JP2006179847A - Package for housing electronic component and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for housing electronic components as well as electronic devices capable of improving jointing strength to an external electric circuit board and capable of easily confirming a jointed state with the external electric circuit board. <P>SOLUTION: The package for housing electronic components comprises an insulating substrate 101 on which an electronic component 114 is mounted, a side surface conductor 107 which is formed on the side surface of insulating substrate 101 and electrically connected to an electrode of the electronic component 114, and a connection pad 112 which is formed on the outer periphery of the lower surface of insulating substrate 101 while contacting the side surface conductor 107. Relating to the side surface conductor 107, the surface at the end on the lower surface side of the insulating substrate 101 protrudes outside the surface at the end on the upper surface side of insulating substrate 101. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component storage package for mounting an electronic component such as a semiconductor element or a piezoelectric element, and an electronic device.

  Conventionally, an electronic component storage package for mounting an electronic component such as a semiconductor element or a piezoelectric element is shown in FIG. 3 as a plan view and a cross-sectional view taken along line CC ′ in FIG. Thus, it is comprised from the insulating base 201 and the cover body 213 which consists of a square-plate metal attached to the upper surface of the insulating base 201. The insulating base 201 is formed by laminating a rectangular frame 203 having the same external dimensions as the bottom plate 202 on the upper surface of a square flat plate 202 made of an insulating material such as ceramics or resin. . The insulating base 201 is formed with a plurality of wiring conductors 204 to which the electrodes of the electronic component 214 are electrically connected from the inside to the side surface.

  A plurality of cutout portions 205 (castellation) reaching the lower surface of the bottom plate 202 from the upper surface of the frame body 203 are formed in a portion of the side surface of the insulating base 201 where the wiring conductor 204 is led out. A side conductor 207 is attached to the surface of 205. A connection pad 212 is attached to the outer peripheral portion of the lower surface of the insulating base 201. The wiring conductor 204, the side conductor 207, and the connection pad 212 are electrically connected to each other to form a conductive path that leads the electrode of the electronic component 214 to the outside. Further, a sealing metallization layer 210 having a substantially square frame shape to which the lid body 213 is bonded is attached to the upper surface of the frame body 203.

The electronic component 214 is mounted in the recess 206 of the electronic component storage package, each electrode of the electronic component 214 is electrically connected to the wiring conductor 204 via a bonding wire or the like, and the lid 213 is attached to the insulating base 201. It becomes an electronic device by being joined. The electronic device is mounted on the external electric circuit board by bonding the connection pads 212 of the electronic apparatus to the wiring conductor of the external electric circuit board via a bonding material such as solder.
JP 2002-9578 A

  However, as the density of electronic devices in recent years has increased, the area of the connection pad 212 has been reduced. For this reason, there is a problem that the bonding area between the side conductor 212 and the bonding material is reduced, and the connection strength between the electronic component storage package and the external electric circuit board is lowered.

  In addition, since the areas of the connection pads 212 and the side conductors 207 have been reduced, it has become difficult to check the bonding state between the electronic device and the external electric circuit board. That is, the confirmation of the bonding state between the electronic device and the external electric circuit board is performed by confirming the rising state of the bonding material with an image recognition device or the like, but the area of the connection pad 212 and the side conductor 207 is reduced. As a result, the amount of the bonding material that crawls up also decreases, making it difficult to check the mounting state of the electronic device.

  The present invention has been devised in view of such problems, and its purpose is to improve the bonding strength with the external electric circuit board and facilitate the confirmation of the bonding state with the external electric circuit board. An object is to provide an electronic component storage package and an electronic device.

  An electronic component storage package according to the present invention includes an insulating base on which an electronic component is mounted on an upper surface, a side conductor formed on a side surface of the insulating base and electrically connected to an electrode of the electronic component, and the insulating base. A connection pad formed in contact with the side conductor on the outer periphery of the lower surface of the insulating base, and the side conductor has a surface at an end portion on the lower surface side of the insulating base in plan view. It protrudes outside the surface of the end part on the side.

  In the electronic component storage package according to the present invention, it is preferable that the side conductor is gradually inclined outward as the surface of the end portion on the lower surface side of the insulating base faces the lower surface of the insulating base. It is characterized by being.

  In the electronic component storage package of the present invention, it is preferable that the side conductor has a stepped shape that spreads outward as the surface of the end portion on the lower surface side of the insulating base toward the lower surface of the insulating base. It is characterized by becoming.

