JP4503583B2 - キャパシタ用接着シートおよびそれを用いたキャパシタ内蔵型プリント配線板の製造方法 - Google Patents

キャパシタ用接着シートおよびそれを用いたキャパシタ内蔵型プリント配線板の製造方法 Download PDF

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Publication number
JP4503583B2
JP4503583B2 JP2006338480A JP2006338480A JP4503583B2 JP 4503583 B2 JP4503583 B2 JP 4503583B2 JP 2006338480 A JP2006338480 A JP 2006338480A JP 2006338480 A JP2006338480 A JP 2006338480A JP 4503583 B2 JP4503583 B2 JP 4503583B2
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Japan
Prior art keywords
capacitor
electrode
layer
wiring board
printed wiring
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Active
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JP2006338480A
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English (en)
Japanese (ja)
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JP2008153360A (ja
Inventor
田 文 彦 松
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Nippon Mektron KK
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Nippon Mektron KK
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Priority to JP2006338480A priority Critical patent/JP4503583B2/ja
Priority to TW096141701A priority patent/TWI455662B/zh
Priority to CN2007103009309A priority patent/CN101207971B/zh
Priority to KR1020070130915A priority patent/KR20080055728A/ko
Publication of JP2008153360A publication Critical patent/JP2008153360A/ja
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Publication of JP4503583B2 publication Critical patent/JP4503583B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP2006338480A 2006-12-15 2006-12-15 キャパシタ用接着シートおよびそれを用いたキャパシタ内蔵型プリント配線板の製造方法 Active JP4503583B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006338480A JP4503583B2 (ja) 2006-12-15 2006-12-15 キャパシタ用接着シートおよびそれを用いたキャパシタ内蔵型プリント配線板の製造方法
TW096141701A TWI455662B (zh) 2006-12-15 2007-11-05 A method for manufacturing a capacitor-type printed wiring board, and a method for manufacturing the capacitor-type printed wiring board
CN2007103009309A CN101207971B (zh) 2006-12-15 2007-12-14 电容器用粘结片和电容器内置型印刷布线板的制造方法
KR1020070130915A KR20080055728A (ko) 2006-12-15 2007-12-14 캐패시터용 접착시트 및 그것을 이용한 캐패시터 내장형프린트 배선판의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006338480A JP4503583B2 (ja) 2006-12-15 2006-12-15 キャパシタ用接着シートおよびそれを用いたキャパシタ内蔵型プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JP2008153360A JP2008153360A (ja) 2008-07-03
JP4503583B2 true JP4503583B2 (ja) 2010-07-14

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JP2006338480A Active JP4503583B2 (ja) 2006-12-15 2006-12-15 キャパシタ用接着シートおよびそれを用いたキャパシタ内蔵型プリント配線板の製造方法

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JP (1) JP4503583B2 (zh)
KR (1) KR20080055728A (zh)
CN (1) CN101207971B (zh)
TW (1) TWI455662B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10817096B2 (en) 2014-02-06 2020-10-27 Apple Inc. Force sensor incorporated into display
WO2014124173A1 (en) 2013-02-08 2014-08-14 Changello Enterprise Llc Force determination based on capacitive sensing
US9671889B1 (en) 2013-07-25 2017-06-06 Apple Inc. Input member with capacitive sensor
AU2015217268B2 (en) 2014-02-12 2018-03-01 Apple Inc. Force determination employing sheet sensor and capacitive array
US10006937B2 (en) 2015-03-06 2018-06-26 Apple Inc. Capacitive sensors for electronic devices and methods of forming the same
US10007343B2 (en) 2016-03-31 2018-06-26 Apple Inc. Force sensor in an input device
US10866683B2 (en) 2018-08-27 2020-12-15 Apple Inc. Force or touch sensing on a mobile device using capacitive or pressure sensing
CN113985773B (zh) * 2021-10-27 2024-01-30 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种基片叠层的控制系统、方法、电子设备及存储介质

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002305365A (ja) * 2001-04-05 2002-10-18 Mitsubishi Electric Corp 多層プリント配線基板およびその製造方法
JP2004214433A (ja) * 2003-01-06 2004-07-29 Mitsubishi Electric Corp プリント配線板、半導体装置およびプリント配線板の製造方法
WO2004089049A1 (ja) * 2003-03-28 2004-10-14 Tdk Corporation 多層基板およびその製造方法
JP2006310543A (ja) * 2005-04-28 2006-11-09 Ngk Spark Plug Co Ltd 配線基板及びその製造方法、半導体回路素子付き配線基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3119630B2 (ja) * 1998-09-18 2000-12-25 日本電気株式会社 半導体チップモジュール用多層回路基板およびその製造方法
KR20030014374A (ko) * 2000-06-15 2003-02-17 아지노모토 가부시키가이샤 접착 필름 및 이를 사용하는 다층 프린트 배선판의 제조방법
TW511415B (en) * 2001-01-19 2002-11-21 Matsushita Electric Ind Co Ltd Component built-in module and its manufacturing method
JP3816508B2 (ja) * 2004-11-04 2006-08-30 三井金属鉱業株式会社 キャパシタ層形成材及びそのキャパシタ層形成材を用いて得られる内蔵キャパシタ層を備えたプリント配線板
US7541265B2 (en) * 2005-01-10 2009-06-02 Endicott Interconnect Technologies, Inc. Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002305365A (ja) * 2001-04-05 2002-10-18 Mitsubishi Electric Corp 多層プリント配線基板およびその製造方法
JP2004214433A (ja) * 2003-01-06 2004-07-29 Mitsubishi Electric Corp プリント配線板、半導体装置およびプリント配線板の製造方法
WO2004089049A1 (ja) * 2003-03-28 2004-10-14 Tdk Corporation 多層基板およびその製造方法
JP2006310543A (ja) * 2005-04-28 2006-11-09 Ngk Spark Plug Co Ltd 配線基板及びその製造方法、半導体回路素子付き配線基板

Also Published As

Publication number Publication date
JP2008153360A (ja) 2008-07-03
TWI455662B (zh) 2014-10-01
CN101207971A (zh) 2008-06-25
CN101207971B (zh) 2011-07-06
KR20080055728A (ko) 2008-06-19
TW200833190A (en) 2008-08-01

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