JP4511336B2 - Multi-cavity wiring board and method for manufacturing electronic device - Google Patents

Description

  The present invention relates to a multi-piece wiring board in which a large number of wiring board regions, which are wiring boards for mounting electronic components such as semiconductor elements and crystal resonators, are arranged in a vertical and horizontal manner, and an electronic device. Is.

  Conventionally, for example, a small wiring board used for an electronic component storage package for storing an electronic component such as a semiconductor element or a crystal resonator is made of a ceramic material such as an aluminum oxide sintered body, and has a surface such as tungsten. This is a structure in which a plurality of rectangular flat ceramic insulating layers on which wiring conductors made of a metal material are formed are stacked one above the other. An electronic device is formed by housing an electronic component on the wiring board and electrically connecting the electrode of the electronic component to an exposed portion of the wiring conductor via solder, a bonding wire, or the like.

  By the way, with the recent demand for miniaturization of electronic devices, the size of such wiring boards has become extremely small, about several mm square, and it is easy to handle a large number of wiring boards. Therefore, in order to efficiently manufacture the wiring board and the electronic device, a so-called multi-cavity wiring board form in which a large number of wiring boards are obtained simultaneously from a single large-area mother board. It is made with.

  An example of such a multi-piece wiring board is shown in FIG. FIG. 2A is a plan view of a conventional multi-cavity wiring board, and FIG. 2B is a cross-sectional view of the multi-cavity wiring board of FIG.

  The multi-cavity wiring board is formed in each wiring board area 203 and a mother board 201 in which a plurality of rectangular wiring board areas 203 are arranged in a row and length and a frame-shaped discard margin area 202 is formed in the outer periphery. And a plurality of wiring conductors (not shown).

  A concave portion 204 for accommodating an electronic component is formed on the upper surface of each wiring board region 203, and a part of the wiring conductor is exposed in the concave portion 204 of the wiring board region 203 and the other part is partly exposed. The wiring board region 203 is formed so as to be exposed on the lower surface, side surface, and the like.

  Further, on the outer periphery of the lower surface of each wiring board region 203, a plurality of connection pads 209 for external connection are formed in an array so as to be electrically connected to the wiring conductor.

  Then, an electronic component (not shown) is accommodated in the recess 204 of the wiring board region 203, and the electrode of the electronic component is electrically connected to the exposed portion of the wiring conductor via an electrical connection means such as a bonding wire or solder. By bonding a lid made of metal, glass or the like so as to close the recess 204 on the upper surface of the wiring board region 203, or filling the recess 204 with a resin filler made of epoxy resin or the like, By electronically storing electronic components therein, a large number of electronic devices are formed in a multi-piece state in which the electronic devices are arranged vertically and horizontally.

  Thereafter, the electronic device in the multi-cavity state is divided into individual wiring board regions 203 to form electronic devices as a large number of products. In some cases, electronic components are mounted on the wiring board region 203 after the multi-piece wiring board is divided into individual wiring board regions 203.

  The formed electronic device is mounted by electrically and mechanically connecting the connection pad 209 to the connection terminal of the external electric circuit board via solder or the like, and the electrode of the electronic component is electrically connected to the external electric circuit. Connected.

  Such a multi-cavity substrate is made, for example, by forming a raw material powder such as aluminum oxide into a sheet shape together with an organic solvent and a binder to produce a plurality of ceramic green sheets, and punching a part of the ceramic green sheets. Then, the openings that become the recesses 204 are arranged and formed. Next, a metal paste such as tungsten that becomes a wiring conductor or the like is printed on the ceramic green sheet, and then the openings are stacked so that the openings are positioned in the upper layer. It is manufactured by firing at a high temperature.

  Conventionally, in such a multi-piece wiring board, dividing grooves are formed in advance by pushing a cutter blade or the like along the boundary between the wiring board regions 203 of the ceramic green sheet to be the mother board 201, By slicing according to the cutting line on the boundary line of each wiring board area of the mother board 201, each wiring board area 203 is divided into individual pieces.

  In this case, as a positioning method when dividing grooves are formed on the mother substrate 201 or when slicing is performed, a positioning mark 205 is formed in the disposal margin area 202 on the outer periphery of the mother substrate 201, and this mark 205 is used. For example, a method of positioning a rotary blade for slicing is generally employed as a reference.

  The mark 205 is formed by attaching a conductive material similar to the wiring conductor formed on the main surface of the mother board 201 to the mother board 201 in a predetermined pattern, or providing a hole in the surface of the discard margin area 202 of the mother board 201. It is formed by.