  In the electronic component storage package according to the present invention, preferably, the side conductor has an end on the lower surface side of the insulating base that is thicker than an end on the upper surface of the insulating base. is there.

  In the electronic component storage package according to the present invention, preferably, the insulating base has a side surface of the end portion on the lower surface side protruding outside a side surface of the end portion on the upper surface side. Is.

  In the electronic component storage package of the present invention, it is preferable that the side conductor is provided in a notch formed so as to extend in the vertical direction on the side surface of the insulating base, and on the lower surface of the insulating base. The side conductors are formed in an area of half or less of the area of the notch.

  In the electronic component storage package of the present invention, preferably, the wiring conductor, the side conductor, and the connection pad are made of a refractory metal, and the wiring conductor, the side conductor, and the connection exposed to the outside. A nickel plating layer of 1 to 20 μm and a gold plating layer of 0.1 to 3.0 μm are deposited on the surface of the pad.

  An electronic device of the present invention includes the electronic component storage package according to any one of claims 1 to 6 and an electronic component mounted on the electronic component storage package. Is.

  In the electronic component storage package of the present invention, the surface of the end portion on the lower surface side of the insulating base in the side conductor protrudes outside the surface of the end portion on the upper surface of the insulating base, so that the bonding strength with the external electric circuit is increased. Can be improved. That is, the electronic component storage package of the present invention can be bonded so that the bonding material is wrapped around the side conductor from the connection pad, and the bonding strength between the electronic device and the external electric circuit board can be improved. In addition, since the solder crawls up on the surface of the side conductor that protrudes to the outside, the anchor effect due to the fact that the thickness of the fillet of the bonding material formed on the side conductor is formed thick above the portion that protrudes to the outside. And the bonding strength between the electronic device and the external electric circuit board can be improved.

  Moreover, the electronic component storage package of this invention can confirm easily the joining state of an electronic apparatus and an external electric circuit board | substrate with such a structure. That is, in the electronic component storage package of the present invention, since the surface of the end portion on the lower surface side of the insulating base out of the side conductors protrudes outside the surface of the end portion on the upper surface side of the insulating base, It is possible to easily confirm the bonding material climbed up to the portion where the electronic device is present with an image recognition device or the like, and it is possible to easily confirm the mounting state of the electronic device.

  In the electronic component storage package of the present invention, it is preferable that the side surface conductor is inclined because the surface of the end portion on the lower surface side of the insulating base gradually inclines toward the lower surface of the insulating base. The molten bonding material can be smoothly rubbed up along the surface of the side conductor, and the strong bonding between the insulating base and the external electric circuit board via the bonding material can be performed more easily. Can do.

  Also, for example, when forming a notch (castellation) on the side surface of the insulating base and providing a side conductor in the notch, when depositing a plating layer on the side conductor by electrolytic plating, A plating solution can be circulated satisfactorily through the side conductor of the notch, and an electronic component storage package with little variation in plating thickness can be provided.

  In the electronic component storage package of the present invention, it is preferable that the side surface conductor has a stepped shape in which the surface of the end portion on the lower surface side of the insulating base spreads outwardly toward the lower surface of the insulating base. In the side conductor, the end of the insulating base on the lower surface side, that is, the portion where the joining material crawls is formed in a stepped shape, so that a large area of joining between the side conductor and the joining material can be ensured more reliably. In addition, the bonding surface can be configured to include a surface orthogonal to the direction (almost lateral direction) in which the thermal stress generated between the insulating base and the external electric circuit board acts, and the bonding is caused by the thermal stress. Peeling between the material and the side conductor can be prevented more effectively, and the bonding reliability can be further improved.

  In the electronic component storage package of the present invention, it is preferable that the side conductor has a larger stress on the side conductor because the lower end of the insulating base is thicker than the upper end of the insulating base. The thickness of the side conductor can be sufficiently secured in the part close to the connection pad with a tendency, and the side conductor can be securely and firmly bonded to the insulating base, further increasing the reliability of bonding to the external electric circuit board. It can be excellent.

  Also, for example, when the side conductor is formed by applying a metal paste, it can be formed into a predetermined shape simply by adjusting the viscosity of the paste and allowing the paste to hang down according to gravity. Productivity of the component storage package can be improved.

  In the electronic component storage package of the present invention, it is preferable that the insulating base has a side conductor in which a side surface of the end portion on the lower surface side protrudes outside a side surface of the end portion on the upper surface side. Since the side surface of the insulating base on which the insulating substrate is formed protrudes outside the end on the upper surface side of the insulating base on the lower surface side of the insulating base, the surface of the side conductor on the lower end side of the insulating base Can be realized more easily and reliably in a structure in which the outer surface protrudes outside the surface of the end portion on the upper surface side of the insulating base.

