JP5946616B2 - Wiring board - Google Patents

Description

  The present invention relates to a wiring board having a plurality of wiring board regions for mounting electronic components such as semiconductor elements.

  In recent years, with the miniaturization of electronic components such as semiconductor elements, wiring boards for mounting electronic components have also been miniaturized. A small wiring board is manufactured, for example, by manufacturing a wiring board called a multi-cavity wiring board in which a plurality of small wiring boards are arranged on a single mother board, and dividing them into small wiring boards. Has been.

  Such a wiring board has a wiring board area in which a plurality of small wiring boards are arranged vertically and horizontally and a peripheral area provided so as to surround the wiring board area. In the peripheral area, for example, positioning at the time of dividing the wiring board area into each wiring board and through holes used for positioning at the time of mounting electronic components and the periphery of the through holes are detected, and a shift in the wiring pattern is detected. And a mark for forming.

JP 2006-128298 A JP-A-2005-19690

  However, in the conventional technique, the mark for detecting the displacement of the wiring pattern is formed in the vicinity of the outer edge of the through hole over the entire circumference of the through hole. Therefore, the mark is made of a white material such as gold plating, for example. In the image processing for detecting the through hole, the light irradiated to the mark expands and scatters at the outer edge of the through hole. As a result, the boundary between the through-hole and the mark becomes unclear, the detection accuracy of the through-hole is lowered, and there is a possibility that the positioning accuracy during division and the positioning accuracy during mounting of the electronic component may be lowered.

  On the other hand, in order to separately provide the mark and the through hole, the area of the peripheral region provided so as to surround the wiring board region must be increased, which may increase the manufacturing cost.

  The present invention has been made in view of the above-described problems, and in a wiring board, a printed pattern of a wiring pattern is not deteriorated without reducing the detection accuracy of a through hole used for positioning at the time of division or mounting at the time of mounting an electronic component. An object is to provide a mark for detection.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
[Mode 1] A first area in which a plurality of wiring board areas each having a wiring pattern are arranged vertically and horizontally, a second area provided around the first area, and the second area And a through hole used for positioning the wiring board region of the first region through the bottom surface of the concave portion and the bottom surface of the concave portion. A mark including at least a first circular arc having a center on the bottom surface of the recess that is the same as the center of the through hole and having a radius larger than the radius of the through hole and smaller than the radius of the recess. A mark part for detecting a shift of the wiring pattern , and a width extending from an outer edge of the through hole to an outer edge of the hollow part, and extending along an arc of the through hole. An exposed portion that is exposed, the first circle of The arc forms an outer edge of the outer edge of the mark closest to the recess, and a gap having a width in the radial direction of the through hole is formed between the arc of the first circle and the outer edge of the through hole. And the bottom surface is exposed in the gap.

[Application Example 1]
A plurality of wiring board regions are formed on a first surface side of the first region, a second region provided around the first region, and a first surface side of the second region. And a through hole used for positioning of the wiring board region of the first region, wherein the bottom surface of the recess portion includes the through-hole. A mark portion having a mark at least including a first circular arc having a center that is the same as the center of the hole and having a radius larger than the radius of the through hole and smaller than the radius of the recess; A wiring board having a width extending from the outer edge of the hole to the outer edge of the recess and extending along the circumference of the through hole and exposing the bottom surface.

  According to the wiring board of Application Example 1, the bottom surface of the hollow portion in which the through hole for positioning the wiring board region is formed has the same center as the center of the through hole, and is larger than the radius of the through hole. Since the mark portion including at least the arc of the first circle having a radius smaller than the radius of the portion is provided, the displacement of the wiring pattern of the wiring board can be easily detected by detecting the displacement of the arc of the mark portion. it can. In addition, the bottom surface of the recess has an exposed portion extending from the outer edge of the through hole to the outer edge of the recess and extending along the circumference of the through hole. During the image processing, the outer edge of the through hole can be detected clearly, and the detection accuracy of the through hole can be improved. Therefore, by forming the mark portion so that the exposed portion is formed on the bottom surface of the recess portion, it is possible to detect the displacement of the wiring pattern and to accurately detect the through hole. In addition, since the mark portion is formed around the through hole, the area of the second region can be reduced and the manufacturing cost can be reduced as compared with the case where the through hole and the mark portion are separately formed separately. it can.

