JP2005244543A - Package for accommodating piezoelectric vibrator and piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent cracks caused by a heat history and poor quality caused by a change in frequency characteristics, when joining a lid body to a metallized layer for sealing by a brazing filler metal. <P>SOLUTION: There are provided: an insulating board 1 having a recess 5 for accommodating a piezoelectric vibrator 3 on an upper surface; a wiring conductor 6 led from the inside of the recess 5 to the outer surface of the insulating board 1; the metallized layer 2 for sealing formed around the recess 5 on the upper surface of the insulating board 1; a gold-plated layer 10 for covering the metallized layer 2 for sealing; and the lid body 7 made of silicon that is attached onto the upper surface of the insulating board 1 via the gold-silicon alloy brazing filler metal 11 so that the recess 5 is blocked. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a piezoelectric vibrator housing package and a piezoelectric device for housing a piezoelectric vibrator such as a piezoelectric element or a quartz vibrator within a container formed of an insulating base and a lid, and particularly compared. The present invention relates to a piezoelectric vibrator and a piezoelectric device capable of joining a lid and an insulating substrate at a low temperature.

  Conventionally, as shown in FIGS. 2 (a) and 2 (b), a package for housing a piezoelectric vibrator for housing a piezoelectric vibrator has an aluminum oxide sintered body, an aluminum nitride sintered body, It is made of a ceramic material such as a mullite sintered body and glass ceramics, and has a rectangular parallelepiped concave portion 35 for accommodating the piezoelectric vibrator 34 at the center of the upper surface, and piezoelectric vibration on the outer peripheral portion of the bottom surface of the concave portion 35. An insulating base 31 having an electrode pad 33 to which the end of the child 34 is attached, a sealing metallization layer 32 formed on the upper surface around the recess 35 of the insulating base 31, and a sealing metallization layer 32 It is composed of a metal lid 42 joined via a brazing material 43. In general, the wiring conductor 36 is led out from the electrode pad 33 to the outer surface such as the side surface or the lower surface of the insulating base 31. 2A is a plan view showing an example of a conventional package for housing a piezoelectric vibrator, and FIG. 2B is a cross-sectional view thereof. Further, the electrode pad 33 is formed on a convex portion or a step portion formed on the bottom surface of the concave portion 35 so that a gap is formed between the lower surface of the piezoelectric vibrator 34 and the bottom surface of the concave portion 35. Thereby, the center part and other edge part of the piezoelectric vibrator 34 can vibrate favorably.

  According to this conventional piezoelectric vibrator housing package, the piezoelectric vibrator 34 is housed in the recess 35 of the insulating base 31 and the electrodes (not shown) formed at the ends of the piezoelectric vibrator 34 are accommodated. Is electrically connected to the electrode pad 33 on the outer periphery of the recess 35 via an electrical connection means such as a conductive adhesive 38, and then the sealing is formed on the upper surface around the recess 35. By welding a metal lid 42 to the upper surface of the metallized layer 32 by a seam weld method via a brazing material 43, the piezoelectric vibrator 34 is placed inside the container composed of the insulating base 31 and the metal lid 42. It is hermetically sealed, thereby resulting in a product piezoelectric device.

  For welding the metal lid 42 and the sealing metallized layer 32 by the seam weld method, a clad type metal lid 42 (in which a brazing material is integrally formed on the back surface of the metal lid 42) is used in advance. After positioning and placing on the upper surface of the sealing metallization layer 32, the electrode roller is moved along the outer peripheral portion of the upper surface of the metal lid 42 to heat and melt the brazing material, and the metallic material is passed through the brazing material 43. This is performed by bonding the lid 42 and the sealing metallized layer 32 together. The temperature at which the brazing material 43 melts is usually 800 to 900 ° C. in the case of a brazing material of silver alloy or copper alloy, and the local heating temperature at the joining site at this time is 1000 ° C. or higher.