  Further, in this case, since the thickness of the side conductor can be the same thickness from the lower end to the upper end of the side surface of the insulating base, for example, an electronic component storage package is used as such an electronic component storage package. When manufacturing in the form of a so-called multi-chip substrate in which a plurality of wiring board regions are arranged vertically and horizontally, the following effects are obtained.

  That is, normally, when a side conductor made of a ductile metal material has a thick portion and is interposed between adjacent wiring board regions, when dividing a multi-chip substrate into each wiring board region, The thick portions of the side conductors may be connected and extend between the wiring board regions, which may hinder division. In particular, when each wiring board area is very small, for example, a rectangular shape having a side length of about 3 to 5 mm, a sufficient division allowance (for division) is provided between adjacent wiring board areas. When it is difficult to ensure a width for inserting the divided grooves, etc., there is a tendency that such a problem due to the intervention of the metallized layer becomes remarkable. On the other hand, when there is no particularly thick part in the thickness of the side conductor, the above-described problems caused by the extension of the thick part of the side conductor can be effectively suppressed.

  In the electronic component storage package of the present invention, the side conductor is provided in a notch portion formed on the side surface of the insulating base so as to extend in the vertical direction, and is half the area of the notch on the lower surface of the insulating base. Since the side conductor is formed in the following area, an opening that penetrates from the lower surface to the upper surface of the insulating base can be formed large, and the side conductor is located inside the opening. When a plating layer of nickel or gold is applied to the side conductor, the plating solution can be reliably circulated into the opening. Therefore, a plating film is applied to the side conductor due to poor circulation of the plating solution. It can be formed satisfactorily without inducing defects such as unevenness and chipping.

  Further, since the side conductor is less than half of the area of the notch, the area of the side conductor does not become unnecessarily large, and the bonding material is taken by the side conductor and the connection pad and the external electric circuit board The bonding reliability can be further improved without a shortage of the bonding material interposed between the circuit conductors.

  Moreover, productivity as an electronic component storage package having a side conductor can be improved. That is, an electronic component storage package is manufactured in the form of a multi-piece wiring substrate formed by arranging a large number of wiring board regions in a vertical and horizontal direction on a mother board, and the wiring board region of the wiring board region is formed. By forming a through-hole with a conductor on the inner surface across the boundary, it can be stored along the boundary of the wiring board area, and the electronic component housing the conductor on the side surface of the individual insulating substrate Package can be manufactured at once.

  In the electronic component storage package of the present invention, the wiring conductor, the side conductor, and the connection pad are made of a refractory metal, and the surface of the wiring conductor, the side conductor, and the connection pad exposed to the outside has a nickel content of 1 to 20 μm. Since the plating layer and the gold plating layer of 0.1 to 3.0 μm are applied, the oxidative corrosion of the exposed wiring conductor can be effectively prevented, and the metallization layer for sealing, the metal frame, The bonding with the brazing filler metal can be made good, and the connection between the wiring conductor and each electrode of the electronic component and the connection with the wiring conductor of the external electric circuit board can be made strong.

  Further, since the outermost layer is a gold plating layer having an appropriate thickness, the plating layer can be reliably covered with the underlying metal and effectively prevent the oxidative corrosion. Moreover, since the color tone of the gold plating layer is significantly different from that of the bonding material such as solder, it becomes even easier and more reliable to detect whether or not the bonding material has crawled up to the side conductor.

  The electronic device according to the present invention includes the electronic component storage package described in any one of the above and the electronic component mounted on the electronic component storage package, thereby reducing the size of the connection pad and the side conductor. Even if the bonding area with the external electric circuit board is reduced, the insulating base can be firmly bonded to the external electric circuit board, and the state of bonding to the external electric circuit board through the bonding material is easy. It is possible to provide an electronic device that can be confirmed.

  The electronic component storage package and the electronic apparatus according to the present invention will be described in detail with reference to the drawings. FIG. 1A is a side view showing the structure of the electronic component storage package of the present invention, and FIG. 1B is a plan view of the electronic component storage package of the present invention shown in FIG. It is. 1C is a cross-sectional view taken along the line AA ′ of the electronic component storage package of the present invention shown in FIG. 1B, and FIG. 1D is shown in FIG. It is a principal part enlarged view of sectional drawing.