[Application Example 2]
The wiring board according to application example 1, wherein an area of the exposed portion and an area of the mark portion are substantially the same.

  According to the wiring board of Application Example 2, the exposed portion and the mark portion are formed so that their areas are substantially the same. Accordingly, it is possible to detect the deviation of the wiring pattern and the detection of the through hole without deviation.

[Application Example 3]
It is a wiring board of the application example 1 or the application example 2, Comprising: The wiring board by which the said exposed part and the said mark part are alternately provided along the circumference direction around the said through-hole.

  According to the wiring board of Application Example 3, the exposed portions and the mark portions are alternately provided around the through hole along the circumferential direction. The circumferential direction means a direction that rotates along the circumference of the through-hole with the center of the through-hole as an axis. Therefore, since the exposed portion and the mark portion are provided over the entire surface of the hollow portion, it is possible to improve the misalignment of the wiring pattern and the detection accuracy of the through hole.

[Application Example 4]
4. The wiring board according to any one of Application Examples 1 to 3, wherein four mark portions are arranged on a bottom surface of the hollow portion, and the first mark among the four mark portions. The part and the second mark part are arranged to face each other across the through hole in a plan view, and among the four mark parts, the third mark part and the fourth mark part are the plan view A wiring board, which is disposed so as to face each other with a through hole interposed therebetween so as not to overlap the first and third mark portions.

  According to the wiring board of Application Example 4, the first mark portion and the second mark portion, and the third mark portion and the fourth mark portion are arranged to face each other with the through-hole interposed therebetween in plan view. In addition, the first and third mark portions are arranged so as not to overlap. That is, each mark part is arranged so that one mark part is included in each of the areas obtained by dividing the bottom surface of the depression part into four equal parts by two straight lines passing through the center of the through hole and orthogonal to each other. Accordingly, it is possible to improve the accuracy of detection of the displacement of the wiring pattern.

[Application Example 5]
In the wiring board of Application Example 4, the first mark portion and the second mark portion are arranged symmetrically with respect to the center of the through hole, and the third mark portion and the second mark portion The four mark portions are arranged symmetrically with respect to the center of the through hole, and the midpoint of the arc of the first mark portion and the midpoint of the arc of the second mark portion are arranged. A wiring board in which a first straight line connecting, a midpoint of the arc of the third mark portion, and a second straight line connecting the midpoint of the arc of the fourth mark portion are orthogonal to each other.

  According to the wiring board of Application Example 5, the first mark portion and the second mark portion, and the third mark portion and the fourth mark portion are arranged point-symmetrically and adjacent to each other. The marks are arranged 90 degrees apart in the circumferential direction. Accordingly, it is possible to easily detect the displacement of the wiring pattern with high accuracy.

[Application Example 6]
The wiring board according to any one of Application Examples 1 to 5, wherein the mark portion has the same center as the center of the through hole, and is larger than the radius of the through hole, and the radius of the recess portion. The second circle arc different from the radius of the first circle, the first circle arc, and the both ends of each of the first circle arc and the second circle arc The exposed portion includes two straight lines extending in a radial direction from the center of the through hole, and the through hole existing between the two straight lines. A wiring board, which is a region composed of an outer edge and an outer edge of a recess.

  According to the wiring board of Application Example 6, the shape of the mark portion is 2 connecting the respective ends of the first circular arc, the second circular arc, the first circular arc, and the second circular arc. The shape of the exposed portion is defined by two straight lines extending in the radial direction from the center of the through hole, and the outer edge of the through hole and the outer edge of the recess portion existing between the two straight lines. It is prescribed. Therefore, the shape of the mark portion and the exposed portion can be easily defined.

[Application Example 7]
7. The wiring board according to any one of application examples 1 to 6, wherein the through hole is used for positioning when dividing the first area into the wiring board areas.

  According to the wiring board of Application Example 7, the through hole is used for positioning (reference) when the first area is divided into the wiring board areas. Therefore, the division accuracy can be improved.

[Application Example 8]
The wiring board according to any one of Application Examples 1 to 7, further comprising a wiring pattern,
The mark portion is formed on the bottom surface simultaneously with the formation of the wiring pattern.