Note that through conductors (not shown) are formed on the extended lines of the borders between the adjacent wiring board regions 203, and these through conductors connect between the wiring conductors of the adjacent wiring board regions 203 or upper and lower wiring conductors. It is formed so as to be electrically connected, and when it is divided into individual wiring board regions 203, it is divided vertically so that it becomes a side conductor (castellation conductor) located on the side face of the wiring board.
JP 2003-318511 A JP 2004-186290 A

  However, in the conventional multi-cavity wiring board described above, for example, a positional deviation between a mark for positioning formed by a conductor and a recess formed by punching, etc. Thus, misalignment between each part in each wiring board region to be cut easily occurs.

  Therefore, there is a problem that the distance from the outer side to the recess or the connection pad may be shifted from a predetermined position in the individual wiring board region (electronic component storage package).

  In each electronic component storage package, for example, if the distance between the outer side and the concave portion (inner side surface) shifts, the upper surface side of the wiring board region (individual electronic component storage package) surrounds the concave portion. The mechanical strength on the narrower side of the frame body is reduced, and for example, there is a possibility that cracks may occur in the insulating base body due to stress accompanying thermal expansion and contraction when the lid body is joined to the upper surface of the wiring board region. Moreover, since the joining width of the frame body with respect to the lid body becomes narrow, the reliability of joining of the lid body is lowered, and there is a possibility that the hermetic sealing performance in the recess is reduced.

  In addition, if the distance between the outer side and the connection pad is deviated, when the positioning is performed on the external electric circuit board with respect to the outer side of the wiring board region (electronic component storage package), There was a possibility that the position of the connection pad would shift and a mounting failure would occur.

In this case, means for adjusting the dividing position according to the positions of the recesses and the connection pads can be considered, but the recesses are positioned on one surface of the mother board and the connection pads are positioned on the other surface of the mother board. It is very difficult to adjust the dividing position with respect to both the recess and the connection pad.
In addition, there is a method of simultaneously checking with the image recognition device from the upper and lower surfaces of the mother board and determining the cutting line so as to confirm the positional relationship between the upper and lower surfaces of the mother board at the same time. The workability of the dividing process is reduced, and the manufacturing cost is increased.

  In particular, in recent years, a small-sized wiring board used for an electronic component storage package or the like is required to be further downsized, particularly a frame portion that surrounds a recess with respect to the outer shape of the wiring board, in order to reduce the size and height of the electronic device. It has become a problem how to keep the mechanical strength of the recess and to increase the area of the recess.

  Since the lid is joined to the upper surface of the wiring board region by seam welding or the like, a stress is applied due to the difference in linear expansion coefficient between the wiring board side and the metal lid at this time, and the frame part surrounding the recess If the width is reduced and the mechanical strength is reduced, cracks are very likely to occur when the lid is joined. For this reason, various problems resulting from the above-mentioned positional deviation have become more serious issues.

  The present invention has been devised in view of such problems, and its purpose is to divide each wiring board region into individual pieces, and to provide a recess on one side of the mother board and connection pads on the other side. In any case, an object of the present invention is to provide a multi-piece wiring board capable of easily determining a dividing position with high accuracy so as not to cause a large positional shift with respect to the outer side of the individual piece.

Method of manufacturing a multi-piece wiring substrate of the present invention is to prepare a plurality of ceramic green sheets serving as a base substrate, a recess in the wiring board area of multiple one surface of a portion of that of the ceramic green sheet Providing an opening, forming a second portion of the through hole in the outer margin area of the outer periphery by the same process as the recess, and in the outer margin area of the other ceramic green sheet, Forming a first portion of a through-hole having a size larger than that of the second portion, and forming a wiring conductor in the plurality of wiring board regions of the other ceramic green sheet by printing a metal paste, respectively; And connecting pads along the outer periphery of each wiring board region on the other side of the mother board of the other ceramic green sheet. And forming a mark indicating the center of the first portion of the through hole in the discarding region on the other surface of the other surface of the mother substrate of the other ceramic green sheet by the same process, Forming a reflective layer in the abandon margin region on the outer periphery of the other surface of a part of the green sheet; and the other surface side of the part of the ceramic green sheet is one of the other parts of the ceramic green sheet as a surface side, wherein the second portion of the first portion and the through hole of the through holes are laminated so as to communicate with the vertical and is characterized that you and a firing .

A method of manufacturing a multi-piece wiring substrate of the present invention, the through hole and is characterized that you formed on the extension of the boundary between the wiring substrate region.

In the method of manufacturing a multi-cavity wiring board according to the present invention, the dimension of the second portion of the through hole gradually decreases from the other surface of the mother board toward one surface of the mother board. Rukoto be formed such that is characterized in.

Further, the method of manufacturing a multi-piece wiring substrate of the present invention, the dimension of the second portion of the through hole, to 1/3 to 1/2 of the dimension of the first portion of the through hole It is characterized by that.

A method for manufacturing an electronic device according to the present invention includes a step of dividing a multi-piece wiring substrate manufactured by the method for manufacturing a multi-piece wiring substrate according to the invention into individual wiring board regions, and separating the packages into pieces. And a step of mounting an electronic component in the concave portion of the package.