  The electronic component storage package of the present invention includes an insulating base 101 on which an electronic component 114 is mounted on an upper surface, a side conductor 107 formed on a side surface of the insulating base 101 and electrically connected to an electrode of the electronic component 114, A connection pad 112 formed in contact with the side conductor 107 is provided on the outer peripheral portion of the lower surface of the insulating base 101. In the side conductor 107, the surface of the end portion on the lower surface side of the insulating base 101 protrudes outside the surface of the end portion on the upper surface side of the insulating base 101.

  In the example shown in FIG. 1, a recess 106 in which the electronic component 114 is accommodated is formed on the upper surface of the insulating base 101. A wiring conductor 104 is formed from the inside of the recess 106 to the side surface of the insulating base 101, and the wiring conductor 104 is electrically connected to the side conductor 107. A sealing metallization layer 110 is formed on the upper surface of the insulating substrate 101 so as to surround the recess 106, and a metal frame 111 is bonded onto the sealing metallization layer 110.

  The insulating base 101 is made of an insulating material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic. The insulating base 101 is formed, for example, by laminating a plurality of insulating layers made of such an insulating material.

  In the electronic component storage package shown in FIGS. 1A to 1D, the insulating base 101 includes a bottom plate 102 on which a wiring conductor 104 to which an electrode of the electronic component 114 is electrically connected is formed, and a recess. And a frame 103 formed so as to surround 106. The insulating base 101 is, for example, a quadrangular shape having a side length of about 3.0 to 20.0 mm and a thickness (height) of about 0.5 to 3.0 mm.

  For example, if the insulating base 101 is formed by laminating ceramic layers made of an aluminum oxide sintered body, the insulating base 101 is formed as follows. First, raw material powders such as aluminum oxide and glass are formed into a sheet shape by a doctor blade method or the like together with an organic solvent and a binder to form a plurality of ceramic green sheets (hereinafter simply referred to as green sheets). Next, after laminating the plurality of green sheets, firing is performed at a temperature of about 1500 ° C. to 1600 ° C. The recess 106 of the insulating base 101 is formed by punching a top sheet or several green sheets positioned below the top layer to form a square opening at the center.

  An electronic component 114 is mounted on the upper surface of the insulating base 101. The electronic component 114 is a piezoelectric element such as a crystal resonator or a surface acoustic wave element, a semiconductor element such as a semiconductor integrated circuit element or an optical semiconductor element, a capacitive element, or the like. The electronic component 114 is bonded to the upper surface of the insulating base 101 through, for example, glass, an adhesive, a brazing material, or the like. A side conductor 107 is formed on the side surface of the insulating base 101, and a connection pad 112 is formed in contact with the side conductor 107 on the outer periphery of the lower surface.

  In the electronic component storage package of the present invention, the side conductor 107 has the surface of the end portion on the lower surface side of the insulating base 101 protruding outside the surface of the end portion on the upper surface side of the insulating base 101 in plan view. That is, in the electronic component storage package of the present invention, as shown in FIG. 1D, the surface position X of the lower end portion of the side conductor 107 is outside the surface position Y of the upper end portion of the side conductor 107. As described above, the electronic component storage package of the present invention is formed such that the surface of the lower end portion of the side conductor 107 is positioned outside the surface of the upper end portion of the side conductor 107 in plan view. Here, the plan view means that the electronic component storage package shown in FIGS. 1A, 1C, and 1D is viewed from the upper surface side, and is as shown in FIG. It is.

  Side conductor 107 is electrically connected to an electrode (not shown) of electronic component 114. The electrical connection between the side conductor 107 and the electrode of the electronic component 114 is made, for example, via the wiring conductor 104. In this case, a part of the wiring conductor 104 is exposed to the inside of the recess 106 and is connected to the side conductor 107 at a portion led out to the side surface of the insulating base 101. The electrode of the electronic component 114 and the side conductor 107 are electrically connected to each other by connecting the electrode of the electronic component 114 to the portion exposed to the inside of the recess 106 of the insulating base 101 through a conductive connecting material such as a bonding wire. Connected to.

  The connection pad 112 is connected to a wiring conductor (not shown) of the external electric circuit board via a bonding material (not shown) such as solder, so that the electrode of the electronic component 114 is connected to the wiring conductor of the external electric circuit board. And electrically connected.

  The side conductor 107, the connection pad 112, and the wiring conductor 104 are made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, or platinum. If the side conductors 107, the connection pads 112, and the wiring conductors 104 are made of, for example, tungsten, a tungsten metal paste is printed in a predetermined pattern on a green sheet serving as the insulating base 101 by means such as screen printing. It is formed by.