In such a piezoelectric vibrator housing package, the sealing metallization layer 32 is provided so as to cover the entire upper surface around the recess 35 in order to maximize the bonding area of the metal lid 42. ing.
JP 2002-33636 A

  However, in the conventional piezoelectric vibrator housing package, when the metal lid 42 and the insulating base 31 (the metallizing layer 32 for sealing) are joined, the package is heated to a very high temperature of about 800 to 900 ° C. Therefore, there is a problem in that the heat applied at that time tends to cause mechanical breakdown such as cracks in the insulating substrate 31 and the reliability of hermetic sealing is lowered.

  Further, this heat has a problem that an abnormality of the frequency characteristic is easily induced in the piezoelectric vibrator, particularly the quartz crystal vibrator, and the accuracy of the frequency characteristic as the piezoelectric device is likely to be lowered.

  In particular, with the recent demand for miniaturization of piezoelectric devices, the size of the insulating base 31 has become extremely small, about several millimeters square, so that it is more susceptible to the effects of heat as described above. Since mechanical breakage is likely to occur, the reliability of hermetic sealing is significantly reduced.

  In addition, the distance between the portion where the metallic lid 42 is heated and joined to the insulating base 31 and the piezoelectric vibrator 34 becomes very short, and the size of the piezoelectric vibrator 34 is further reduced, so that the seam weld The frequency characteristics are more likely to change due to the thermal history of the method.

  For example, with the recent demand for thinner electronic devices, the thickness of the insulating base 31 is very thin, about 0.4 to 0.8 mm.

  In addition, the width of the upper surface around the recess 35 (the sealing width to which the metal lid 42 is bonded) is very narrow, about 0.2 to 0.5 mm.

  In this way, when the metal lid 42 is welded to the sealing metallization layer 32 having a very narrow width of about 0.2 to 0.5 mm around the concave portion 35 by the seam weld method, the heat is transferred to the metal. The lid 42 is thermally expanded. On the other hand, although heat is transmitted to the insulating base 31 through the sealing metallization layer 32, a temperature difference is generated between the metal lid 42 and the insulating base 31 because it is away from the heat source. As the metal lid 42 is cooled from this state, the outer periphery of the metal lid 42 is firmly joined to the sealing metallized layer 32 by the brazing material 43. A stress is generated to shrink the upper surface of 31 to the center of the recess 35, and a crack is generated in the thin insulating substrate 31.

  The present invention has been devised in view of such problems, and its purpose is to cause the insulating base and the lid to be mechanically broken, such as cracks, in the insulating base even when the size and thickness are reduced. And a piezoelectric vibrator housing package and a piezoelectric device that can be bonded at a low temperature that does not change the frequency characteristics of the piezoelectric vibrator and are excellent in hermetic sealing and accuracy in frequency characteristics. There is to do.

  The piezoelectric vibrator housing package of the present invention includes an insulating base having a recess for housing the piezoelectric vibrator on the upper surface, a wiring conductor led out from the inside of the concave to the outer surface of the insulating base, and the insulating base A sealing metallization layer formed around the recess on the upper surface of the metal, a gold plating layer covering the metallization layer for sealing, and a gold-silicon alloy brazing so as to close the recess on the upper surface of the insulating substrate And a lid made of silicon attached through a material.

  In the piezoelectric vibrator housing package of the present invention, it is preferable that an outer periphery of the sealing metallization layer extends to an upper end portion of an outer surface of the insulating base.

  In the piezoelectric vibrator housing package of the present invention, preferably, an electrode pad to which the electrode of the piezoelectric vibrator is connected is formed on the outer peripheral portion of the bottom surface of the concave portion, and the metallization layer for sealing is The non-formation part is formed in the inner peripheral end along the said electrode pad by planar view.

  The piezoelectric device according to the present invention includes a piezoelectric vibrator housing package having the above-described configuration, a piezoelectric vibrator housed in the recess and formed on an end portion thereof and electrically connected to the wiring conductor, And a lid attached to cover the concave portion on the upper surface of the insulating base.