  According to the wiring board of Application Example 8, the mark portion is formed simultaneously with the wiring pattern. Therefore, since the deviation amount between the wiring pattern and the mark portion matches, the detection accuracy of the positional deviation of the wiring pattern can be improved.

  In the present invention, the various aspects described above can be applied by appropriately combining or omitting some of them.

Explanatory drawing which illustrates schematic structure of the wiring board 10 in 1st Example. The enlarged plan view explaining the bottom face 100 of the hollow part 20 in 1st Example. Process drawing explaining the manufacturing process of the wiring board 10 in 1st Example. Explanatory drawing explaining formation of the through-hole for the through-hole 18 and the cavity 32 in 1st Example. Explanatory drawing explaining formation of the hollow part for the hollow part 20 and the cavity 32 in 1st Example. Explanatory drawing explaining formation of the through-hole for the hollow parts 20 in 1st Example. Explanatory drawing explaining metallization paste printing used as the mark 110 in 1st Example. The enlarged plan view explaining the bottom face 400 of the hollow part of the wiring board in the modification 1. The enlarged plan view explaining the bottom face 500 of the hollow part of the wiring board in the modification 2. The enlarged plan view explaining the bottom face 600 of the hollow part of the wiring board in the modification 3.

A. First embodiment:
A1. Wiring board schematic configuration:
FIG. 1 is an explanatory view illustrating a schematic configuration of a wiring board 10 in the first embodiment. FIG. 1A is a plan view from the lower surface side of the wiring board 10, and FIG. 1B is a cross-sectional view of the wiring board 10 taken along the line AA shown in FIG. The wiring board 10 is a so-called multi-piece wiring board.

  The wiring substrate 10 includes a first region 35 and a second region 36 provided around the first region 35. As shown in FIG. 1B, the wiring board 10 is configured by laminating a plurality of ceramic layers 12, 14, and 16. The ceramic layers 12, 14, and 16 are made of, for example, a material such as aluminum oxide or glass ceramic, and have a configuration such as a via conductor, a wiring pattern, and an electrode (not shown). In the first area 35, wiring board areas 30 for mounting electronic components such as semiconductor elements are arranged vertically and horizontally. Each wiring board region 30 has a cavity 32. The cavity 32 is formed in a hollow shape on the upper surface 12a side of the wiring board 10 for mounting electronic components. The wiring board area 30 is divided into individual small wiring boards (wiring board area 30). In the second region 36, the through hole 18 and the recessed portion 20 are formed. In the embodiment, the upper surface 12a corresponds to the “second surface” in the claims.

  The recess 20 is formed on the lower surface 16 a side of the wiring substrate 10 and has a depth penetrating the ceramic layers 14 and 16. Further, the recess 20 has a top surface 100. Since the top surface 100 becomes the bottom surface of the recessed portion 20 when viewed from the lower surface 16a side, the top surface 100 of the recessed portion 20 is hereinafter referred to as the bottom surface 100 for convenience of explanation. On the bottom surface 100, a mark 110 for detecting a printing deviation of a wiring pattern (not shown) of the wiring substrate 10 is formed. The mark 110 is formed of the same material as that for forming the wiring pattern, for example, an alloy composed of W and Mo. In the embodiment, the lower surface 16a corresponds to the “first surface” in the claims.

  The through hole 18 is formed on the upper surface 12 a side of the wiring substrate 10 so as to penetrate the center of the bottom surface 100 of the recess 20 and is used for positioning the wiring substrate region 30. In the present embodiment, the positioning of the wiring board region 30 includes positioning when the first region 35 is divided (cut) into individual wiring board regions 30, and positioning of electronic components in the cavities 32 of the wiring board region 30. Various positioning means such as positioning at the time of mounting are included.

  FIG. 2 is an enlarged plan view for explaining the bottom surface 100 of the recess 20 in the first embodiment. As shown in FIG. 2, the through hole 18 and the bottom surface 100 are concentric circles having the same center O. On the bottom surface 100, a first mark 110a, a second mark 110b, a third mark 110c, and a fourth mark for detecting a printing deviation of a wiring pattern (not shown) formed on the wiring board 10 are provided. A mark 110d and exposed portions 120a to 120d, which are the bottom surface 100 of the hollow portion 20 and from which the surface of the ceramic layer 12 is exposed, are provided. Hereinafter, in the embodiments, for convenience of explanation, the first mark 110a to the fourth mark 110d may be simply referred to as the mark 110, and the exposed portions 120a to 120d may be simply referred to as the exposed portion 120.