  In the electronic component storage package of the present invention, the side conductor 107 has the surface of the end portion on the lower surface side of the insulating base 101 protruding outside the surface of the end portion on the upper surface side of the insulating base 101. With such a configuration, the electronic component storage package of the present invention has a bonding material extending from the connection pad 112 to the side conductor 107 (the surface of the end portion on the lower surface side of the insulating base 101) even when the area of the connection pad 112 is reduced. Can be continuously joined so as to wrap around. In addition, since the surface of the end portion on the lower surface side of the insulating base 101 out of the side conductor 107 protrudes outside the surface of the end portion on the upper surface side of the insulating base 101, the bonding area between the side conductor 107 and the bonding material is reduced. Can be bigger. Further, the solder rises on the surface of the side conductor 107 that protrudes to the outside, so that the thickness of the fillet of the bonding material formed on the side conductor 107 is increased above the portion that protrudes to the outside. An anchor effect can also be obtained. As a result, the bonding material can be firmly bonded from the connection pad 112 to the lower end portion of the side conductor 107, and the insulating base 101 can be firmly bonded to the external electric circuit board.

  Further, the surface of the side conductor 107 on the lower surface side of the insulating base 101 protrudes outside the surface of the end on the upper surface side of the insulating base 101, so that the surface of the side conductor 107 crawls up to the outer portion. The bonding material such as solder can be easily confirmed by an image recognition device or the like when viewed from above. Therefore, even when the area of the side conductor 107 is small, it can be easily and surely detected whether or not the bonding material has surely climbed up to the side conductor 107, and the confirmation of the bonding to the external electric circuit board is easy. Can be done.

  In order to form the side conductor 107 so that the surface of the end portion on the lower surface side of the insulating base 101 protrudes outside the surface of the end portion on the upper surface side of the insulating base 101, for example, a metal that becomes the side conductor 107 The viscosity of the paste is adjusted, and the paste hangs downward according to gravity so that the thickness is increased below the insulating substrate 101.

  Further, in the electronic component storage package of the present invention, it is preferable that the surface of the end portion of the side conductor 107 on the lower surface side of the insulating base 101 is gradually inclined outward as it goes to the lower surface of the insulating base 101.

  The electronic component storage package according to the present invention can smoothly scoop up the molten bonding material along the surface of the inclined side conductor 107, and the insulating base 101 and the external electric circuit board can be bonded via the bonding material. Can be made stronger.

  Further, for example, in the case where the cutout portion (castellation) 105 is formed on the side surface of the insulating base 101 and the side conductor 107 is provided in the cutout portion 105, a plating layer is formed on the side conductor 107 by electrolytic plating. When depositing, the plating solution can be circulated favorably through the side conductor 107 of the notch 105, and an electronic component storage package with little variation in plating thickness can be provided.

  The electronic component storage package of the present invention preferably has a stepped shape in which the surface of the end portion of the side conductor 107 on the lower surface side of the insulating base 101 spreads outward as it goes to the lower surface of the insulating base 101. .

  The electronic component storage package of the present invention can secure a larger bonding area between the side conductor 107 and the bonding material by forming the portion where the bonding material crawls up like this in a step shape. The surface can have a surface orthogonal to the direction (substantially lateral direction) in which the thermal stress generated between the insulating base 101 and the external electric circuit board acts, and the bonding material and the side conductor 107 caused by the thermal stress Can be more effectively prevented and bonding reliability can be further improved.

  In the electronic component storage package of the present invention, it is preferable that the side conductor 107 has a thicker bottom end on the insulating base 101 than an end on the top side of the insulating base 101.

  With such a configuration, the electronic component storage package of the present invention sufficiently secures the thickness of the side conductor 107 at a portion close to the connection pad 112 in the side conductor 107 where stress tends to act greatly. The conductor 107 can be reliably and firmly bonded to the insulating base 101, and the reliability of bonding with the external electric circuit board can be further improved.

  Also, for example, when the side conductor 107 is formed by a method of applying a metal paste, it can be formed in a predetermined shape simply by adjusting the viscosity of the paste and allowing the paste to hang down according to gravity. The productivity of the electronic component storage package can be improved.

  In the electronic component storage package of the present invention, it is preferable that the insulating base 101 has a side surface of the end portion on the lower surface side that protrudes outside the side surface of the end portion on the upper surface side.

  2A is a side view showing the main structure of the electronic component storage package of the present invention, and FIG. 2B is a plan view of the electronic component storage package of the present invention shown in FIG. FIG.