  According to the piezoelectric vibrator housing package of the present invention, an insulating base having a recess for housing the piezoelectric vibrator on the upper surface, a wiring conductor led out from the inside of the concave to the outer surface of the insulating base, and the insulating base The sealing metallization layer formed around the recess on the upper surface, the gold plating layer covering the sealing metallization layer, and the gold-silicon alloy brazing material so as to close the recess on the upper surface of the insulating substrate. Since the lid is made of silicon to be attached, the lid is placed on the upper surface of the insulating base via a gold-silicon alloy having a low melting point of 300 to 400 ° C. after housing the piezoelectric vibrator in the recess. It is possible to join, attach and seal, and the components of the lid made of silicon and the components of the metallizing layer for sealing diffuse into the gold-silicon alloy brazing material well, thereby allowing 300 to 400 ℃ and Can also obtain a very good bond strength had a temperature. Therefore, it is possible to effectively prevent mechanical destruction of the insulating base due to heat when the lid is joined, and to improve the reliability of the hermetic sealing. At the same time, a change in the frequency of the piezoelectric vibrator due to the thermal history can be effectively prevented, and the accuracy of the frequency characteristics can be improved.

  In the piezoelectric vibrator housing package of the present invention, it is preferable that the sealing metallization layer has an outer periphery extending to the upper end of the outer surface of the insulating base. When a lid made of silicon is bonded to an insulating substrate with a gold-silicon alloy brazing material, the bonding between the gold-silicon alloy brazing material and the sealing metallization layer, and Bonding between the metallization layer for sealing and the insulating substrate can be made even stronger, and the reliability of hermetic sealing can be further improved.

  In the piezoelectric vibrator housing package of the present invention, preferably, an electrode pad to which the electrode of the piezoelectric vibrator is connected is formed on the outer peripheral portion of the bottom surface of the concave portion. Since the non-formed part is formed at the inner peripheral end along the electrode pad, it is possible to effectively prevent the gold-silicon alloy brazing material from reaching the part along the electrode pad at the edge of the recess of the insulating base. When the lid made of silicon is bonded onto the metallizing layer for sealing with a gold-silicon alloy brazing material, the gold-silicon alloy brazing material is inserted into the recess from the bonding surface between the lid and the sealing metallized layer. It is possible to effectively prevent scattering on the upper surface of the electrode pad.

  Therefore, the scattered gold-silicon alloy brazing material prevents problems such as a short circuit (electrical short circuit) between the sealing metallization layer and the wiring conductor and a short circuit between the electrodes of the piezoelectric vibrator. be able to.

  Also, the piezoelectric device of the present invention includes a piezoelectric vibrator housing package having the above-described configuration, a piezoelectric vibrator housed in a recess and having an electrode formed at an end thereof electrically connected to a wiring conductor, and an insulation Since the upper surface of the base body is provided with a lid attached so as to cover the concave portion, it is excellent in the reliability of hermetic sealing of the piezoelectric vibrator housed therein, and stably vibrates the frequency characteristics. Can be made highly reliable and accurate.

  Next, a piezoelectric vibrator housing package and a piezoelectric device according to the present invention will be described with reference to the accompanying drawings.

  FIG. 1A is a top view showing an example of an embodiment of a piezoelectric vibrator housing package and a piezoelectric device according to the present invention, and FIG. 1B is a cross-sectional view taken along the line AA ′. . In the figure, 1 is an insulating substrate, 2 is a metallizing layer for sealing, 3 is a piezoelectric vibrator, 4 is an electrode pad to which an electrode formed on the surface of the end of the piezoelectric vibrator is joined, 6 is a wiring conductor, 7 Is a lid. The piezoelectric vibrator housing package of the present invention is mainly composed of the insulating substrate 1, the sealing metallization layer 2, the electrode pad 4, the wiring conductor 6, and the lid 7.

