JP4509983B2 - 光カプラの製造方法 - Google Patents
光カプラの製造方法 Download PDFInfo
- Publication number
- JP4509983B2 JP4509983B2 JP2006223355A JP2006223355A JP4509983B2 JP 4509983 B2 JP4509983 B2 JP 4509983B2 JP 2006223355 A JP2006223355 A JP 2006223355A JP 2006223355 A JP2006223355 A JP 2006223355A JP 4509983 B2 JP4509983 B2 JP 4509983B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- light emitting
- light receiving
- array
- frame array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Optical Communication System (AREA)
Description
110 発光リードフレームアレイ
111 発光リードフレーム
112 発光端部
114 発光端部リード
116 発光素子
120 受光リードフレームアレイ
121 受光リードフレーム
122 受光端部
124 受光端部リード
126 受光素子
142 第1圧合部
144 第2圧合部
146 第3圧合部
148 第4圧合部
150 位置決め領域
Claims (1)
- 受光素子が設けられた複数の受光端部と複数の受光端部リードとを有する受光リードフレームアレイと、発光素子が設けられた複数の発光端部と複数の発光端部リードとを有する発光リードフレームアレイとを備え、前記複数の受光端部リードと前記複数の発光端部リードが相対的に離れるように配置され、かつ前記複数の受光端部と前記複数の発光端部とが一方向に交互に配置されたリードフレーム素材を用い、
前記受光リードフレームアレイまたは前記発光リードフレームアレイを切り取って反転し、
前記複数の受光端部リードと前記複数の発光端部リードとが相対的に離れるように配置したまま、前記複数の発光素子と前記複数の受光素子とが向かい合うように前記複数の発光端部と前記複数の受光端部とを重ね合わせ、
切り取った前記受光リードフレームアレイまたは前記発光リードフレームアレイをリードフレーム素材に固定する、光カプラの製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095116151A TWI307416B (en) | 2006-05-05 | 2006-05-05 | Method of manufacturing photo coupler |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007300053A JP2007300053A (ja) | 2007-11-15 |
JP4509983B2 true JP4509983B2 (ja) | 2010-07-21 |
Family
ID=38660447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006223355A Expired - Fee Related JP4509983B2 (ja) | 2006-05-05 | 2006-08-18 | 光カプラの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7666710B2 (ja) |
JP (1) | JP4509983B2 (ja) |
TW (1) | TWI307416B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101458366B (zh) * | 2007-12-13 | 2010-12-01 | 旭丽电子(广州)有限公司 | 光耦合器导线架料带 |
JP5875848B2 (ja) | 2011-12-16 | 2016-03-02 | 株式会社東芝 | フォトカプラの製造方法及びフォトカプラ用リードフレームシート |
CN109712793B (zh) * | 2017-10-25 | 2020-10-30 | 光宝科技新加坡私人有限公司 | 翻转式磁耦合封装结构及其引线架组件与制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02117182A (ja) * | 1988-10-26 | 1990-05-01 | Sharp Corp | 光結合素子の製造方法 |
JP2002057365A (ja) * | 2000-08-08 | 2002-02-22 | Nec Corp | リードフレームおよびそれを用いて製造した半導体装置並びにその製造方法 |
JP2003133498A (ja) * | 2001-10-25 | 2003-05-09 | Sharp Corp | 光結合装置のリードフレーム及び光結合装置の製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4412135A (en) | 1979-03-23 | 1983-10-25 | Sharp Kabushiki Kaisha | Photo coupler device molding including filler particles |
JPH01215564A (ja) | 1988-02-24 | 1989-08-29 | Canon Inc | 記録装置 |
JP3096824B2 (ja) * | 1992-04-17 | 2000-10-10 | ローム株式会社 | Led製造用フレームおよびこれを用いたledの製造方法 |
US5535296A (en) | 1994-09-28 | 1996-07-09 | Optobahn Corporation | Integrated optoelectronic coupling and connector |
JPH08222757A (ja) * | 1995-02-14 | 1996-08-30 | Sharp Corp | 光結合素子 |
KR0137165Y1 (ko) | 1995-09-30 | 1999-04-15 | 배순훈 | 회전체의 신호전달 장치 |
US6712527B1 (en) | 2000-01-12 | 2004-03-30 | International Business Machines Corporation | Fiber optic connections and method for using same |
EP1170606A1 (en) | 2000-07-06 | 2002-01-09 | Corning Incorporated | Multiple planar complex optical devices and the process of manufacturing the same |
US6594050B2 (en) | 2001-01-03 | 2003-07-15 | Physical Optics Corporation | Optical communication switch node |
US20020148943A1 (en) | 2001-04-12 | 2002-10-17 | Tatum Jimmy A. | Trainable laser optical sensing systems and methods |
DE10228390B4 (de) | 2002-06-25 | 2007-04-19 | Krohne Meßtechnik GmbH & Co KG | Optokoppler |
-
2006
- 2006-05-05 TW TW095116151A patent/TWI307416B/zh active
- 2006-08-18 JP JP2006223355A patent/JP4509983B2/ja not_active Expired - Fee Related
- 2006-08-28 US US11/510,716 patent/US7666710B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02117182A (ja) * | 1988-10-26 | 1990-05-01 | Sharp Corp | 光結合素子の製造方法 |
JP2002057365A (ja) * | 2000-08-08 | 2002-02-22 | Nec Corp | リードフレームおよびそれを用いて製造した半導体装置並びにその製造方法 |
JP2003133498A (ja) * | 2001-10-25 | 2003-05-09 | Sharp Corp | 光結合装置のリードフレーム及び光結合装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US7666710B2 (en) | 2010-02-23 |
US20070257342A1 (en) | 2007-11-08 |
TW200742881A (en) | 2007-11-16 |
JP2007300053A (ja) | 2007-11-15 |
TWI307416B (en) | 2009-03-11 |
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