2C is a cross-sectional view taken along line BB ′ of the electronic component storage package of the present invention shown in FIG. 2B, and FIG. 2D is shown in FIG. It is a principal part enlarged view of sectional drawing.

  Since the side surface itself of the insulating base 101 on which the side conductor 107 is formed has a structure that protrudes outside the end on the upper surface side of the insulating base 101 on the lower surface side of the insulating base 101, the insulating base 101 is connected to the side conductor 107. A structure in which the surface of the end portion on the lower surface side of the insulating base 101 protrudes outside the surface of the end portion on the upper surface side of the insulating base 101 can be realized more easily and reliably.

  Further, in this case, since the thickness of the side conductor 107 can be the same thickness from the lower end to the upper end of the side surface of the insulating base 101, for example, an electronic component storage package (insulating base 101) is formed in this way. When manufacturing in the form of a so-called multi-chip substrate in which a plurality of wiring board regions that form a package for storing electronic components are arranged vertically and horizontally, the following effects are obtained.

  That is, normally, when the side conductor 107 made of a ductile metal material has a thick portion and is interposed between adjacent wiring board regions, the multi-chip substrate is divided into each wiring board region. In addition, the thick portions of the side conductors 107 may be connected and extended between the wiring board regions, which may hinder division. In particular, when each wiring board region is very small, for example, a rectangular shape having a side length of about 1 to 23 to 5 mm or the like, a sufficient division allowance between adjacent wiring board regions ( When it is difficult to secure a width for inserting a dividing groove for dividing, etc., there is a tendency that a defect due to the intervention of such a metallized layer becomes remarkable. On the other hand, when there is no particularly thick part in the thickness of the side conductor 107, it is possible to effectively suppress the problems caused by the extension of the thick part of the side conductor 107 as described above. .

  In order to obtain a structure in which the side surface of the end portion on the lower surface side of the insulating substrate 101 protrudes outside the side surface of the end portion on the upper surface side, for example, a ceramic layer (ceramic) that forms the insulating substrate 101 is used. For the green sheet), the outer dimension of the lowermost layer is made larger than the outer dimension of the other ceramic layer, and the outer edge of the ceramic green sheet that becomes the lowermost ceramic layer is outside the outer edge of the other ceramic layer. It suffices to stack them so that they are positioned at the positions.

  Here, the thickness of the bottom plate 102 is set to the size of the notch 105 and the fillet of the bonding material so that the surface of the side conductor 107 formed at the lower end of the insulating base 101 becomes a portion where the bonding material crawls up. By adjusting the thickness according to the shape, it is possible to more effectively obtain the anchor effect due to the fact that the thickness of the fillet of the bonding material formed on the side conductor 107 is formed thick above the portion that is outside. . The thickness of the fillet of the bonding material is 0.2 to 0.2 when the length of one side of the insulating base 101 is about 3.0 to 20.0 mm and the thickness is about 0.5 to 3.0 mm. By adjusting the thickness so that the bottom plate 102 has a thickness of about 0.5 mm, the anchor effect is obtained when the thickness of the fillet of the bonding material formed on the side conductor 107 is formed thicker above the portion that protrudes to the outside. Can be obtained more effectively.

  In the electronic component storage package of the present invention, the side conductor 107 is provided in a notch portion 105 formed on the side surface of the insulating base 101 so as to extend in the vertical direction. The side conductors 107 are preferably formed in an area that is less than half of the area of 105.

  With such a configuration, the electronic component storage package of the present invention can have a large opening that penetrates from the lower surface to the upper surface of the insulating base 101, and the side conductor 107 is positioned inside the opening. For example, when a nickel or gold plating layer is applied to the side conductor 107, the plating solution can be reliably circulated into the opening, and unevenness, chipping, etc. due to poor circulation of the plating solution can be ensured. A plating film can be formed on the side conductor 107 without inducing this problem.

  Further, since the side conductor 107 is less than half of the area of the notch 105, the area of the side conductor 107 does not become unnecessarily large, and the bonding material is taken by the side conductor 107 and connected to the connection pad 112. The bonding reliability can be further improved without a shortage of the bonding material interposed between the circuit conductors of the external electric circuit board.

  The notch 105 can be formed as follows, for example. That is, an electronic component storage package is manufactured in the form of a multi-piece wiring substrate formed by arranging a large number of wiring board regions in the vertical and horizontal directions on the mother board, and the wiring board region By forming the through hole across the boundary, the through hole can be formed on the side surface of the individual insulating base simply by dividing along the boundary of the wiring board region.