  The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a ceramic material such as glass ceramics, and has a side length of about 2 to 20 mm. It is a quadrangular shape with a thickness of about 0.5 to 3 mm. A rectangular parallelepiped recess 5 for accommodating the piezoelectric vibrator 3 is provided at the center of the upper surface, and a wiring conductor 6 is formed from the inner side of the recess 5 to the outer surface such as the side surface and the lower surface of the insulating substrate 1. ing.

  The wiring conductor 6 functions as a conductive path for electrically connecting each electrode of the piezoelectric vibrator 3 to an external electric circuit.

  In addition, an electrode pad 4 is formed in a portion of the wiring conductor 6 exposed inside the recess 5 so as to be electrically connected to the wiring conductor 6. The electrode pad 4 has a function of increasing the area of connection with the electrode of the piezoelectric vibrator 3 and making the electrical connection of the electrode easy and strong.

  For example, each electrode of the piezoelectric vibrator 3 is electrically connected to the electrode pad 4 via an electrical connection means such as a conductive adhesive 9, and the portion of the wiring conductor 6 led out to the side surface and the lower surface of the insulating base 1. Is electrically connected to an external electric circuit (not shown) via solder or the like, so that the electrode of the piezoelectric vibrator 3 is electrically connected to the external electric circuit via the electrode pad 4 and the wiring conductor 6. The

  For example, when the piezoelectric vibrator 3 is a quartz crystal vibrator, the electrode pad 4 is formed on the outer peripheral portion of the bottom surface of the recess 5 so as to be suitable for connection of electrodes formed on the end portion of the lower surface thereof. . Note that the electrode pad 4 may be provided at another part of the recess 5 according to the design convenience such as the form of the piezoelectric vibrator 3 and the routing of the wiring conductor 6.

  The wiring conductor 6 and the electrode pad 4 are formed of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, or gold.

  Further, the electrode pad 4 is formed on a convex portion or a stepped portion formed on the bottom surface of the concave portion 5 so that a gap is formed between the lower surface of the piezoelectric vibrator 3 and the bottom surface of the concave portion 5. Thereby, it can vibrate favorably, without the center part and other edge part of the piezoelectric vibrator 3 contacting the bottom face of the recessed part 5 of an insulation base | substrate.

  Further, around the recess 5 on the upper surface of the insulating base 1, a rectangular frame-shaped sealing metallization layer 2 made of metal powder metallization such as tungsten, molybdenum, copper, silver or the like is deposited and sealed. A container for hermetically sealing the piezoelectric vibrator 3 is formed by attaching the outer peripheral portion of the lower surface of the lid 7 to the upper surface of the metallized layer 2 for use.

  The insulating base 1, the wiring conductor 6, the electrode pad 4 and the sealing metallization layer 2 have the insulating base 1 made of an aluminum oxide sintered body, and the wiring conductor 6, the electrode pad 4 and the sealing metallization layer. If 2 is made of tungsten metallization, an appropriate organic binder, solvent, plasticizer, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. For example, a plurality of ceramic green sheets are obtained by forming into a sheet shape by a sheet forming method such as a doctor blade method, and then, the ceramic green sheets are appropriately punched and the wiring conductors 6 and electrode pads 4 are sealed. A metal paste to be used as the metallizing layer 2 is printed and applied, and then the ceramic green With laminated bets vertically are manufactured by firing the stack at high temperatures.

  The exposed surfaces of the wiring conductor 6 and the electrode pad 4 prevent oxidative corrosion of the wiring conductor 6 and the electrode pad 4 and connect the wiring conductor 6 and the electrode pad 4 to the electrode of the piezoelectric vibrator 3 and the wiring conductor 6. The nickel plating layer having a thickness of about 10 to 20 μm and the gold plating layer 10 having a thickness of about 0.1 to 3 μm are sequentially deposited in order to strengthen the connection between the electrode and the external electric circuit. Good.