The method for manufacturing a multi-cavity wiring board according to the present invention prepares a plurality of ceramic green sheets as a mother board, and opens a plurality of wiring board regions on one side of a part of the ceramic green sheets as recesses. provided with a part, forming a first portion of the large through-hole dimension than second portion of the transmembrane hole to discard margin area of the outer periphery, by each printing a metal paste, other ceramic green sheets Forming wiring conductors in a plurality of wiring board areas of the ceramic green sheet, connecting pads along the outer periphery of each wiring board area on the other surface to be the other surface of the mother board of the other ceramic green sheet, and the ceramic green sheet A mark indicating the center of the first portion of the through-hole is formed in the same step in the discard margin region of the other surface which is the other surface of the other mother substrate. A step that form a reflective layer to discard margin area of the outer periphery of the other surface of the part of those ceramic green sheets, one surface of the other of the ceramic green sheet and the other surface side of those portions of the ceramic green sheet The wiring is formed vertically and horizontally in the center of the mother board by including a step of laminating and firing so that the first part of the through hole and the second part of the through hole communicate vertically When forming a dividing groove at the boundary between adjacent wiring board areas of the board area and when inserting a rotary blade for slicing, depending on the position of the through-hole penetrating from the other face side to one face, The position of the formed recess can be estimated and detected.

  That is, since the through-hole penetrates the mother substrate, it can be easily seen from one surface side and the other surface side. Then, by detecting in advance the positional relationship between the through hole and the recess on one surface side of the mother board, when the mother board is viewed from the other surface side, the position of the through hole is used as a reference. The position of the recess can be calculated and detected.

  In addition, since the reflective layer is formed on the bottom surface of the first portion of the through hole, the illumination light is reflected by the reflective layer when the illumination light for position confirmation is irradiated from the other surface side. The bottom surface of the first portion can be easily recognized, and the second portion (small-diameter hole) of the through hole extending from the bottom surface (dark because it does not reflect light) can be clearly confirmed.

  Then, by adjusting the position to be divided on the basis of the position of the detected recess and the position of the connection pad that can be directly confirmed from the other surface, the connection of the recess on one surface of the mother board and the other surface is adjusted. To provide a multi-piece wiring board capable of easily determining a division position with high accuracy so that a large positional shift with respect to the outer side of each piece does not occur for any of the pads. it can. In addition, as a result, in the individual electronic component storage package, the positional deviation of the recess and the connection pad with respect to the outer side is suppressed, and the accuracy and workability of mounting the electronic component and mounting on the external electric circuit board are excellent. can do.

According to the manufacturing method of the multi-piece wiring substrate of the present invention, a through hole, the wiring board by Rukoto be formed on the extension of the boundary between the regions, wiring board formed vertically and horizontally on the center of the mother substrate When forming a dividing groove at the boundary of adjacent wiring board areas in the area or inserting a rotary blade for slicing, the position of the recess on the upper surface of the wiring board area formed vertically and horizontally in the center of the mother board and the wiring on the lower surface In consideration of the position of the conductor, it is possible to form a dividing groove at a boundary between adjacent wiring board regions with high positional accuracy, or to insert a slicing rotary blade.

  Further, since there is no need to form an extra through hole in the wiring board region, downsizing of the wiring board region (individual electronic component storage package) is not hindered.

According to the manufacturing method of the multi-piece wiring substrate of the present invention, the second portion of the through hole, so that the dimension with the direction from the other surface of the mother substrate on one surface of the base substrate becomes gradually smaller formed to a Rukoto, when viewed through hole from the side of the first portion, (bright being reflective layer is formed) and the bottom surface of the first portion, the side surface of the darker second part, the mother It will be visible in a triple structure with the open end of the second part penetrating to one surface of the substrate and external light is slightly incident, and is recognized by both the reflective layer and the open end of the second part. It becomes easy.

  In addition, since the size of the through hole can be kept small on one side of the mother substrate where the recess is formed, the mechanical strength of the mother substrate is too low even if a large number of through holes are formed. This can be effectively prevented.

  Further, by confirming the second portion of the through hole formed so as to gradually become smaller from one direction side of the lower surface, it is possible to infer the state of deviation of each laminated insulating layer. In other words, even when the recess is composed of a plurality of step portions, it is possible to estimate the state of displacement of each insulating layer stacked on each step portion, and it is possible to mount electronic components in the recess with high positional accuracy. it can. For example, in the case of an electronic device in which two step portions are formed in a recess, a semiconductor element is accommodated in the lower step portion, and a piezoelectric vibrator is accommodated in the upper step portion, three through holes having different diameters are discarded. By defining the positional relationship between each through hole and the opening that is formed in the same insulating layer as the stepped portion, it is possible to prevent the electronic components from contacting the stepped portion and to accurately position the electron. The component can be mounted in the recess.