  The side conductor can be formed by applying a metal paste to the inner side surface of the through hole by a screen printing method using vacuum suction. In this case, there is no need to print the metal paste that becomes the side conductor 107 one by one on the side surface of the green sheet that becomes the insulating base 101, and the electronic component storage package having the side conductor 107 is bundled. Can be manufactured, and productivity can be improved.

  In the electronic component storage package of the present invention, the wiring conductor 104, the side conductor 107, and the connection pad 112 are made of a refractory metal, and the surface of the wiring conductor 104, the side conductor 107, and the connection pad 112 exposed to the outside. It is preferable that a nickel plating layer (not shown) of 1 to 20 μm and a gold plating layer (not shown) of 0.1 to 3.0 μm are applied to each other.

  With such a configuration, the electronic component storage package of the present invention can effectively prevent oxidative corrosion of the exposed wiring conductor 104, side conductor 107, and connection pad 112, and the metallization layer 110 for sealing. Bonding with the metal frame 111 with the brazing material can be made good, and the connection between the wiring conductor 104 and each electrode of the electronic component 114 and the connection with the wiring conductor of the external electric circuit board can be strengthened. be able to.

  In addition, since the outermost layer is composed of a gold plating layer having an optimum thickness, the plating layer can reliably cover the underlying metal and effectively prevent its oxidative corrosion. Moreover, since the color tone of the gold plating layer is significantly different from that of the bonding material such as solder, it becomes easier and more reliable to detect whether or not the bonding material has crawled up to the side conductor 107.

  The nickel plating layer and the gold plating layer are formed by means such as an electrolytic plating method or an electroless plating method. For example, in the case of being formed by an electrolytic plating method, a common lead wire that is connected to the wiring conductor 104, the side conductor 107, and the connection pad 112 and is led out to the outer periphery of the insulating base 101 is formed. In a gold electrolytic plating solution, the lead wire is formed by supplying a current from a power source to a lead-out portion of the lead wire via a plating jig.

  The nickel plating layer is not limited to being formed by a single layer, and may be formed by a plurality of layers. Moreover, you may make it add additive components (cobalt, phosphorus, etc.) or change the addition amount of an additive component between several layers.

  For the electronic component storage package described above, the electronic component 114 is mounted on the insulating base 101, and the electronic component 114 is sealed with a sealing means such as a lid 113 or a sealing resin, if necessary. An electronic device of the present invention is formed.

  According to the electronic device of the present invention, even if the size of the connection pad 112 and the side conductor 107 is reduced and the bonding area with the external electric circuit board is reduced by providing the above configuration, the insulating base 101 is connected to the external electric circuit. An electronic device that can be firmly bonded to the circuit board and can easily check the bonding state to the external electric circuit board via the bonding material can be obtained.

  The electronic device is mounted on the external electric circuit board by electrically and mechanically connecting the connection pad 112 to the circuit conductor of the external electric circuit board via a bonding material such as solder. The sealed electronic component 114 is electrically connected to the circuit conductor of the external electric circuit board through the side conductor 107 and the connection pad 107, and exchanges signals and supplies the ground voltage and the power supply voltage.

  For example, when the side conductor 107 of the electronic device is joined to the circuit conductor of the external electric circuit board by soldering, the solder paste is melted by the application of heat and the flux contained therein becomes the wiring conductor of the external electric circuit board and the connection pad. While removing the oxide film on the surface of 112, it spreads to the wiring conductor of the external electric circuit board and the connection pad 112, and further crawls up to the upper part of the side conductor 107 connected to the connection pad 112 by the surface tension of the solder. It will be. The side conductor 107 is gold-plated on the entire surface having a color tone different from that of the solder, and the side conductor 107 has a surface of an end portion on the lower surface side of the insulating base 101 outside an end surface on the upper surface side of the insulating base 101. Because it is formed so that it protrudes, the area of the solder that creeps up in the top view is apparently widened, so it is easy to detect the bonding state of the electronic component storage package to the wiring conductor of the external electric circuit board It becomes.

  In addition, when the lid 113 is joined to the upper surface of the insulating base 101 to close the recess 106, and the electronic component 114 is hermetically sealed inside the container formed by the insulating base 101 and the lid 113, It is preferable to form a sealing metallized layer 110 at a portion to which the upper cover 113 is bonded.

  The sealing metallization layer 110 can be formed of the same metal material as that of the side conductor 107 and the connection pad 112. For example, a tungsten metal paste is applied to a portion of the green sheet serving as the insulating base 101 surrounding the recess 106. It is formed by printing with a screen printing method.

