JP2020113725A - Manufacturing method of wiring board - Google Patents

Abstract

To provide a manufacturing method of a wiring board making it possible to form a front surface conductor layer and a back surface conductor layer with high positional accuracy for each predetermined position on the front and back surfaces of the board body formed by stacking a plurality of insulating layers.SOLUTION: A manufacturing method of a wiring board 1 includes: a step of preparing a plurality of insulating layers G1 to G3; a first hole step of forming a first positioning hole H1 for each of the insulating layers G1 to G3; a surface conductor layer step of forming a surface conductor layer 5 on a surface of the insulating layer G1 forming a surface 3 among the insulating layers G1 to G3; a stacking step of stacking the insulating layers G1 to G3 and press-bonding to form a board body 2m so that the first positioning holes H1 are overlapped with each other along a stacking direction by making the insulating layer G1 on the surface of which the surface conductor layer 5 is formed to be an outermost layer; a second hole step of forming a plurality of second positioning holes H2 penetrating between the front surface 3 and a back surface 4 of the board body 2m by making the surface conductor layer 5 as a reference; and a back surface conductor layer step of forming a back conductor layer 6 on the back surface 4 of the board body 2m with reference to the plurality of second positioning holes H2.SELECTED DRAWING: Figure 2

Description

The present invention is a method of manufacturing a wiring board, which is formed by laminating a plurality of insulating layers, and in which a conductor layer can be accurately arranged at predetermined positions on both the front surface and the back surface of a substrate body having a front surface and a back surface facing each other. Regarding

For example, in a central portion of the main surface, rectangular wiring board regions are vertically and horizontally adjacently arranged in an array, and a mother substrate in which frame-shaped dummy regions are located around them is formed on the main surface of the mother substrate. A plurality of grooves formed along the boundaries between the wiring board areas and the boundaries between the wiring board areas and the dummy areas, and a plurality of grooves formed in the dummy areas so as to be located on extension lines of the grooves. Has been proposed (for example, see Patent Document 1).
According to the multi-cavity wiring board, since the mother board can be divided into a plurality of wiring boards based on the holes, it is possible to prevent the occurrence of a deviation between the alignment mark and the actual boundary, and therefore, at each boundary. The mother substrate can be cut along with high positional accuracy.

However, in the above-described multi-cavity wiring board, the cutting position for each wiring board area and the position of the wiring conductor on one surface (main surface) can be accurately determined, while facing each other wiring board area. It may be difficult to individually and accurately form the conductor layer for each predetermined amount on the front surface and the back surface.
For example, when a plurality of insulating layers are laminated to form the mother substrate, even if a conductor layer is formed with high positional accuracy on each surface (or back surface) of each insulating layer, when these insulating layers are laminated. When a stacking deviation occurs in the wiring board, when the obtained mother board is cut and divided into wiring boards, the positions of the two conductor layers individually formed on the front surface and the back surface facing each other are shifted from each other. There was a risk that it would end up.

JP-A-2006-128298 (pages 1 to 8, FIG. 1)

The present invention solves the problems described in the background art and forms a front surface conductor layer and a back surface conductor layer with high position accuracy at predetermined positions on the front surface and the back surface of a substrate body formed by laminating a plurality of insulating layers. An object of the present invention is to provide a method of manufacturing a wiring board that can be performed.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-mentioned problems, the present invention provides a plurality of insulating layers in which first positioning holes are individually formed in advance, at a predetermined position on the surface of the first insulating layer which will be the surface of the substrate body later. After forming a surface conductor layer and forming a second positioning hole between the front surface and the back surface of the substrate body obtained by laminating the insulating layer and another insulating layer, the second positioning hole is formed. It is made in view of forming a back surface conductor layer on the back surface of the substrate body with reference to the positioning hole.
That is, a method of manufacturing a wiring board according to the present invention (claim 1) is a board body having a plurality of insulating layers laminated and having a front surface and a back surface facing each other, and a surface formed on the surface of the board body. A method for manufacturing a wiring board, wherein a conductor layer and a back surface conductor layer formed on the back surface are formed at predetermined positions with respect to each other in a plan view, comprising: a preparatory step of preparing the plurality of insulating layers; First hole forming step of forming a first positioning hole for each insulating layer, and forming a surface conductor layer on the surface of at least the insulating layer constituting the surface of the plurality of insulating layers Step, and stacking and crimping the plurality of insulating layers so that the insulating layer having the surface conductor layer formed on the surface is the outermost layer and the first positioning holes overlap each other along the stacking direction. And a second hole forming step of forming a plurality of second positioning holes penetrating between the front surface and the back surface of the substrate body with reference to the surface conductor layer, And a back surface conductor layer forming step of forming a back surface conductor layer on the back surface of the substrate body with the plurality of second positioning holes as a reference.