Further, the method of manufacturing a multi-piece wiring substrate of the present invention, the discard margin area of the other surface of the base substrate, by Rukoto to form a mark indicating the center of the first portion of the through hole, the through-hole The center of the portion 1 can be easily detected.

  For example, when the center of the through hole is detected by the image recognition device, the accurate position can be confirmed at the center of the through hole detected from this mark without calculating from the center of gravity of the through hole. The workability when recognizing the center of the can be improved.

The first portion of the through-hole can expose the second portion of the through-hole on the bottom surface, and the wiring on the other surface can be accurately positioned by checking the central portion of the first portion of the through-hole. A cutting line in the substrate area can be specified.

A method of manufacturing a multi-piece wiring substrate of the present invention, marks, from Rukoto be formed by the connection pads in the same step, can form a connection pad and marks while maintaining the positional accuracy of the screen printing, connected to the mark Position accuracy between the pads can be improved. That is, by using the mark as a reference, the position accuracy of the connection pad when dividing the mother board can be further increased.

  In addition, the connection pad of each wiring board area and the mark of the disposal allowance area can be simultaneously formed by applying metallized paste by screen printing etc., and the positional accuracy between the connection pad and the mark can be improved. It is possible to simplify the printing process of the metallized paste.

A method of manufacturing a multi-piece wiring substrate of the present invention, the dimension of the second portion of the through-hole, 1/3 to 1/2 and to Rukoto dimension of the first portion of the through hole, When dividing the mother board, that is, when dividing grooves are formed along the boundary between adjacent wiring board areas or when inserting a rotary blade for slicing, the visibility is further improved, so the cutting line can be positioned with high accuracy. It is possible to estimate, and it is possible to form a division groove with high positional accuracy at the boundary between adjacent wiring board regions, or to insert a slicing rotary blade.

Moreover, multi-cavity method of manufacturing a wiring board of the present invention, the second portion and the concave portion of the through-holes, since the formation in the same step, the positional accuracy between the second portion and the concave portion of the through hole It can be increased more reliably. Therefore, the position of the concave portion on the upper surface can be estimated through the second portion with higher positional accuracy. Further, the punching process is simplified, and the productivity of the multi-piece wiring board can be increased.

The electronic device manufacturing method of the present invention includes a step of dividing a package by dividing the multi-cavity wiring board manufactured by the multi-cavity wiring board manufacturing method of the present invention into wiring board regions, and And mounting the electronic components in the recesses of the package, both the recesses on one side and the connection pads on the other side have good positional accuracy from the outside, and the reliability of hermetic sealing In addition, it is possible to provide an electronic device with high connection reliability to an external electric circuit.

Next, a multi-piece wiring board according to the present invention will be described with reference to the accompanying drawings. FIG. 1A is a plan perspective view showing an example of an embodiment of a multi-cavity wiring board according to the present invention, and FIG. 1B is an XX ′ diagram of the multi-cavity wiring board of FIG. It is sectional drawing in a line. For easy understanding of the configuration of the present invention, FIG. 1A is a plan perspective view of the lower surface side of the mother board.

  In the drawing, 101 is a mother board, 102 is a margin area, 103 is a wiring board area, and 104 is a recess in which electronic components are mounted. A margin area 102 is formed so as to surround the wiring board area 103 formed in the center of the mother board 101. A plurality of connection pads 109 connected to the external electric circuit board are formed on the lower surface of each wiring board region 103. In FIG. 1A, the connection pad 109 is omitted to make the perspective view easier to see.

  Further, a through hole 111 is formed in the disposal margin region 102, and this through hole is on the other surface side (the lower surface side in FIG. 1) opposite to the first surface where the concave portion 104 of the mother substrate 101 is formed. ) And a second portion 107 which is located on one surface side (the upper surface side in FIG. 1) and has a smaller dimension than the first portion 106. Yes.

  The mother substrate 101 is formed by laminating ceramic layers made of ceramic materials such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, and glass ceramics. Each wiring board region 103 has, for example, a rectangular shape having a side length of about 2 to 20 mm and a thickness of about 0.3 to 2 mm. A mounting portion for storing and mounting electronic components is provided on the bottom surface of the recess 104 on the upper surface of each wiring board region 103.

  If such a mother substrate 101 is made of, for example, an aluminum oxide sintered body, a plurality of ceramic green sheets obtained by forming a raw material powder such as aluminum oxide into a sheet shape are prepared, and the wiring substrate is partitioned vertically and horizontally. A region 103 is provided, and then a part of this ceramic green sheet is appropriately punched to provide an opening to be a recess 104, and then the ceramic green sheet having the opening is positioned on the upper layer side Thus, it is produced by laminating and firing.