  The marks 110 and the exposed portions 120 are alternately provided along the circumferential direction Z around the through holes 18. In the embodiment, the circumferential direction means a direction that rotates along the circumference (outer edge) of the through hole 18 with the center O of the through hole 18 as an axis. Further, the mark 110 and the exposed portion 120 are formed to have substantially the same area.

  The mark 110 has at least the arc 115 of the first circle 70 having the same center as the center O of the through hole 18 and having a radius d3 larger than the radius d1 of the through hole 18 and smaller than the radius d2 of the recess 20. It is formed in a shape, and is formed on the bottom surface 100 by screen printing simultaneously with the wiring pattern of the wiring substrate 10. Specifically, in the first embodiment, the mark 110 has the arc 115 of the first circle 70 and a second radius d4 that is larger than the radius d3 of the first circle 70 and less than or equal to the radius d2 of the recess 20. Is an area surrounded by the arc 118 of the circle 80 and two straight lines (straight line 116, straight line 117) that connect both ends of the arc 115 and the arc 118. For example, the first mark 110a is surrounded by an arc 115a of the first circle 70, an arc 118a of the second circle 80, and a straight line 116a and a straight line 117a that connect both ends of the arc 115a and the arc 118a. This is a substantially fan-shaped region. By forming in this shape, a gap 130 having a width d5 is formed in the radial direction of the through hole 18 between the arc 115 on the through hole 18 side of the mark 110 and the outer edge 122 of the through hole 18. Due to the presence of the gap 130, the deviation (for example, direction and position) of the arc 115 with respect to the through hole 18 can be easily confirmed, and the positional deviation of the print pattern formed simultaneously with the mark 110 can be easily detected. .

  The first mark 110a and the second mark 110b are arranged point-symmetrically with the center O of the through hole 18 as a symmetric point, and the third mark 110c and the fourth mark 110d are They are arranged point-symmetrically with the center O as the symmetry point. Furthermore, the first mark 110a to the fourth mark 110d are a first straight line X connecting the midpoint m1 of the arc 115a of the first mark 110a and the midpoint m2 of the arc 115b of the second mark 110b. The second straight line Y connecting the midpoint m3 of the arc 115c of the third mark 110c and the midpoint m4 of the arc 115d of the fourth mark 110d is arranged so as to be orthogonal. That is, each of the four marks 110 is disposed 90 degrees away from the adjacent marks 110 in the circumferential direction of the through hole 18. The first straight line X is a straight line along the vertical direction in the arrangement direction of the wiring board region 30, and the second straight line Y is a straight line along the horizontal direction in the arrangement direction of the wiring board region 30. The first straight line X and the second straight line Y are virtual straight lines and are not provided on an actual wiring board.

  The exposed portion 120 has a width w1 extending from the outer edge of the through hole 18 to the outer edge of the recessed portion 20, and extends along the arc of the through hole 18 so that the bottom surface 100 of the ceramic layer 12 is exposed. is there. Specifically, the exposed portion 120 includes two straight lines (straight line 116 and straight line 117) extending in the radial direction from the center O of the through hole 18, and the through hole 18 existing between the two straight lines 116 and 117. This is a substantially fan-shaped region (region surrounded by points P1, P2, P3, and P4) surrounded by the outer edge 122 and the outer edge 124 of the recess. By providing the exposed portion 120, there is a region where the mark 110 for detecting a print misalignment of the wiring pattern does not exist in the radial direction of the through hole 18 from the arc of the through hole 18. At the time of image processing, the edge (outer edge 122) of the through hole 18 becomes clear, and the detection accuracy of the through hole 18 can be improved.

  In the first embodiment, the straight lines 116 and 117 that constitute the exposed portion 120 and the straight lines 116 and 117 that constitute the mark 110 are the same straight line, but the straight line that constitutes the exposed portion 120 and the mark 110. May be different straight lines.

A2. Manufacturing process:
A manufacturing process of the wiring board 10 will be described with reference to FIGS. FIG. 3 is a process diagram for explaining the manufacturing process of the wiring board 10 in the first embodiment.