According to the method for manufacturing the wiring board, the following effects (1) to (3) can be obtained.
(1) In the laminating step, when the plurality of insulating layers are laminated and pressure-bonded, even if the central axes of the first positioning holes individually formed in advance are misaligned with each other, after the laminating step, And the plurality of insulating layers are integrally laminated to penetrate between the front surface and the back surface of the substrate body, the second positioning hole is formed with the surface conductor layer as a reference, and the second positioning hole is used as a reference. A back conductor layer is formed on the back surface of the substrate body. Therefore, the positional relationship between the front surface conductor layer and the back surface conductor layer formed in advance on the surface of the substrate body is clear, and the front surface conductor layer and the back surface conductor layer are arranged at required positions in a plan view. The printed wiring board can be reliably manufactured.
(2) With the effect (1), as described later, by electrically connecting the front surface conductor layer and the back surface conductor layer, for example, the surface conductor layer of the wiring board obtained by the present invention It is possible to ensure reliable and stable electrical connection between an electronic component that is mounted upwardly and a motherboard such as a printed circuit board on which the wiring board is mounted via the back surface conductor. Becomes
(3) Since the positional relationship between the front surface conductor layer and the back surface conductor layer is clear when the wiring board is formed as a substrate for taking a large number of wiring boards, individual wirings are made with reference to the front surface conductor layer. Even when the substrate (substrate region) is cut and solidified, the situation where the back surface conductor layer is inadvertently cut or the distance from the outer peripheral edge of the wiring board to the above-mentioned back surface conductor layer becomes insufficient. Can be prevented.

The insulating layer is made of ceramic (for example, alumina) or resin (for example, epoxy resin).
Further, the front surface and the back surface are relative names, and when one of a pair of surfaces of the substrate body facing each other is called a front surface, the other is called a back surface.
Further, when the insulating layer is a high temperature co-fired ceramic such as alumina, the front surface conductor layer and the back surface conductor layer, and inner layer wirings and via conductors described later are made of tungsten (hereinafter simply referred to as W) or molybdenum. (Hereinafter, simply abbreviated as Mo), and in the case of a low temperature co-fired ceramic such as glass-ceramic or the above resin, it is made of copper (Cu) or silver (Ag).
The shape of the outer shape of the first and second positioning holes in a plan view is a circular shape, an oval shape, or a regular polygonal shape of a quadrangle or more or a deformed polygonal shape (for example, a rectangular shape).
Further, the first and second positioning holes are formed by laser processing as well as punching, and at least two or more (plural) of these holes are punched.
In addition, when the front surface conductor layer is used as a reference in the second hole forming step and the second positioning hole is used as a reference in the back surface conductor forming step, a part of the front surface conductor layer or a second positioning hole is used. The above steps are performed by recognizing the image taken by the image processing means for taking an image with the center of the image as a reference.
In addition, it is recommended that each of the steps be carried out in a multi-cavity form.

Further, in the present invention, the plurality of insulating layers include a rectangular product region located on the center side in a plan view and a rectangular frame-shaped ear portion surrounding the periphery of the product region. The positioning hole and the second positioning hole also include a method of manufacturing a wiring board (claim 2), which is individually formed for each different side in the ear portion.
According to this, since the first positioning hole and the second positioning hole are individually formed for each different side in the ear portion, for example, the first positioning hole and the second positioning hole are penetrated into the board body of the wiring board that constitutes the product area. A wiring board having the front surface conductor layer and the back surface conductor arranged at predetermined positions on the front surface and the back surface of the board body can be easily manufactured even if it has no holes or side surface conductors. .. Therefore, the effects (1) and (3) can be easily obtained.
The product area may have a configuration in which a plurality of the wiring boards are juxtaposed vertically and horizontally adjacent to each other in plan view, or may be a single wiring board later.