  A wiring conductor (not shown) is formed in each wiring board region 103. A part of the wiring conductor is exposed inside the recess 104 and is electrically connected to an electrode of an electronic component (not shown) mounted in the recess 104 via a bonding wire, solder, or the like. It functions as a conductive path that leads to the outside (for example, the lower surface or side surface of each wiring board region 103).

  The wiring conductor is made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, gold, and the like. It is formed by printing with a wiring conductor pattern.

  The exposed surface of the wiring conductor is plated with nickel or gold to prevent oxidative corrosion and improve characteristics such as solder wettability and bonding wire bondability when connecting solder and bonding wires. A layer (not shown) is preferably applied. This plating layer is formed, for example, by supplying a plating deposition current to a portion to be plated (surface of the wiring conductor) in a plating solution and performing electrolytic plating.

  The supply of current to the wiring conductors in each wiring board region 103 is performed by electrically connecting the wiring conductors between the adjacent wiring board regions 103 and to the wiring conductors in the outermost wiring board region 103. This can be done by supplying a current.

  For example, by forming a through conductor (not shown) having a metallized layer deposited on the inner wall at the boundary between the wiring board regions 103 and electrically connecting the through conductor to the wiring conductor, each adjacent wiring board The wiring conductors are electrically connected between the regions 103. Further, a frame-like common conductor layer (not shown) that is electrically connected to the wiring conductor of the outermost peripheral wiring board area 103 is formed in the discard margin area 102, and a part of the common conductor layer is formed on the mother board. By extending to the side surface, a plating current is supplied to the wiring conductor in the outermost wiring board region. That is, a plating jig is electrically connected to the extended portion, and a current is supplied from a power source (DC rectifier, etc.) to the common conductor layer via the plating jig, and a current is supplied from the common conductor layer to the wiring conductor. Supplied.

  Note that the common conductor layer is formed by printing and applying a metal paste similar to that for forming the wiring conductor in a frame shape on the main surface of the portion that becomes the discard margin region 102 on the outer periphery of the green sheet. The common conductor layer is preferably formed of the same material as the wiring conductor in consideration of productivity and the like.

  The discard margin region 102 formed so as to surround the plurality of wiring board regions 103 is provided in order to facilitate handling of the multi-piece wiring substrate.

  For example, it is effective to prevent mechanical damage such as chipping and cracking in the wiring board area 103 when a large number of wiring boards hit the jig, device, etc. by mistake during handling. Is done.

  Further, as will be described later, the discard margin area 102 also has a function of securing a space for forming a reference for positioning the multi-piece wiring board.

  With respect to this multi-piece wiring board, electronic parts are mounted in the recesses 104, and a lid (not shown) is attached to a portion surrounding the recess 104 on one surface of each wiring board region 103, so that the respective recesses 104 are respectively attached. By closing, in each wiring board region 103, the electronic components are hermetically sealed inside the container formed between the recess 104 and the lid, and a large number of electronic devices are formed. The electronic components to be mounted are piezoelectric elements such as crystal resonators and surface acoustic wave elements, semiconductor elements such as semiconductor integrated circuit elements and optical semiconductor elements, and capacitive elements.

  By dividing this multi-piece electronic device along the boundary between the wiring board regions 103 and along the boundary between the wiring board region 103 and the disposal margin region 102, a large number of electronic devices are formed simultaneously and collectively. The

  The mother substrate 101 is divided by slicing with a rotary blade for slicing, or by dividing grooves (not shown) formed in advance along each boundary, and bending stress is applied to the mother substrate 101 along the divided grooves. In addition, it is performed by a method such as a method of breaking the mother substrate 101 (so-called break).

  Further, the dividing groove is formed by pressing a blade (metal blade) against the main surface of the ceramic green sheet serving as the mother substrate 101 along the boundary between the wiring substrate regions 103 and the boundary between the wiring substrate region 103 and the disposal margin region 102. It is formed by forming a notch of a predetermined depth.

  For each formed electronic device (not shown), the connection pads 109 arranged on the outer peripheral side of the lower surface are respectively aligned with the corresponding connection terminals (not shown) of the external electric circuit board and soldered. It is mounted on an external electric circuit board by connecting it electrically and mechanically through a connecting material such as a conductive adhesive or an electrically conductive adhesive, and the hermetically sealed electronic component is electrically connected to an external electric circuit. Is done.

  Note that the connection pad 109 is made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, or gold. It is formed by printing in a predetermined pattern along the outer periphery of each wiring board region 103 on the other side of the sheet. If the above-described wiring conductors and connection pads 109 are made of the same metal material, the productivity of a multi-piece wiring board can be improved.