  Further, the metal frame 111 may be attached to the metallizing layer 110 for sealing. When the metal frame 111 is attached, when the lid 113 is made of a metal such as iron-nickel-cobalt alloy, the lid is attached to the insulating base 101 by a joining means such as seam welding or electron beam welding. 113 can be firmly attached, and the reliability of hermetic sealing can be further increased.

  The metal frame 111 is joined to the sealing metallization layer 110 via a brazing material such as silver brazing, for example. In order to braze the metal frame 111 to the metallizing layer 110 for sealing, a brazing material (so-called preform) such as silver brazing formed into a frame plate shape is sandwiched between the metal frame 111 and the metallizing layer 110 for sealing. A method is used in which the metal frame 111 is positioned and disposed, and the brazing material is heated and melted and joined using a continuous furnace or the like.

  The electronic component storage package and the electronic device according to the present invention are not limited to the above example, and various modifications may be made as long as they do not depart from the gist of the present invention. For example, in the example of the above embodiment, the insulating layer constituting the insulating base 101 has a three-layer structure, but an electronic component storage package using an insulating layer having a structure other than this may be used. Further, in the embodiment of the electronic component storage package and the electronic device according to the present invention, the side conductors 107 formed on the side surface of the substrate are provided at two locations on the long side, but are formed on the short side. May be.

(A) is a side view which shows the structure of the electronic component storage package of this invention. (B) is a top view of the electronic component storage package of the present invention shown in (a). (C) is sectional drawing in the A-A 'line of the electronic component storage package of this invention shown to (b). (D) is the principal part enlarged view of sectional drawing shown in (c). (A) is a side view which shows the structure of the electronic component storage package of this invention. (B) is a top view of the electronic component storage package of the present invention shown in (a). (C) is sectional drawing in the B-B 'line | wire of the electronic component storage package of this invention shown to (b). (D) is the principal part enlarged view of sectional drawing shown in (c). (A) is a side view which shows the structure of the conventional electronic component storage package. (B) is a top view of the conventional electronic component storage package shown in (a). (C) is sectional drawing in the C-C 'line | wire of the conventional electronic component storage package shown in (b).

Explanation of symbols

101 ... Insulating substrate 102 ... Bottom plate 103 ... Frame body 104 ... Wiring conductor 105 ... Notch 106 ... Recess 107 ... ... Side conductor 110 ... Metalizing layer 111 for sealing ... Metal frame 112 ... Connection pad 113 ... Cover 114 ... Electronic component

Claims (8)

An insulating base on which an electronic component is mounted on an upper surface, a side conductor formed on a side surface of the insulating base and electrically connected to an electrode of the electronic component, and the side conductor on an outer peripheral portion of the lower surface of the insulating base A connection pad formed in contact with the side surface, and the side surface conductor has a surface of an end portion on the lower surface side of the insulating base that protrudes outside a surface of the end portion on the upper surface side of the insulating base in a plan view. A package for storing electronic components. 2. The electronic component housing according to claim 1, wherein the side surface conductor is gradually inclined outward as a surface of an end portion on the lower surface side of the insulating base is directed to the lower surface of the insulating base. package. 2. The electronic component according to claim 1, wherein the side conductor has a stepped shape in which a surface of an end portion on the lower surface side of the insulating base is extended outwardly toward the lower surface of the insulating base. Storage package. 4. The electronic component storage package according to claim 1, wherein the side conductor has an end on the lower surface side of the insulating base that is thicker than an end on the upper surface of the insulating base. 5. . 2. The electronic component storage package according to claim 1, wherein a side surface of the end portion on the lower surface side of the insulating base protrudes outside a side surface of the end portion on the upper surface side. The side conductor is provided in a notch portion formed to extend in the vertical direction on the side surface of the insulating base, and the side surface has an area that is less than half of the area of the notch on the lower surface of the insulating base. 6. The electronic component storing package according to claim 1, wherein a conductor is formed. The wiring conductor, the side conductor, and the connection pad are made of a refractory metal, and a nickel plating layer of 1 to 20 μm and 0.1 are formed on the surface of the wiring conductor, the side conductor, and the connection pad exposed to the outside. The electronic component storage package according to any one of claims 1 to 6, wherein a gold plating layer of ˜3.0 μm is applied. An electronic device comprising: the electronic component storage package according to any one of claims 1 to 7; and an electronic component mounted on the electronic component storage package.

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