Further, in the present invention, the plurality of insulating layers include a rectangular product region located on the center side in a plan view and a rectangular frame-shaped ear portion surrounding the periphery of the product region. The wiring board manufacturing method (claim 3) is also included, in which the positioning holes are individually formed for different sides in the ear portion, and the second positioning holes are formed in the product region. ..
According to this, the first positioning hole is individually formed for each different side in the ear portion, and the second positioning hole is formed in the product region. A through hole penetrating between the front surface and the back surface of the substrate body of any of the wiring boards constituting the above can be formed and used as the second positioning hole in the second hole forming step. Therefore, the effects (1) and (3) can be obtained while reducing the number of processing steps.

Further, in the present invention, the plurality of insulating layers include a rectangular product region located on the center side in a plan view and a rectangular frame-shaped ear portion surrounding the periphery of the product region. The positioning hole is individually formed for each different side in the ear portion, and the second positioning hole straddles the boundary between the product region and the ear portion, and is in plan view. Also included is a method of manufacturing a wiring board (claim 4), which is formed on different sides of the ears.
According to this, the first positioning hole is individually formed for each different side in the ear portion, and the second positioning hole extends over the boundary between the product region and the ear portion. In addition, the ears are formed on different sides in plan view. Therefore, for example, in the substrate area of the wiring board located outside the product area, when forming a recess for forming a side surface conductor on the side surface adjacent to the ear portion, the wiring board and the ear portion are straddled. By using part of the second positioning hole formed in this way as the concave portion, it is possible to obtain the effects (1) and (3) while reducing the number of processing steps.

Furthermore, in the present invention, the second positioning hole is on a diagonal virtual straight line that passes through two corner regions diagonally located in a plan view among four corner regions including four corners of the product region. Two or more are formed, or two or more are formed on a parallel virtual straight line that passes through two corner regions that face each other in parallel with the sides of the product region in a plan view, and on the diagonal virtual straight line. One or more are formed, or on an opposing virtual straight line passing through another two corner regions opposite to the two corner regions passing through the parallel virtual straight line in plan view, and the midpoint of the product region Or two or more are formed on the parallel virtual straight line, or two or more are formed on the parallel virtual straight line in plan view and two or more are formed on the opposing virtual straight line. Also included is a method for manufacturing a wiring board (claim 5).
According to this, the second positioning hole is provided in each corner area of the product area, the ear portion located in the corner area, or near the center (middle point) of one side of the product area, or Is formed at the midpoint of the ear near the. Therefore, the positions where the plurality of second positioning holes are to be formed can be easily set apart from each other. Therefore, since the positioning accuracy of the front surface conductor layer and the back surface conductor layer can be increased and stabilized, the effects (1) and (3) can be more reliably obtained.
The corner area is a rectangular area that has both one corner and the adjacent ear in the product area, and has a plan view of about 30 mm×30 mm, for example.

In addition, according to the present invention, an inner layer wiring is formed between the plurality of insulating layers, and the inner layer wiring includes the front surface conductor layer and the back surface via a via conductor penetrating the insulating layer. Also included is a method of manufacturing a wiring board (claim 6), which is individually electrically conductive with the conductor layer.
According to this, since the front surface conductor layer and the back surface conductor layer are electrically connected to each other through the inner layer wiring and the via conductor, the effect (2) can be reliably obtained.

(A) is a plan view showing an insulating layer used in the present invention, (B1) is a vertical sectional view thereof, (B2) is an enlarged sectional view of (B1), and (C) is a first hole of the present invention. Schematic diagrams showing the forming step and the surface conductor layer forming step, (D) is a schematic diagram showing the laminating step of the present invention, and (d) is an enlarged view of a one-dot chain line portion in (D). (A1) and (A2) are a plan view and an enlarged vertical sectional view showing the second hole forming step of the present invention, (B) is a schematic sectional view showing the back surface conductor layer forming step of the present invention, and (C) is , A schematic sectional view showing a firing step, and (D) is a schematic sectional view showing a plurality of wiring boards obtained in the dividing step. (A) is a plan view showing a corner region, a diagonal virtual straight line, a parallel virtual straight line, and an opposing virtual straight line in the insulating layer used in the present invention, and (B) has a second positioning hole in the product region. FIG. 6 is a plan view showing a first hole forming step and a surface conductor layer forming step in the embodiment. FIG. 3A is a plan view showing a second hole forming step following FIG. 3B, and FIG. 3B shows a form in which a second positioning hole is formed across the boundary between the product region and the ear. FIG. (A), (B) is a top view which shows the form which formed the 2nd positioning hole in a different position in the said insulating layer. (A), (B) is a top view which shows the form which formed the 2nd positioning hole in the insulating layer in another position further.

