 composite material Substances 0.000 claims description 25
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 13
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
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Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
2 チャックトップ
3 チャックトップ導体層
4 支持体
5 台座
6 空隙
7 加熱体
8 支持棒
9 冷却モジュール
10 昇降手段
11 チャックトップ変形防止用基板
21 環状溝
22 放射状溝
23 柱状部材
41 支持体円筒部
42 貫通孔
71 抵抗発熱体
72 絶縁体
Claims (5)
- 表面にチャックトップ導体層を有するチャックトップと、該チャックトップを支持する支持体と、該支持体を載置する台座とからなり、支持体と台座との間の少なくとも一部に空隙を有し、前記台座が有底円筒形状であり、その材質がムライトもしくはアルミナ、ムライトとアルミナの複合体のいずれかからなることを特徴とするウェハプローバ用ウェハ保持体。
- 前記チャックトップおよび/または支持体に、発熱体を備えることを特徴とする請求項1に記載のウェハプローバ用ウェハ保持体。
- 前記支持体の形状が、有底円筒形状であることを特徴とする請求項1または2に記載のウェハプローバ用ウェハ保持体。
- 前記空隙内に、冷却モジュールを備えることを特徴とする請求項1乃至3のいずれかに記載のウェハプローバ用ウェハ保持体。
- 請求項1乃至4のいずれかに記載したウェハプローバ用ウェハ保持体を備えたことを特徴とするウェハプローバ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005201120A JP4646715B2 (ja) | 2005-07-11 | 2005-07-11 | ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005201120A JP4646715B2 (ja) | 2005-07-11 | 2005-07-11 | ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007019359A JP2007019359A (ja) | 2007-01-25 |
JP4646715B2 true JP4646715B2 (ja) | 2011-03-09 |
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JP2005201120A Active JP4646715B2 (ja) | 2005-07-11 | 2005-07-11 | ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ |
Country Status (1)
Country | Link |
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JP (1) | JP4646715B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010186765A (ja) * | 2009-02-10 | 2010-08-26 | Sumitomo Electric Ind Ltd | ウエハプローバ用ウエハ保持体及びそれを搭載したウエハプローバ |
JP5500421B2 (ja) * | 2009-12-14 | 2014-05-21 | 住友電気工業株式会社 | ウェハ保持体およびそれを搭載したウェハプローバ |
JP2012191241A (ja) * | 2012-06-27 | 2012-10-04 | Sumitomo Electric Ind Ltd | ウエハプローバ用ウエハ保持体及びそれを搭載したウエハプローバ |
JP5978992B2 (ja) * | 2012-12-28 | 2016-08-24 | 株式会社ソシオネクスト | 電子デバイス用試験装置及び試験方法 |
JP6060889B2 (ja) * | 2013-12-16 | 2017-01-18 | 住友電気工業株式会社 | ウエハ加熱用ヒータユニット |
JP6786439B2 (ja) * | 2016-06-28 | 2020-11-18 | 日本特殊陶業株式会社 | 保持装置および保持装置の製造方法 |
-
2005
- 2005-07-11 JP JP2005201120A patent/JP4646715B2/ja active Active
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Publication number | Publication date |
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JP2007019359A (ja) | 2007-01-25 |
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