  Then, the piezoelectric vibrator 3 is housed in the concave portion 5, the electrode is connected to the electrode pad 4, and the lid body 7 is attached to the upper surface of the insulating base body 1 so as to close the concave portion 5. The piezoelectric vibrator 3 is hermetically sealed inside a container composed of 1 and a lid 7 to form a piezoelectric device. In the piezoelectric device, a portion of the wiring conductor 6 led out to the outer surface of the insulating base 1 is electrically and mechanically connected to an external electric circuit via solder or the like, and the piezoelectric vibrator 3 is connected to the external electric circuit with a predetermined amount. An oscillation signal is transmitted.

  In the piezoelectric vibrator housing package and the piezoelectric device according to the present invention, the sealing metallization layer 2 is covered with the gold plating layer 10 and is made of silicon via the gold-silicon alloy brazing material 11 on the upper surface of the insulating substrate 1. A lid 7 is attached so as to close the recess 5.

  With this configuration, after housing the piezoelectric vibrator 3 in the recess 5, the lid body 7 is joined and attached to the upper surface of the insulating base 1 via the gold-silicon alloy brazing material 11 having a low melting point of 300 to 400 ° C. Thus, mechanical destruction of the insulating substrate 1 due to heat can be effectively prevented, and the reliability of hermetic sealing can be improved. At the same time, a change in the frequency of the piezoelectric vibrator 3 due to the thermal history can be effectively prevented, and the accuracy of the frequency characteristics can be improved.

  In this case, since the metallizing layer 2 for sealing on the upper surface of the insulating base 1 is covered with the gold plating layer 10 and the lid 7 is made of silicon, the gold- Bonding via the silicon alloy brazing material 11 can be facilitated and strong. For example, the lower surface of the lid body 7 is brought into close contact with the upper surface of the insulating base 1 and heated, and the gold of the gold plating layer 10 and the silicon of the lid body 7 are mutually connected without any additional brazing material or the like. It can be diffused to form an alloy layer as a brazing material and bonded through this alloy layer. In addition, even if the width of the upper surface around the recess 5 (sealing width to which the lid body 7 is joined) is as narrow as about 0.2 to 0.5 mm, the hermetic sealing performance is improved. Excellent bonding is possible.

  Here, as a heating method for melting the gold-silicon alloy, a reflow furnace having a peak temperature that is about 50 ° C. higher than the melting point of the gold-silicon alloy is used. The insulating substrate 1 in which the piezoelectric vibrator 3 is accommodated is coated with a metal paste made of a metal powder of gold-silicon alloy on the metallizing layer 2 for sealing formed around the recess 5 on the upper surface of the insulating substrate 1. Then, the lid body 7 made of silicon is positioned so as to match the insulating base 1 and is placed in the reflow furnace, so that the piezoelectric vibrator 3 is hermetically sealed in the concave portion 5 of the insulating base 1.

  In this case, the thickness of the gold plating layer 10 is preferably 0.3 μm or more. If it is less than 0.3 μm, it is difficult to strengthen the bonding of the gold-silicon alloy brazing material 11. Moreover, if productivity and economical efficiency are considered, the range of 0.3 micrometer-0.5 micrometer is still more preferable.

  The gold plating layer 10 can be formed by a plating method such as an electrolytic method or an electroless method. For example, in the case of an electrolytic method, gold cyanide is used as a gold supply source, a pH adjusting agent, a complexing agent, etc. Can be formed by immersing the insulating substrate 1 on which the sealing metallization layer 2 is formed in a gold plating solution to which is added, and energizing the sealing metallization layer 2 at a predetermined current density and time. it can.