Hereinafter, modes for carrying out the present invention will be described.
Alumina powder, a binder resin, a solvent, a plasticizer, and the like are mixed in advance in appropriate amounts to prepare a ceramic slurry, and the ceramic slurry is formed into a sheet by the doctor blade method, as shown in FIGS. 1(A) and 1(B1). , (B2), three layers of ceramic green sheets (insulating layers, hereinafter simply referred to as green sheets) Gn for preparing a large number and having a pair of opposing surfaces were prepared (preparation step).
Each of the green sheets Gn is located on the center side in a plan view, and has a rectangular product area Pa having a plurality of substrate areas 2a adjacent to each other vertically and horizontally, and a rectangular frame shape surrounding the periphery of the product area Pa. It consists of the ears Fa. The boundary between the product area Pa and the ear portion Fa is partitioned by an imaginary planned cutting surface 9 indicated by a broken line in FIG.
Note that, in FIG. 1 and FIG. 2 described later, the vertical direction is represented as being larger than the actual size for convenience of drawing.

First, as shown on the left and right of the three-layer green sheets G1 to G3 shown in FIG. 1C, three (plural) first positioning holes H1 are individually formed on different sides of the ear portion Fa. (First hole forming step). Subsequently, as shown on the left side of the figure, a plurality of via holes 10 were drilled at predetermined positions in each substrate region 2a within the product region Pa. These have a circular cross section and are formed by a known punching process.
Further, as shown in the vicinity of the center in FIG. 1(C), a conductive paste containing W powder or Mo powder is filled in each of the via holes 10 by using a squeegee (not shown) and a negative pressure. Then, after individually forming the unfired via conductors 8, as shown on the right side of the figure, a conductive paste similar to the above is screen-printed on each of the upper surfaces of the green sheets G1 to G3, and The baked surface conductor layer 5 was formed (surface conductor layer forming step). The surface conductor layer 5 was individually connected to the via conductor 8.

Next, the green sheets G1 to G3 on which the surface conductor layer 5 and the via conductors 8 are formed are the outermost layers of the green sheet G1 which forms the surface 3 of the substrate body 2 described later, and the first of these The layers were laminated and pressure-bonded so that the positioning holes H1 were overlapped along the lamination (axial) direction (lamination step).
As a result, as shown in FIG. 1D, the above-mentioned green sheets G1 to G3 were laminated, and a substrate body 2m for multi-cavity formation having a front surface 3 and a back surface 4 facing each other was formed. At this time, as shown in the enlarged view of FIG. 1D, when the first positioning holes H1 are deviated from each other in center axis due to an error in stacking the green sheets G1 to G3. was there.

Next, as shown in the plan view of FIG. 2(A1) and the vertical cross-sectional view of FIG. 2(A2), a total of 3 ears are provided on the ears Fa of the substrate body 2m with reference to a part of the surface conductor layer 5. One (plurality) second positioning holes H2 were formed by punching (second hole forming step). In the ear portion Fa, one second positioning hole H2 is formed on the left side and two second positioning holes H2 are formed on the right side (different sides).
Further, for each substrate area 2a in the product area Pa on the back surface 4 of the substrate body 2m, the same conductive paste as described above is screen-printed on the basis of at least two (plural) or more second positioning holes H2. Was applied. Since the second positioning hole H2 having a circular cross section is used as a reference, the center of each second positioning hole H2 is imaged by, for example, a CCD camera (not shown), and the positions of these centers are used as references. Screen printing was performed.
As a result, as shown in FIG. 2B, a plurality of back surface conductor layers 6 having a predetermined pattern were formed in each substrate area 2a in the product area Pa on the back surface 4 (back surface conductor layer forming step). .. The back surface conductor layer 6 was individually connected to the via conductor 8 penetrating the lowermost green sheet G3.

