JP4498309B2 - レーザー干渉による加工方法及び該加工方法で加工された回折格子、反射防止構造 - Google Patents

レーザー干渉による加工方法及び該加工方法で加工された回折格子、反射防止構造 Download PDF

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Publication number
JP4498309B2
JP4498309B2 JP2006137088A JP2006137088A JP4498309B2 JP 4498309 B2 JP4498309 B2 JP 4498309B2 JP 2006137088 A JP2006137088 A JP 2006137088A JP 2006137088 A JP2006137088 A JP 2006137088A JP 4498309 B2 JP4498309 B2 JP 4498309B2
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Japan
Prior art keywords
laser
interference
processing method
processing
wavelength
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Expired - Fee Related
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JP2006137088A
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English (en)
Japanese (ja)
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JP2006346748A5 (https=
JP2006346748A (ja
Inventor
秀夫 岩瀬
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Canon Inc
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Canon Inc
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Filing date
Publication date
Priority to JP2006137088A priority Critical patent/JP4498309B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Priority to CN2006800170970A priority patent/CN101175599B/zh
Priority to US11/914,674 priority patent/US7796317B2/en
Priority to DE112006001230T priority patent/DE112006001230B4/de
Priority to PCT/JP2006/310415 priority patent/WO2006123835A1/en
Publication of JP2006346748A publication Critical patent/JP2006346748A/ja
Publication of JP2006346748A5 publication Critical patent/JP2006346748A5/ja
Priority to US12/790,665 priority patent/US7939782B2/en
Application granted granted Critical
Publication of JP4498309B2 publication Critical patent/JP4498309B2/ja
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Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0025—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1847—Manufacturing methods
    • G02B5/1857—Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Surface Treatment Of Optical Elements (AREA)
JP2006137088A 2005-05-18 2006-05-16 レーザー干渉による加工方法及び該加工方法で加工された回折格子、反射防止構造 Expired - Fee Related JP4498309B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2006137088A JP4498309B2 (ja) 2005-05-18 2006-05-16 レーザー干渉による加工方法及び該加工方法で加工された回折格子、反射防止構造
US11/914,674 US7796317B2 (en) 2005-05-18 2006-05-18 Processing method and processing apparatus using interfered laser beams
DE112006001230T DE112006001230B4 (de) 2005-05-18 2006-05-18 Bearbeitungsverfahren und Bearbeitungsvorrichtung, die interferierende Laserstrahlen verwenden, sowie Beugungsgitter und Miktrostruktur, hergestellt mit dem Barbeiungsverfahren
PCT/JP2006/310415 WO2006123835A1 (en) 2005-05-18 2006-05-18 Processing method and processing apparatus using interfered laser beams
CN2006800170970A CN101175599B (zh) 2005-05-18 2006-05-18 使用干涉激光光束的处理方法和处理装置
US12/790,665 US7939782B2 (en) 2005-05-18 2010-05-28 Processing method and processing apparatus using interfered laser beams

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005144937 2005-05-18
JP2006137088A JP4498309B2 (ja) 2005-05-18 2006-05-16 レーザー干渉による加工方法及び該加工方法で加工された回折格子、反射防止構造

Publications (3)

Publication Number Publication Date
JP2006346748A JP2006346748A (ja) 2006-12-28
JP2006346748A5 JP2006346748A5 (https=) 2007-02-15
JP4498309B2 true JP4498309B2 (ja) 2010-07-07

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JP2006137088A Expired - Fee Related JP4498309B2 (ja) 2005-05-18 2006-05-16 レーザー干渉による加工方法及び該加工方法で加工された回折格子、反射防止構造

Country Status (5)

Country Link
US (2) US7796317B2 (https=)
JP (1) JP4498309B2 (https=)
CN (1) CN101175599B (https=)
DE (1) DE112006001230B4 (https=)
WO (1) WO2006123835A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4054330B2 (ja) * 2002-09-27 2008-02-27 キヤノンマシナリー株式会社 周期構造作成方法および表面処理方法
JP5439738B2 (ja) * 2008-05-07 2014-03-12 東洋製罐株式会社 構造体、レーザ加工方法及び真贋判定方法
PT2414131E (pt) * 2009-03-30 2015-09-04 Boegli Gravures Sa Método e dispositivo para a estruturação de uma superfície de um corpo sólido com um revestimento duro com o auxílio de um laser utilizando máscara e diafragma
JP5414884B2 (ja) 2009-03-30 2014-02-12 ボエグリ − グラビュル ソシエテ アノニム 硬質材料をコーティングした物体の表面をレーザーによって構造化する方法及び装置
EP2532470A1 (en) * 2010-02-05 2012-12-12 Fujikura Ltd. Formation method for microstructure, and substrate having microstructure
US9455105B2 (en) * 2010-09-27 2016-09-27 Kulite Semiconductor Products, Inc. Carbon nanotube or graphene based pressure switch
CN102566057B (zh) * 2012-01-15 2013-06-12 中国人民解放军国防科学技术大学 具有光程调节能力的多光束合束器
US11242284B2 (en) 2012-07-26 2022-02-08 Dexerials Corporation Microfabrication method
EP3759529B8 (en) 2018-02-28 2023-10-11 Biomimetic Private Company Using lasers to reduce reflection of transparent solids, coatings and devices employing transparent solids

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1179063B (it) * 1984-08-20 1987-09-16 Fiat Auto Spa Apparecchiatura per effettuare trattamenti su pezzi metallici mediante laser di potenza
JPS62220919A (ja) * 1986-03-24 1987-09-29 Toshiba Corp 光量制御装置
CN1034530C (zh) * 1992-05-16 1997-04-09 中国科学院长春光学精密机械研究所 激光外差共路干涉光学系统
JPH11170073A (ja) * 1997-12-09 1999-06-29 Fuji Elelctrochem Co Ltd レーザビーム描画装置
US6169631B1 (en) * 1998-05-19 2001-01-02 Seagate Technology Llc Laser-texturing data zone on a magnetic disk surface by using degenerative two wave mixing
JP3468152B2 (ja) * 1999-03-03 2003-11-17 株式会社トッパンエヌイーシー・サーキットソリューションズ 印刷配線板の製造方法および基板表面粗化装置
JP4124396B2 (ja) 1999-12-17 2008-07-23 独立行政法人科学技術振興機構 ホログラムの製造方法および装置
CN2432001Y (zh) 2000-06-21 2001-05-30 中国科学院光电技术研究所 一种激光干涉光刻系统
TW523791B (en) * 2000-09-01 2003-03-11 Semiconductor Energy Lab Method of processing beam, laser irradiation apparatus, and method of manufacturing semiconductor device
JP4190812B2 (ja) * 2002-07-05 2008-12-03 古河電気工業株式会社 ファイバグレーティングの製造方法及びその製造装置
CN1228663C (zh) * 2003-02-27 2005-11-23 上海交通大学 基于导波共振的偏振方法

Also Published As

Publication number Publication date
US20090103181A1 (en) 2009-04-23
CN101175599B (zh) 2010-09-01
JP2006346748A (ja) 2006-12-28
US7939782B2 (en) 2011-05-10
DE112006001230B4 (de) 2010-11-04
US20100301025A1 (en) 2010-12-02
CN101175599A (zh) 2008-05-07
US7796317B2 (en) 2010-09-14
DE112006001230T5 (de) 2008-04-17
WO2006123835A1 (en) 2006-11-23

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