In the multi-cavity wiring board according to the present invention, a through hole 111 is formed in the discard margin region 102. In addition, the through-hole 111 includes a first portion 106 located on the other surface side of the mother substrate 101 and a second portion 107 located on one surface side of the mother substrate 101 and having a smaller size than the first portion 106. The reflective layer 108 is formed on the bottom surface of the first portion 106 of the through hole 111.

  With this configuration, when the dividing groove is formed at the boundary between the adjacent wiring board regions 103 formed vertically and horizontally in the center of the mother board 101, or when the rotary blade for slicing is inserted, the other surface side From the position of the through hole 111 penetrating to one surface, the position of the concave portion 104 formed on one surface can be estimated and detected.

  That is, since the through hole 111 penetrates the mother substrate 101, it can be easily seen from one surface side and the other surface side. Then, by detecting in advance the positional relationship between the through hole 111 and the recess 104 on one surface side of the mother substrate 101, the through hole 111 can be seen when the mother substrate 101 is viewed from the other surface side. It is possible to calculate and detect the position of the recess 104 with reference to the position of.

  In addition, since the reflective layer 108 is formed on the bottom surface of the first portion 106 of the through hole 111, the illumination light is reflected by the reflective layer 108 when the illumination light for position confirmation is irradiated from the other surface side. Therefore, the bottom surface of the first portion 106 can be easily recognized, and the second portion 107 (small-diameter hole) of the through-hole 111 extending from the bottom surface (dark because it does not reflect light) is clearly confirmed. be able to.

  Then, by adjusting the position to be divided on the basis of the detected position of the recessed portion 104 and the position of the connection pad 109 that can be directly confirmed from the other surface side, the recessed portion 104 on one surface of the mother substrate 101, and For each of the connection pads 109 on the other side, a multi-piece wiring that can easily determine the dividing position with high accuracy so as not to cause a large positional shift with respect to the outer side of the piece. A substrate can be provided. In addition, in this way, in the individual electronic component storage package, the positional deviation of the concave portion 104 and the connection pad 109 with respect to the outer side is suppressed, and the accuracy and workability of mounting the electronic component and mounting on the external electric circuit board are excellent. Can be.

  The through-hole 111 is formed in the marginal region 102 on the outer periphery of the ceramic green sheet serving as the mother substrate by punching or laser processing to form a hole penetrating in the thickness direction. It is formed by laminating ceramic green sheets so as to communicate with each other.

  The reflective layer 108 reflects light, such as tungsten, the connection pad 109, metal materials such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, gold, and other ceramic materials having a higher brightness than the mother substrate 101. For example, in the case of tungsten, a tungsten metal paste is printed in a predetermined pattern along the outer periphery of each wiring board region 103 on the other side of the green sheet to be the mother board 101. It is formed by keeping. If the reflective layer 108 is made of the same metal material as the wiring conductor and the connection pad 109, the productivity of the multi-piece wiring board can be improved.

  The reflective layer 108 is preferably coated with a plating layer made of a metal material that easily reflects light, such as gold, copper, nickel, or platinum. If such a plating layer is deposited, the reflection of the reflection layer 108 becomes better, and the bottom surface of the first portion 106 and the second portion 107 adjacent thereto are more easily and accurately recognized. Will be expensive.

  In particular, the plating layer is preferably formed of a nickel plating layer as a layer in contact with a metal material such as tungsten forming the reflective layer 108 and a gold plating layer as an outermost layer. In this case, the bonding strength of the plating layer to the metal material can be increased, the oxidative corrosion of the metal material can be effectively prevented by the gold plating layer, and the contrast between the reflective layer 108 and the mother substrate is also improved. Can be bigger.

  Here, for example, the size of the mother substrate 101 is further increased, and the distance between the central portion of the wiring substrate region 103 and the through-hole 111 (the first portion 106 and the second portion 107) formed in the disposal margin region 102. Even when the area becomes large, dummy areas are provided at several locations in the wiring board area, and through holes 111 (the first portion 106 and the second portion 107) are provided in the dummy area, thereby increasing the mother area. You may make it respond | correspond to the board | substrate 101. FIG.

  Further, the first portion 106 and the second portion 107 of the through hole 111 are preferably formed so as to be concentric. In this case, the bottom surface of the first portion 106 is exposed with the same width over the entire circumference of the through-hole 111, and the reflective layer 108 can be formed on the exposed bottom surface. In addition, since the through hole 111, the bottom surface of the first portion 106, the reflective layer 108, and the second portion 107 can be reliably detected from the entire circumference, the accuracy when dividing the mother substrate 101 is increased. can do.

  In this case, if the through hole 111 has a circular cross section in both the first portion 106 and the second portion 107, stress is concentrated in part when the through hole 111 is formed, and cracks occur in the mother substrate 101. It is possible to more reliably prevent problems such as the occurrence of a through-hole, and to easily form the through-holes 111 and to ensure good productivity. Therefore, both the first portion 106 and the second portion 107 of the through hole 111 are preferably circular in cross section, and more preferably concentric.