Further, as shown in FIG. 2C, the green sheets G1 to G3 are ceramic layers by firing the substrate body 2m on which conductors such as the front and back surface conductor layers 5 and 6 are formed (firing step). (Insulating layers) C1 to C3, and at the same time, the conductors such as the front and back surface conductor layers 5 and 6 were also fired.
Subsequently, the fired substrate body 2m is sequentially dipped in an electrolytic nickel plating bath and an electrolytic gold plating bath to form a nickel layer on the surfaces of the front and back surface conductor layers 5 and 6 exposed to the outside. Then, a plating process of sequentially coating the metal layer and the gold layer was performed.
Then, the plated substrate body 2m is cut along the planned cutting surface 9 by, for example, a disk-shaped cutter that rotates at a high speed to cut each of the substrate regions 2a, and the ears Fa Was excised (division process). As a result, as shown in FIG. 2D, the substrate body 2 made of the ceramic layers C1 to C3 and having the front surface 3 and the back surface 4 facing each other, and the front surface 3 and the back surface 4 were formed at predetermined positions. It was possible to obtain a plurality of wiring boards 1 each including the front surface conductor layer 5 and the back surface conductor layer 6, and the inner layer wiring 7 and the via conductor 8 that electrically connect these.

In the method of manufacturing the wiring board 1 as described above, a plurality of the first and second positioning holes H1 and H2 are formed in the ears Fa of the board body 2m, and the green sheets G1 to G1 are formed in the laminating step. Even when the central axes of these first positioning holes H1 are deviated from each other when G3 is laminated and pressure-bonded, the green sheet G1 to G3 of the substrate body 2m integrally laminated after the laminating step is performed. The back surface conductor layer 6 is formed on the back surface 4 of the substrate body 2m with reference to the second positioning hole H2 which penetrates between the front surface 3 and the back surface 4 and is formed with the front surface conductor layer 5 as a reference. Is formed. Therefore, the positional relationship between the front surface conductor layer 5 and the rear surface conductor layer 6 which are formed in advance on the front surface 3 of the substrate body 2 is clear, and the front surface conductor layer 5 and the rear surface conductor layer 6 are seen in a plan view. It was possible to reliably manufacture the wiring substrate 1 arranged at each required position.

Further, since the front surface conductor layer 5 and the back surface conductor layer 6 are electrically connected to each other, for example, an electronic component such as a semiconductor element mounted above the front surface conductor layer 5 in the obtained wiring board 1 is mounted. The electrical connection between the wiring board 1 and a printed board (motherboard) on which the wiring board 1 is subsequently mounted via the back surface conductor layer 6 can be surely and stable.
Further, since the wiring board 1 is formed in a form for taking a large number of pieces and the positional relationship between the front surface conductor layer 5 and the back surface conductor layer 6 is clear, the front surface conductor layer 5 is used as a reference, Even when the individual wiring boards 1 are cut into individual pieces, the situation in which the back conductor layer 6 is inadvertently cut and the distance from the outer peripheral edge of the wiring board 1 to the back conductor layer 6 is It was possible to prevent the situation of becoming insufficient.
Therefore, it is easily understood that the effects (1) to (3) can be obtained by the method for manufacturing the wiring board 1.

FIG. 3A is a plan view showing the corner area Ca, the diagonal virtual straight line L1, the parallel virtual straight line L2, and the facing virtual straight line L3 in the substrate body 2m used in the present invention.
As shown in the drawing, four corner areas Ca each having a square (rectangular) shape in plan view and being virtual are individually provided near the four corners of the product area Pa located on the center side of the substrate body 2m in plan view. Is set to. Of the four corner areas Ca, a straight line passing through the two corner areas Ca at diagonal positions is referred to as a diagonal virtual straight line L1 as indicated by a dashed line in FIG. A straight line passing through two corner regions Ca facing in parallel to the same side is called a parallel virtual straight line L2, and another straight line passing through another two corner regions Ca facing the two corner regions Ca passing through the parallel virtual straight line L2. Is referred to as a facing virtual straight line L3.
The parallel virtual straight line L2 and the facing virtual straight line L3 are straight lines that face each other. In FIG. 3A, the lower straight line is the parallel virtual straight line L2, and the upper straight line is the opposite virtual straight line in FIG. Although the straight line L3 is used, the two are relative, and in the figure, the upper straight line may be the parallel virtual straight line L2 and the lower straight line may be the opposing virtual straight line L3.

FIG. 3B shows a state in which the through hole 10 having a rectangular shape in plan view is provided on the center side of each substrate area 2a in the product area Pa after the first hole forming step and the surface conductor layer forming step. FIG. 3 is a plan view showing a substrate body 2m in FIG.
That is, as shown in the drawing, in the ear portion Fa of the substrate body 2m, the four first positioning holes H1 formed in the first hole forming step are located apart from each other, and the substrate in the product area Pa is located. The surface conductor layer 5 having a predetermined pattern formed in the surface conductor layer forming step is formed in the region 2a.