  Further, a base plating layer (not shown) such as a nickel plating layer or a copper plating layer may be interposed between the sealing metallization layer 2 and the gold plating layer 10. When a nickel layer or the like having excellent adhesion to both the sealing metallization layer 2 and the gold plating layer 10 is interposed as a base plating layer, the gold plating layer 10 can be attached to the sealing metallization layer 2. The strength can be further increased.

  In this case, for example, if the sealing metallization layer 2 is made of a tungsten metallization layer, the nickel plating layer having a thickness of about 2 μm to 10 μm is adhered to the sealing metallization layer 2 and the gold plating layer 10. In addition, it is preferable in terms of preventing peeling due to internal stress of the underlying plating layer.

  The lid made of silicon is formed by dicing a silicon substrate and cutting it to a predetermined dimension.

  In the piezoelectric vibrator housing package of the present invention, it is preferable that the outer periphery of the sealing metallization layer 2 extends to the upper end portion of the outer surface of the insulating substrate 1.

  As a result, when the lid 7 made of silicon is joined by the gold-silicon alloy brazing material 11, the sealing metallization layer 2 can be widely formed from the surface of the insulating base 1 to the upper end of the outer surface. -The bonding between the silicon alloy brazing material 11 and the sealing metallization layer 2 and the bonding between the sealing metallization layer 2 and the insulating substrate 1 can be strengthened, and the reliability of hermetic sealing is further improved. Can be made.

  Further, the bonding area between the sealing metallization layer 2 formed from the upper surface of the insulating substrate 1 to the upper end of the outer surface and the lid 7 can be widened by the thickness of the sealing metallization layer 2, and an extra portion is provided. Since the gold-silicon alloy brazing material 11 can be held on the metallizing layer 2 for sealing formed on the side surface of the insulating base 1, scattering of the gold-silicon alloy brazing material 11 into the recess 5 can be prevented. When the gold-silicon alloy brazing material 11 scatters in the recess 5, the scattered gold-silicon alloy brazing material 11 adheres to the electrode pad 4 and the like, and the electrical connection between the electrode pad 4 and the sealing metallized layer 2 is performed. A short circuit or the like may occur, and the piezoelectric vibrator 3 may not vibrate normally.

  Further, in the piezoelectric vibrator housing package and the piezoelectric device of the present invention, the electrode pad 4 to which the electrode of the piezoelectric vibrator 3 is connected is formed on the outer peripheral portion of the bottom surface of the recess 5, and the sealing metallized layer 2. Preferably, the non-forming portion 8 is formed at the inner peripheral end along the electrode pad 4 in plan view.

  If the electrode pad 4 is formed on the outer peripheral portion of the bottom surface of the concave portion 5, the piezoelectric vibrator 3 such as a crystal vibrator having an electrode on the lower surface of the end portion can be efficiently accommodated in the concave portion 5, and the piezoelectric vibration. Miniaturization of the child storage package and the piezoelectric device becomes easier.

  The piezoelectric vibrator 3 such as a quartz vibrator is usually in the shape of a rectangular plate, and electrodes are formed at one of the two corners on the short side, so that the electrode of the piezoelectric vibrator 3 is attached. The electrode pad 4 on the outer peripheral portion of the bottom surface of the recess 5 is formed at one of the two corners on the short side of the recess 5.

  Further, since the sealing metallized layer 2 has the non-formed portion 8 formed at the inner peripheral end along the electrode pad 4 in a plan view, the gold-silicon alloy brazing material 11 is formed on the concave portion 5 of the insulating base 1. When the lid 7 made of silicon can be bonded to the metallized layer 2 for sealing with the gold-silicon alloy brazing material 11, it can be effectively prevented from reaching the portion along the electrode pad 4 at the edge. It is possible to effectively prevent the gold-silicon alloy brazing material 11 from scattering from the joint surface between the lid 7 and the sealing metallized layer 2 to the upper surface of the electrode pad 4 in the recess 5.

  For example, when the metallized layer 2 for sealing is formed by printing a metal paste by a screen printing method, the non-formed part 8 forms a screen print pattern on the inner peripheral end along the electrode pad 4 of the recess 5. The portion 8 is formed by masking it.