A green sheet made of ceramics to be the wiring board 10 is formed (step S10). Specifically, after mixing ceramic powder as a material of the green sheet at a predetermined ratio, a plasticizer and a solvent are added to form a slurry, and the resulting slurry is converted into a doctor blade method, a rolling method, a calender roll method, a gold It is formed into a sheet having a thickness of several hundreds of micrometers by a die press method or the like. The ceramic powder used as the material of the green sheet includes, for example, Al ₂ O ₃ , Al ₂ O ₃ —SiO ₂ —ZrO ₂ and a complex oxide of an alkaline earth metal oxide, TiO ₂ and an alkaline earth metal oxide, Composite oxide, spinel, mullite cordierite, and the like.

  A through hole for arranging a conductor via (not shown), a through hole 18 for positioning the wiring board region 30, a cavity 32, and a recess 20 are formed in the formed green sheet (step S12). Specifically, the green sheet formed in step S10 is punched to form a through hole or a depression.

  FIG. 4 is an explanatory view for explaining the formation of the through hole 18 and the through hole for the cavity 32 in the first embodiment. FIG. 5 is an explanatory diagram for explaining the formation of the recess 20 and the through hole for the cavity 32 in the first embodiment. FIG. 6 is an explanatory diagram for explaining the formation of the through hole for the recess 20. As shown in FIG. 4A, a green sheet 212 to be the ceramic layer 12 is placed on a die 302, and the green sheet 212 is pressed with a mold 300 to perform punching. The mold 300 forms a first punching pin 304 for forming the through hole 18, a second punching pin 306 for forming the cavity 32, and a through hole for arranging a conductor via (not shown). Provided with a punching pin (not shown). By punching, as shown in FIG. 4B, the through hole 230 that becomes the cavity 32 is formed in the first region 35, and the through hole 18 is formed in the second region 36. Thus, the through hole 18 for positioning in the wiring board region 30 and the through hole 230 that becomes the cavity 32 are simultaneously punched and formed using the same mold 300, so that the through hole 18 and the cavity 32 are formed. And the positional deviation is suppressed. In FIG. 4, for convenience of explanation, the through hole 18 and the through hole 230 are shown to be formed in the same cross section.

  Next, as shown in FIG. 5A, the green sheet 214 to be the ceramic layer 14 is disposed on the die 312, and the green sheet 214 is pressed with a mold 310 to perform punching. The mold 310 includes a first punching pin 314 for forming a through hole that becomes the recessed portion 20 and a second punching pin 316 for forming a through hole that becomes the cavity 32. By punching, as shown in FIG. 5B, a through hole 232 to be the cavity 32 is formed in the first region 35, and a through hole 220 to be the recessed portion 20 is formed in the second region 36. The Note that the diameter of the second punching pin 316 (corresponding to the width when the shape of the punching pin is square) is slightly larger than the diameter (width) of the second punching pin 306 of the mold 300 shown in FIG.

Next, as shown in FIG. 6A, a green sheet 216 to be the ceramic layer 16 is placed on a die 322, and the green sheet 216 is pressed with a mold 320 to perform punching. The mold 320 includes a punching pin 324 for forming a through hole that becomes the recess 20. By the punching process, as shown in FIG. 6B, a through hole 220 that becomes the recessed portion 20 is formed in the second region 36.

  A conductor paste to be a wiring via conductor is filled in through holes for wiring via conductors (not shown) of the green sheets 212, 214, and 216 (step S14).

  On the surface of the green sheets 212 and 216 filled with the conductor paste, the metallized paste that becomes the mark 110 for detecting the misalignment of the wiring pattern is printed together with the printing of the metallized paste that becomes the wiring pattern (step S16). FIG. 7 is an explanatory diagram for explaining metallized paste printing to be the mark 110 in the first embodiment. A metallized paste 210 to be the mark 110 is applied to a portion of the surface of the green sheet 212 corresponding to the bottom surface 100 of the recess 20 by screen printing or the like. The metallized paste 210 is a paste made of tungsten, molybdenum, silver, copper, or the like.