In the substrate body 2m as described above, by punching with a punch and a die (not shown) for forming the through hole 10 with respect to the center side of each substrate region 2a located in the product region Pa in plan view. The second hole forming step was performed. As a result, as shown in FIG. 4A, the center side of each substrate region 2a of the product region Pa penetrates between the front surface 3 and the back surface 4 of the substrate body 2m, and the through hole 10 is formed. The second positioning hole H2, which also serves as the double positioning hole, was formed.
In these through holes 10, among the four second positioning holes H2 located on the center side of each of the four corners of the substrate region 2a and also serving as the individual through holes 10, the upper right corner side in FIG. 4(A). With respect to the second positioning hole H2 located at and the second positioning hole H2 located at the lower left corner side, the diagonal virtual straight line L1 passes through the central portions thereof.
In addition, as for the 2nd positioning hole H2 located in the upper left corner side in FIG. 4(A) and the 2nd positioning hole H2 located in the lower right corner side, the diagonal virtual straight line L1 can be set similarly to the above. Is.

On the other hand, among the four second positioning holes H2, a second positioning hole H2 located on the lower left corner side of the product area Pa and a second positioning hole located on the lower right corner side in FIG. 4(A). The parallel virtual straight line L2 passes through the center of the hole H2. In addition, in the second positioning hole H2 located on the upper left corner side and the second positioning hole H2 located on the upper right corner side in FIG. 4A, the parallel virtual straight line L2 can be set similarly to the above. ..
As described above, by setting the plurality of second positioning holes H2 in the two corner areas Ca through which the diagonal virtual straight line L1 or the parallel virtual straight line L2 passes, as described above, The plurality of second positioning holes H2 also serving as the one through hole 10 can be easily set at positions separated from each other in the plan view of the substrate body 2m, and the positioning accuracy of the front surface/back surface conductor layers 5, 6 can be improved. Can be increased.

FIG. 4B is a plan view showing a different form of the substrate body 2m after the second hole forming step.
That is, as shown in FIG. 4B, in the ear portion Fa of the substrate body 2m, the three first positioning holes H1 formed in the first hole forming step are separated from each other on different sides. The surface conductor layer 5 having a predetermined pattern formed in the surface conductor layer forming step is located on the surface 3 of each substrate area 2a in the product area Pa. Furthermore, the plan view is rectangular across the planned cutting surface 9 that partitions the adjacent substrate areas 2a and the planned cutting surface 9 that partitions the board area 2a located on the outer peripheral side and the ear Fa. -Shaped through holes 12 were formed in the substrate body 2m by punching using a punch and a die (not shown) (second hole forming step). The through holes 12 are for forming recesses that open outward in a plan view on the side surfaces of the four sides of the obtained substrate body 2 when divided into individual substrate regions 2a.

As shown in FIG. 4B, a through hole 12 located on the right side of the substrate area 2a located in the upper right corner of the product area Pa and a through hole 12 located on the lower side of the board area 2a located in the lower left corner. Both also serve as the second positioning hole H2. As illustrated, the diagonal virtual straight line L1 passes through the two second positioning holes H2.
Further, the through hole 12 located on the right side of the board region 2a located at the upper right corner of the product area Pa and the through hole 12 located on the left side of the board region 2a located at the upper left corner also have the second positioning hole H2. Also serves as. As illustrated, the parallel virtual straight line L2 passes through the two second positioning holes H2.

Further, the through hole 12 located on the upper side of the substrate area 2a located in the upper right corner of the product area Pa and the through hole 12 located on the lower side of the board area 2a located in the lower right corner also have the second positioning hole H2. Also serves as. As illustrated, the parallel virtual straight line L2 also passes through these two positioning holes H2.
Also in the above case, by setting a plurality of second positioning holes H2 within each corner area Ca through which the diagonal virtual straight line L1 or the parallel virtual straight line L2 passes, as described above, the substrate body It is possible to easily set the plurality of second positioning holes H2 also serving as the 2 m through holes 12 at respective positions separated from each other in plan view, and to improve the positioning accuracy of the front surface/back surface conductor layers 5, 6. Become.