  Further, it is preferable that the through hole 111 is formed in an extended line at the boundary between the wiring board regions 103. When a dividing groove is formed at the boundary between adjacent wiring board regions 103 formed vertically and horizontally in the center of the mother board 101, or when a rotary blade for slicing is inserted, it is vertically and horizontally in the center of the mother board 101. In consideration of the position of the concave portion 104 on the upper surface of the formed wiring board region 103 and the position of the wiring conductor on the lower surface, a dividing groove can be formed at a boundary between adjacent wiring board regions 103 with higher positional accuracy, or for slicing. It becomes possible to insert a rotary blade.

  Further, since it is not necessary to form an extra through hole in the wiring board region 103, downsizing of the wiring board region 103 (a piece of electronic component storage package) is not hindered.

  In addition, the second portion 107 of the through hole 111 is preferably formed so that the size gradually decreases from the other surface of the mother substrate 101 toward one surface of the mother substrate 101.

When viewed through hole 111 from the side of the first portion 106, and a bottom surface of the (reflective layer 108 is bright be formed) the first portion 106, the side surface of the darker second portion 107, the mother board 101 is visible in a triple structure with the opening end of the second portion 107 penetrating through one surface of the 101 and external light is slightly incident, and both the reflection layer 108 and the opening end of the second portion 107 are seen. It becomes easier to recognize.

  In addition, since the size of the through hole 111 can be reduced on one surface side of the mother substrate 101 where the concave portion 104 is formed, the mechanical property of the mother substrate 101 can be increased even if a large number of the through holes 111 are formed. It is possible to effectively prevent the strength from becoming too low.

  In addition, by confirming the second portion 107 of the through-hole 111 formed so as to gradually become smaller from one direction side of the lower surface, it becomes possible to infer the state of deviation of each laminated insulating layer. . That is, even when the recess 104 is composed of a plurality of stepped portions, it is possible to estimate the state of displacement of each insulating layer stacked on each stepped portion, and the electronic component is mounted in the recess 104 with high positional accuracy. be able to. For example, in an electronic device in which two stepped portions are formed in the recess 104, a semiconductor element is accommodated in the lower stepped portion, and a piezoelectric vibrator is accommodated in the upper stepped portion, three through holes 111 having three different diameters are formed. It is possible to prevent the electronic components from coming into contact with the stepped portions 111 by clarifying the positional relationship between the through holes 111 and the openings that are formed in the same insulating layer as the stepped portions. Thus, the electronic component can be mounted in the recess with high positional accuracy.

Moreover, the discard margin area 102 of the other surface of the base substrate 101, that has the mark 105 indicating the center of the first portion 106 of the through hole 111 is formed. Since the mark 105 indicating the center of the first portion 106 of the through hole 111 is formed, the center of the first portion 106 of the through hole 111 can be easily detected.

  For example, when the center of the through hole 111 is detected by the image recognition device, the accurate position can be confirmed even at the center of the through hole 111 detected from this mark without calculating from the center of gravity of the through hole 111. Workability when recognizing the center of the first portion 106 can be improved.

  The first portion 106 of the through-hole 111 can expose the second portion 107 of the through-hole 111 on the bottom surface, and the central portion of the first portion 106 of the through-hole 111 is also confirmed on the other surface. Thus, the cutting line of the wiring board region 103 can be specified with high positional accuracy.

Further, the mark 105, that is formed by the connection pads 109 in the same step. The mark 105 and the connection pad 109 can be formed while maintaining the screen printing position accuracy, and the position accuracy between the mark 105 and the connection pad 109 can be improved. That is, by using the mark 105 as a reference, the positional accuracy of the connection pad 109 when dividing the mother substrate 101 can be further increased.

  Further, the connection pads 109 of each wiring board region 103 and the mark 105 of the disposal margin region 102 can be simultaneously formed by applying metallized paste by screen printing or the like, and the positional accuracy of the connection pad 109 and the mark 105 can be improved. In addition to being excellent, it is possible to simplify the printing process of the metallized paste.

  In addition, the dimension of the second portion 107 of the through hole 111 is preferably 1/3 or more and 1/2 or less of the dimension of the first portion 106 of the through hole 111.

When the mother board 101 is divided, that is, when a dividing groove is formed along the boundary between adjacent wiring board regions 103 or a rotary blade for slicing is inserted, the visibility is further improved. The line 110 can be estimated with high positional accuracy, and it is possible to form a division groove with high positional accuracy at the boundary between adjacent wiring board regions 103, or to insert a slicing rotary blade.