  The green sheets 212, 214, and 216 formed as described above are stacked (step S18). When the green sheets 212, 214, and 216 are laminated, the through holes 230 and 232 become the cavities 32, and the through holes 220 become the recessed portions 20.

The stacked green sheets 212, 214, and 216 are fired (step S20). In the first embodiment, the ceramic powder of the green sheets 212, 214, and 216 uses Al ₂ O ₃ and is fired at about 1400 ° C to 1600 ° C.

  By firing in step S20, the green sheets 212, 214, and 216 become the ceramic layers 12, 14, and 16, and the metallized paste 210 becomes the mark 110.

  As described above, the wiring board 10 is manufactured. The surface of the wiring board 10 may be plated with nickel (Ni) or gold (Au).

  According to the wiring board 10 of the first embodiment described above, the same center as the center O of the through hole 18 is formed on the bottom surface 100 of the recess 20 in which the positioning through hole 18 in the wiring board region 30 is formed. The mark 110 including at least the arc 115 of the first circle 70 having a radius larger than the radius d1 of the through hole 18 and smaller than the radius d2 of the recess 20 is provided. Accordingly, by detecting the positional deviation of the arc 115 of the mark 110, the deviation of the wiring pattern in the wiring board region 30 can be easily detected. Further, an exposed portion 120 having a width w1 extending from the outer edge 122 of the through hole 18 to the outer edge 124 of the recessed portion 20 and extending along the circumference of the through hole 18 is provided on the bottom surface 100 of the recessed portion 20. ing. Therefore, in the image processing for detecting the through hole 18, the outer edge 122 of the through hole 18 can be clearly detected, and the detection accuracy of the through hole 18 can be improved. Therefore, by forming the mark 110 on the bottom surface 100 of the recess 20 so that the exposed portion 120 is formed, it is possible to detect the displacement of the wiring pattern without reducing the detection accuracy of the through hole 18. .

  Further, according to the wiring substrate 10 of the first embodiment, the exposed portion 120 and the mark 110 are formed so that their areas are substantially the same. Accordingly, it is possible to detect the deviation of the wiring pattern and the detection of the through hole without deviation.

  Further, according to the wiring substrate 10 of the first embodiment, the exposed portions 120 and the marks 110 are alternately and repeatedly provided along the circumferential direction Z around the through holes 18. Therefore, since the exposed part 120 and the mark 110 are provided over the entire surface of the recessed part 20, it is possible to improve the misalignment of the wiring pattern and the detection accuracy of the through hole 18.

  Further, according to the wiring board 10 of the first embodiment, the first mark 110a and the second mark 110b, and the third mark 110c and the fourth mark 110d each have a center O of the through hole 18. As symmetrical points, the marks 110a to 110d which are arranged point-symmetrically and are adjacent to each other are arranged 90 degrees apart in the circumferential direction Z. Therefore, the displacement of the wiring pattern can be easily visually recognized (detected).

  Further, according to the wiring board 10 of the first embodiment, the shape of the mark 110 is such that the arc 115 of the first circle 70, the arc 118 of the second circle 80, the arc 115, and the arc 118 are connected to both ends. The exposed portion 120 is shaped between two straight lines 116 and 117 extending radially from the center O of the through hole 18 and the two straight lines 116 and 117. The outer edge 122 of the existing through-hole 18 and the outer edge 124 of the recess 20 are defined. Accordingly, the shapes of the mark 110 and the exposed portion 120 can be easily defined.

  Further, according to the wiring substrate 10 of the first embodiment, the through hole 18 is used for positioning when the first region 35 is divided (cut) into the wiring substrate regions 30. Accordingly, the wiring board region 30 can be accurately divided (cut) into a desired shape.

B. Variations:
Below, the various aspects of the mark in the bottom face of the hollow part of a wiring board are demonstrated as a modification. In the following modifications, members having the same functions and configurations as those of the first embodiment, such as the ceramic layer 12, are denoted by the same reference numerals as those of the first embodiment.