FIG. 5A is a plan view of the substrate main body 2m showing a method of setting the plurality of second positioning holes H2 different from the above in the second hole forming step. However, the surface conductor layer 5 on the surface 3 of each substrate region 2a located in the product region Pa is omitted.
As shown in FIG. 5(A), in a plan view of the substrate body 2m, a pair of left and right upper two corner regions Ca including the upper left corner and the upper right corner of the product region Pa, and the product region. Four corner areas Ca, which are a pair of left and right corner areas Ca and a lower two corner areas Ca including corners at the lower left corner and the lower right corner of Pa, are set in advance.
In FIG. 5A, a parallel virtual straight line L2 that is parallel to the lower side of the product area Pa and passes through the ear portion Fa passes through the two corner areas Ca located on the lower side, and The second positioning hole H2 is individually formed on the virtual straight line L2 and in each of the two corner regions 2a.

On the other hand, for each upper corner area Ca, which is another two corner areas Ca facing the two corner areas Ca located on the lower side in FIG. 5(A), parallel to the upper side of the product area Pa. Further, another facing virtual straight line L3 that passes through the ear portion Fa also passes, and one second positioning hole H2 is formed in the middle (midpoint) on the facing virtual straight line L3. That is, a total of three second positioning holes H2 are formed on the parallel virtual straight line L2 and the opposing virtual straight line L3.
In addition, as shown in FIG. 5B, in the opposite virtual straight line L3 as well as in the lower parallel virtual straight line L2, two in each of the two corner regions 2a through which the opposite virtual straight line L3 passes. The second positioning holes H2 may be vertically symmetrically formed to have a total of four second positioning holes H2.
The effects (1) to (3) can also be obtained by the manufacturing method of the wiring board 1 according to each of the steps that employs the setting position of the second positioning hole H2 shown in FIGS. 5A and 5B. Is possible.

FIG. 6A is a plan view of the substrate main body 2m showing a different setting method of the plurality of second positioning holes H2 in the second hole forming step. However, similarly to the above, the surface conductor layer 5 is omitted.
As shown in FIG. 6(A), in the plan view of the substrate body 2m, four corner regions Ca are set near the four corners of the product region Pa, similarly to the above.
Further, the lower virtual imaginary straight line L2 shown in the drawing passing through the pair of left and right corner regions Ca located at the corners of the lower left corner and the lower right corner of the product region Pa, and the two corners through which the virtual imaginary straight line L2 passes. An opposing virtual straight line L3 on the upper side in the drawing that passes through a pair of left and right corner regions Ca located at the corners of the upper left corner and the upper right corner of the product region Pa that is another two corner regions Ca facing the region Ca, Is set. As shown in the figure, it is within a pair of left and right corner regions Ca through which the lower parallel imaginary straight line L2 passes, and each of the substrate regions 2a located at the lower left corner and the lower right corner has a second position on the parallel imaginary straight line L2. Two positioning holes H2 are individually formed.

On the other hand, one second positioning hole H2 is formed in the middle (midpoint) on the opposing virtual straight line L3 which is the upper side in FIG. 6(A). The second positioning hole H2 extends over the planned cutting surface 9 between the two adjacent substrate regions 2a in the product region Pa, and is formed on the side surface of the substrate body 2 obtained when these are divided later. It also forms part of the recess.
Also in the above-mentioned form, a total of three second positioning holes H2 are formed on the upper and lower parallel virtual straight lines L2 and the opposing virtual straight line L3.
Further, as shown in FIG. 6(B), the second positioning hole H2 formed on the upper facing virtual straight line L3 is located at the upper left corner of the product area Pa similarly to the lower parallel virtual straight line L2. In the substrate area 2a located in the upper right corner, two second positioning holes H2 are individually formed on the opposing virtual straight line L3, and combined with the two positioning holes H2 formed on the parallel virtual straight line L2. As a result, a configuration having a total of four second positioning holes H2 may be adopted.
The effects (1) to (3) can also be obtained by the manufacturing method of the wiring board 1 according to the above-described steps, which adopts the setting position of the second positioning hole H2 shown in FIGS. 6(A) and 6(B). Is possible.

The present invention is not limited to the forms described above.
For example, a ceramic other than alumina (for example, mullite, aluminum nitride, glass-ceramic) or a resin such as an epoxy resin may be applied to the insulating material forming the insulating layer. When the glass-ceramic or resin is used, copper or silver is applied to the conductors such as the front and back conductor layers 5 and 6.
Further, the plurality of insulating layers may have a composite form in which an insulating layer made of ceramic and an insulating layer made of resin are laminated.
Furthermore, the first hole forming step and the second hole forming step may be performed by laser processing in which appropriate laser light is irradiated.