For example, the size of one side of the wiring board region 103 is small and is about 2.0 to 3.0 mm, and the lower limit of the diameter at which the through-hole 111 can be formed with a good shape when punching with a mold is 0.15. Since the thickness is about 0.2 mm, the size of the through hole 111 acting as the mark 105 indicating the boundary between the adjacent wiring board regions 103 takes into account the rigidity of the disposal margin region 102 of the mother board 101 and the warping during firing. Then, the visibility of the through hole 111 is further improved by setting the size of the second portion 107 of the through hole 111 to be １ ／ or more and ½ or less of the size of the first portion 106 of the through hole 111. .

  Furthermore, in order to improve the visibility of the through-hole 111, an auxiliary plate may be installed so that the contrast on the inner peripheral side of the small-diameter portion of the through-hole 111 is different as viewed from the image device. For example, since the through-hole 111 visible from one surface (upper surface) of the mother substrate 101 is the second portion 107 (small-diameter hole), the lower surface ( A light-colored auxiliary plate can be installed on the surface opposite to the image device.

The second portion 107 and the recess 104 of the through hole 111 is formed in the same step.

By forming the second portion 107, and the recess 104 of the same process of the through hole 111, it is possible to improve the positional accuracy of more reliably between the second portion 107 and the recess 104 of the through hole 111 it can. Therefore, through the second portion 107, it is possible to estimate the further position accurately position the recess 104 of the upper surface. Further, the punching process is simplified, and the productivity of the multi-piece wiring board can be increased.

Electronic device of the present invention, a package which is sectioned by multiple patterning wiring board according to any of the above is divided into each wiring substrate area 103, an electronic component mounted in the recess 104 of the package Therefore, both the concave portion 104 on one surface and the connection pad 109 on the other surface have good positional accuracy from the outer side, reliability of hermetic sealing, and connection to an external electric circuit. A highly reliable electronic device can be provided.

  It should be noted that the present invention is not limited to the above embodiments, and various modifications may be made without departing from the gist of the present invention. For example, in this example, the shape of the through-hole 111 is circular, but it may be configured by through-holes of other shapes (square, rhombus, etc.). In this example, the mother board 101 is composed of 16 wiring board regions 103 of 4 rows × 4 columns. However, the mother board 101 may be arranged in other numbers of arrangements.

(A) is a bottom plan perspective view showing an example of an embodiment of a multi-cavity wiring board according to the present invention, and (b) is a cross-sectional view of the multi-cavity wiring board of (a) taken along line XX ′. . (A) is a bottom perspective plan view of a conventional multi-cavity wiring board, and (b) is a cross-sectional view of the multi-cavity wiring board of (a) taken along line Y-Y ′.

Explanation of symbols

101 ... Mother board 102 ... Discard allowance area 103 ... Wiring board area 104 ... Recess 106 ... First part 107 ... First 2 part 108... Reflective layer 109... Connection pad 111 .. through hole

Claims (5)

Thereby preparing a plurality of ceramic green sheets serving as a base substrate, with an opening serving as a recess in the wiring board area of multiple one surface of a portion of that of the ceramic green sheet, through the discarding margin area of the outer periphery Forming a second portion of the hole in the same step as the recess;
Forming a first portion of a through-hole having a size larger than that of the second portion of the through-hole in a disposal margin region of the outer periphery of the other ceramic green sheet ;
The other surface which forms the wiring conductor in the plurality of wiring board regions of the other part of the ceramic green sheet by printing a metal paste, and becomes the other side of the mother board of the other part of the ceramic green sheet Connecting pads along the outer periphery of each of the wiring board regions, and the first portion of the through hole in the discard margin region on the other surface of the other surface of the mother substrate of the other ceramic green sheet. Forming a mark indicating the center of the part by the same process, and forming a reflective layer in the abandon area on the outer periphery of the other surface of a part of the ceramic green sheet;
The other surface side of a part of the ceramic green sheet is set as one surface side of the other part of the ceramic green sheet, and the first part of the through hole and the second part of the through hole are vertically Lamination and firing so as to communicate with each other
Multiple patterning wiring board manufacturing method characterized that you include a. Wherein a through hole, a manufacturing method of the multi-piece wiring substrate according to claim 1, wherein that you formed on the extension of the boundary between the wiring substrate region. Wherein the second portion of the through-hole, according to claim 1 dimensions with the toward the one surface of the mother substrate from the other surface of the mother substrate is characterized that you formed to gradually become smaller or A method for manufacturing a multi-piece wiring board according to claim 2. Any The dimension of the second portion of the through hole, of claims 1 to 3, characterized in 1/3 to 1/2 and to Rukoto dimension of the first portion of the through hole A method of manufacturing a multi-piece wiring board according to claim 1 . A step of the singulated packages multiple patterning wiring board manufactured by the manufacturing method of the multi-piece wiring substrate according to any one of claims 1 to 4 is divided for each of the wiring substrate area,
Method of manufacturing an electronic apparatus characterized by comprising a step of mounting an electronic component in the recess of the package.

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