B1. Modification 1:
FIG. 8 is an enlarged plan view for explaining the bottom surface 400 of the recessed portion of the wiring board in the first modification. On the bottom surface 400, there are four first marks 410a, second marks 410b, third marks 410c, and first marks for detecting a printing misalignment of a wiring pattern (not shown) of the wiring board of Modification 1. 4 marks 410d and an exposed portion 420 where the surface of the ceramic layer 12 is exposed are provided. The first mark 410a, the second mark 410b, the third mark 410c, and the fourth mark 410d are larger than the radius of the through hole 18 and the radius of the bottom surface 400 (in other words, the radius of the recess). An arc having the following radius is included. For example, the first mark 410 a includes an arc 415. A gap 430 exists between the outer edge of the through hole 18 and the arc 415 as described in the first embodiment.

  The first mark 410a and the second mark 410b are arranged to face each other across the through hole 18 in a plan view, and the third mark 410c and the fourth mark 410d sandwich the through hole 18 in a plan view. It is arranged facing each other. The first mark 410a and the third mark 410c are arranged so as not to overlap. That is, as shown in FIG. 8, the first mark 410a to the fourth mark 410d are equally divided into four by two straight lines X1 and Y1 that pass through the through hole 18 and the center O of the bottom surface 400 and are orthogonal to each other. One is arranged in each area.

  The exposed portion 420 includes two straight lines 416 and 417 extending in the radial direction of the through-hole 18 from the center O of the through-hole 18, and the outer edge and the bottom surface 400 (the depression) between the straight lines 416 and 417. Part) and is arranged so as not to overlap the first mark 410a to the fourth mark 410d.

  According to the wiring board of the first modification described above, the first mark 410a to the fourth mark 410d are formed by the two straight lines X1 and Y1 passing through the center O of the through hole 18 and perpendicular to the bottom surface 400 of the hollow portion. Each area divided into four equal parts is arranged in a well-balanced manner on the bottom surface 400 so that each mark is included one by one. Accordingly, it is possible to improve the accuracy of detection of the displacement of the wiring pattern.

B2. Modification 2:
FIG. 9 is an enlarged plan view for explaining a bottom surface 500 of the recessed portion of the wiring board in the second modification. The bottom surface 500 is provided with a mark 510 for detecting a printing misalignment of a wiring pattern (not shown) of the wiring board of Modification 2 and an exposed portion 520 where the surface of the ceramic layer 12 is exposed.

  The exposed portion 520 includes two straight lines 516 and 517 extending in the radial direction of the through hole 18 from the center O of the through hole 18, and the outer edge 522 and the bottom surface 500 (recessed portion) of the through hole 18 existing between the straight lines 516 and 517. ) And an outer edge 524 of the substantially fan-shaped region.

  The mark 510 includes a circular arc 515 having a radius that is larger than the radius of the through hole 18 and equal to or less than the radius of the bottom surface 500 (in other words, the radius of the recess). A gap 530 exists between the outer edge 522 of the through hole 18 and the arc 515.

  According to the wiring board of the modified example 2 described above, the mark 510 includes the arc 515 having a radius larger than the radius of the through hole 18 and smaller than the radius of the bottom surface 500 (in other words, the radius of the recess). Even when the area of the mark 510 is smaller than that of the exposed portion 520, the printed pattern of the wiring pattern can be confirmed. On the other hand, as the area of the exposed portion 520 increases, the detection accuracy of the through hole 18 can be improved. Moreover, since the area of the mark 510 is smaller than that of the first embodiment or the first modification, the amount of metallized paste used as the mark 510 can be reduced, and the manufacturing cost can be suppressed.

B3. Modification 3:
FIG. 10 is an enlarged plan view for explaining the bottom surface 600 of the recessed portion of the wiring board in the third modification. The bottom surface 600 is provided with a mark 610 for detecting a printing deviation of a wiring pattern (not shown) of the wiring board of Modification 3 and an exposed portion 620 where the surface of the ceramic layer 12 is exposed.

  The mark 610 of Modification 3 passes through each of the circular arc 615 having a radius larger than the radius of the through-hole 18 and less than the radius of the bottom surface 600 (in other words, the radius of the recess), and both ends of the arc 615. This is an approximately triangular region surrounded by two straight lines 618 and 619.

  The exposed portion 520 includes two straight lines 616 and 617 extending in the radial direction of the through hole 18 from the center O of the through hole 18, and an outer edge 622 and a bottom surface 600 (recessed portion) between the straight holes 616 and 617. ) And an outer edge 624 of the substantially fan-shaped region.