  When the non-formed portion 8 is provided in the sealing metallized layer 2, the non-formed portion 8 is formed so as to be continuous along the inner periphery of the side on the short side of the upper surface around the recess 5. Is preferred. As a result, the gold-silicon alloy brazing material 11 is effectively prevented from being scattered particularly on the short side where the electrodes of the piezoelectric vibrator 3 are formed close to each other, and the piezoelectric vibrator 3 is made more surely normal. Can be operated. Of course, the non-forming part 8 may be provided over the entire inner circumference side of the upper surface around the recess 5.

  Here, by adjusting the thickness of the metallizing layer 2 for sealing to 10 to 30 μm, the amount of brazing material is adjusted so that the fillet of the internal gold-silicon alloy brazing material 11 ′ is formed in the non-formed part 8. Since the reliability of the bonding between the lid 7 and the metallizing layer 2 for sealing can be ensured by performing the above, there is no influence on the hermetic sealing performance.

  Thus, according to the above-described piezoelectric vibrator housing package and piezoelectric device of the present invention, the piezoelectric vibrator 3 is mounted in the recess 5 of the insulating base 1, and the electrode of the piezoelectric vibrator 3 and the metallized wiring conductor 6 are connected. After being electrically connected through the conductive adhesive 9, a lid 7 made of silicon is bonded to the sealing metallized layer 2, and the piezoelectric vibrator 3 is placed inside the container made of the insulating base 1 and the lid 7. By sealing hermetically, it is possible to provide an excellent piezoelectric device that can reliably operate the piezoelectric vibrator 3 accommodated therein.

  In this example, the insulating substrate 1 is formed by laminating three ceramic layers. However, the insulating substrate 1 may be formed by laminating ceramic layers other than three layers. There are electrode pads 4 at both ends instead of only one electrode pad 4, and non-formed portions 8 are formed on the upper surface of the metallization layer 2 for sealing at both ends, or non-formed portions 8 are formed over the entire inner circumference. Needless to say.

(A) And (b) is the top view and sectional drawing which show an example of embodiment of the piezoelectric vibrator accommodation package of this invention, and a piezoelectric device, respectively. (A) And (b) is the top view and sectional drawing which show the example of the conventional package for piezoelectric vibrator accommodation, and a piezoelectric device, respectively.

Explanation of symbols

1 .... Insulating substrate 2 .... Metalizing layer for sealing 3 .... Piezoelectric vibrator 4 .... Electrode pad 5 .... ··· Concavity 6 ······· Wiring conductor 7 ·········································································· Gold-silicon alloy brazing material

Claims (4)

An insulating base having a recess for accommodating the piezoelectric vibrator on the upper surface, a wiring conductor led out from the inside of the recess to the outer surface of the insulating base, and formed around the recess on the upper surface of the insulating base A sealing metallization layer, a gold plating layer covering the sealing metallization layer, and silicon attached via a gold-silicon alloy brazing material so as to close the concave portion on the upper surface of the insulating substrate. A piezoelectric vibrator housing package comprising a lid. 2. The package for accommodating a piezoelectric vibrator according to claim 1, wherein an outer periphery of the metallizing layer for sealing extends to an upper end portion of an outer surface of the insulating base. An electrode pad to which the electrode of the piezoelectric vibrator is connected is formed on the outer peripheral portion of the bottom surface of the concave portion, and the sealing metallization layer is not formed at the inner peripheral end along the electrode pad in plan view The package for housing a piezoelectric vibrator according to claim 1, wherein the package is formed. The piezoelectric vibrator housing package according to any one of claims 1 to 3, and a piezoelectric vibrator housed in the concave portion and having an electrode formed at an end portion thereof electrically connected to the wiring conductor And a lid attached to the upper surface of the insulating base so as to cover the concave portion.

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