Further, when the insulating material of the insulating layer is made of the resin such as the epoxy resin, the laminating step may be performed along with adhesion or curing (heating) treatment.
Furthermore, when the insulating material of the insulating layer is made of the resin, the front and back surface conductor layers 5, 6, the inner layer wiring 7, and the via conductor 8 are formed by various photolithography techniques.
In addition, in the method for manufacturing the wiring board 1, the board body for single-piece production is composed of the board area 2a/product area Pa that will become one wiring board 1 later and the rectangular frame-shaped ear portion Fa that surrounds the area. It is also possible to use.

ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the wiring board which can form a surface conductor layer and a back surface conductor layer with sufficient positional accuracy can be provided for every predetermined position in the surface and the back surface of the board|substrate main body which laminates|stacks several insulating layers. ..

1……………… Wiring board 2, 2m……Board body 3………………Front surface 4………………Back surface 5……………… Front conductor layer 6………………Back conductor layer 7…… …………Inner layer wiring ………………Via conductors C1 to C3... Ceramic layer (insulating layer)
G1 to G3... Green sheet (insulating layer)
H1…………First positioning hole H2…………Second positioning hole Fa…………Ear Pa…………Product area Ca…………Corner area L1…………Diagonal virtual straight line L2…………Parallel virtual straight line L3…………Opposed virtual straight line

Claims (6)

A substrate main body formed by stacking a plurality of insulating layers and having a front surface and a back surface facing each other, a front surface conductor layer formed on the front surface of the substrate main body, and a back surface conductor layer formed on the back surface are seen in a plan view. A method of manufacturing a wiring board formed at predetermined positions with each other,
A preparatory step of preparing the plurality of insulating layers,
A first hole forming step of forming a first positioning hole for each of the plurality of insulating layers;
Of the plurality of insulating layers, at least a surface conductor layer forming step of forming the surface conductor layer on the surface of the insulating layer constituting the surface,
The insulating layer having the surface conductor layer formed on the surface is used as the outermost layer, and the plurality of insulating layers are stacked and pressure-bonded so that the first positioning holes are overlapped with each other along the stacking direction. A stacking step for forming
A second hole forming step of forming a plurality of second positioning holes penetrating between the front surface and the back surface of the substrate body with reference to the surface conductor layer;
A back surface conductor layer forming step of forming a back surface conductor layer on the back surface of the substrate body with the plurality of second positioning holes as a reference.
A method of manufacturing a wiring board, comprising: The plurality of insulating layers include a rectangular product region located on the center side in a plan view and rectangular frame-shaped ears surrounding the product region, and the first positioning hole and the second positioning The holes are individually formed for each different side in the ear portion,
The method of manufacturing a wiring board according to claim 1, wherein. The plurality of insulating layers includes a rectangular product region located on the center side in a plan view and a rectangular frame-shaped ear portion surrounding the periphery of the product region, and the first positioning hole includes the ear portion. And the second positioning hole is formed in the product area.
The method of manufacturing a wiring board according to claim 1, wherein. The plurality of insulating layers includes a rectangular product region located on the center side in a plan view and a rectangular frame-shaped ear portion surrounding the periphery of the product region, and the first positioning hole includes the ear portion. Is formed separately for each side, the second positioning hole extends over the boundary between the product region and the ear portion, and is located on a different side of the ear portion in plan view. Is formed,
The method of manufacturing a wiring board according to claim 1, wherein. Of the four corner areas including the four corners of the product area, two or more of the second positioning holes are formed on a diagonal virtual straight line that passes through two corner areas diagonally located in a plan view. Or two or more are formed on a parallel virtual straight line that passes through two corner regions that face each other in parallel in a plan view, and one or more are formed on the diagonal virtual straight line. Or on an opposing virtual straight line that passes through another two corner regions that the two parallel virtual straight lines pass through in plan view, and that is formed at the midpoint of the product region and Two or more are formed on the virtual straight line, or two or more are formed on the parallel virtual straight line in plan view and two or more are formed on the opposing virtual straight line,
5. The method for manufacturing a wiring board according to claim 1, wherein Inner layer wiring is formed between layers of the plurality of insulating layers, and the inner layer wiring can be individually conducted to the front surface conductor layer and the back surface conductor layer via a via conductor penetrating the insulating layer. Has been
The method for manufacturing a wiring board according to claim 1, wherein

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