  In the first embodiment and other modifications described above, the mark has a substantially sector shape. However, as shown in Modification 3, the mark 610 has a radius larger than the radius of the through hole 18 and smaller than the radius of the recess. Any mark (figure) may be used as long as it includes a circular arc 615 having a circle.

  As mentioned above, although the various Example of this invention was described, this invention is not limited to these Examples, A various structure can be taken in the range which does not deviate from the meaning.

DESCRIPTION OF SYMBOLS 10 ... Wiring board 12, 14, 16 ... Ceramics layer 12a ... Upper surface 16a ... Lower surface 18 ... Through-hole 20 ... Depression part 30 ... Wiring board 32 ... Cavity 35 ... 1st area | region 36 ... 2nd area | region 70 ... 1st Circle 80 ... Second circle 100, 400, 500, 600 ... Bottom 110, 510, 610 ... Mark 110a, 410a ... First mark 110b, 410b ... Second mark 110c, 410c ... Third mark 110d, 410d ... fourth mark 115, 115a, 115b, 115c, 115d ... arc 116, 116a, 117, 117a ... straight line 118, 118a ... arc 120, 120a, 420, 520, 620 ... exposed portion 122 ... outer edge 124 of through hole ... Outer edge 130 of the hollow portion ... Ceramic layer 210 Metallized paste 212, 214, 21 ... green sheets 220, 230 ... through hole 300, 310 ... die 302, 312 ... die 304,306,314 ... punching pins 415,515,615 ... arc 416,417,516,517,616,617,618 ... linear

Claims (7)

A first region in which a plurality of wiring board regions each having a wiring pattern are arranged vertically and horizontally;
A second region provided around the first region;
A recess formed on the first surface side of the second region;
A through-hole that penetrates the bottom surface of the recess and is used for positioning the wiring board region of the first region;
A wiring board comprising:
On the bottom of the recess,
The wiring pattern in which a mark having at least a first circular arc having the same center as the center of the through hole and having a radius larger than the radius of the through hole and smaller than the radius of the recess is arranged . A mark portion for detecting deviation ,
An exposed portion having a width extending from an outer edge of the through-hole to an outer edge of the recessed portion and extending along an arc of the through-hole, wherein the bottom surface is exposed;
Have
The arc of the first circle forms the outer edge of the outer edge of the mark closest to the through hole;
A wiring board, wherein a gap having a width in the radial direction of the through hole is formed between the arc of the first circle and the outer edge of the through hole, and the bottom surface is exposed in the gap. The wiring board according to claim 1,
The area of the exposed portion and the area of the mark portion are substantially the same.
Wiring board. The wiring board according to claim 1 or 2,
The exposed portions and the mark portions are alternately provided around the through hole in a circumferential direction.
Wiring board. A wiring board according to any one of claims 1 to 3,
Four mark portions are arranged on the bottom surface of the hollow portion,
Of the four mark parts, the first mark part and the second mark part are arranged facing each other across the through hole in plan view,
Of the four mark portions, the third mark portion and the fourth mark portion are arranged so as to face each other across the through hole in a plan view so as not to overlap the first and third mark portions. ing,
Wiring board. The wiring board according to claim 4,
The first mark part and the second mark part are arranged symmetrically with respect to the center of the through hole as a symmetry point,
The third mark portion and the fourth mark portion are arranged symmetrically with respect to the center of the through hole as a symmetric point,
A first straight line connecting a midpoint of the arc of the first mark portion and a midpoint of the arc of the second mark portion; a midpoint of the arc of the third mark portion; The second straight line connecting the midpoint of the arc of the fourth mark portion is orthogonal to
Wiring board. A wiring board according to any one of claims 1 to 5,
The mark portion has the same center as the center of the through hole, is larger than the radius of the through hole, is equal to or less than the radius of the recessed portion, and is different from the radius of the first circle. An area surrounded by an arc, an arc of the first circle, and two straight lines connecting both ends of the arc of the first circle and the arc of the second circle,
The exposed portion includes two straight lines extending in the radial direction from the center of the through-hole, and an outer edge of the through-hole and an outer edge of the hollow portion existing between the two straight lines.
Wiring board. A wiring board according to any one of claims 1 to 6,
The through hole is used for positioning when the first region is divided for each wiring board region.
Wiring board.

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