DE112006001230B4 - Bearbeitungsverfahren und Bearbeitungsvorrichtung, die interferierende Laserstrahlen verwenden, sowie Beugungsgitter und Miktrostruktur, hergestellt mit dem Barbeiungsverfahren - Google Patents

Bearbeitungsverfahren und Bearbeitungsvorrichtung, die interferierende Laserstrahlen verwenden, sowie Beugungsgitter und Miktrostruktur, hergestellt mit dem Barbeiungsverfahren Download PDF

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Publication number
DE112006001230B4
DE112006001230B4 DE112006001230T DE112006001230T DE112006001230B4 DE 112006001230 B4 DE112006001230 B4 DE 112006001230B4 DE 112006001230 T DE112006001230 T DE 112006001230T DE 112006001230 T DE112006001230 T DE 112006001230T DE 112006001230 B4 DE112006001230 B4 DE 112006001230B4
Authority
DE
Germany
Prior art keywords
laser beams
interference
polarization
processed
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE112006001230T
Other languages
German (de)
English (en)
Other versions
DE112006001230T5 (de
Inventor
Hideo Iwase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE112006001230T5 publication Critical patent/DE112006001230T5/de
Application granted granted Critical
Publication of DE112006001230B4 publication Critical patent/DE112006001230B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0025—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1847—Manufacturing methods
    • G02B5/1857—Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Surface Treatment Of Optical Elements (AREA)
DE112006001230T 2005-05-18 2006-05-18 Bearbeitungsverfahren und Bearbeitungsvorrichtung, die interferierende Laserstrahlen verwenden, sowie Beugungsgitter und Miktrostruktur, hergestellt mit dem Barbeiungsverfahren Expired - Fee Related DE112006001230B4 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2005-144937 2005-05-18
JP2005144937 2005-05-18
JP2006137088A JP4498309B2 (ja) 2005-05-18 2006-05-16 レーザー干渉による加工方法及び該加工方法で加工された回折格子、反射防止構造
JP2006-137088 2006-05-16
PCT/JP2006/310415 WO2006123835A1 (en) 2005-05-18 2006-05-18 Processing method and processing apparatus using interfered laser beams

Publications (2)

Publication Number Publication Date
DE112006001230T5 DE112006001230T5 (de) 2008-04-17
DE112006001230B4 true DE112006001230B4 (de) 2010-11-04

Family

ID=37431394

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112006001230T Expired - Fee Related DE112006001230B4 (de) 2005-05-18 2006-05-18 Bearbeitungsverfahren und Bearbeitungsvorrichtung, die interferierende Laserstrahlen verwenden, sowie Beugungsgitter und Miktrostruktur, hergestellt mit dem Barbeiungsverfahren

Country Status (5)

Country Link
US (2) US7796317B2 (https=)
JP (1) JP4498309B2 (https=)
CN (1) CN101175599B (https=)
DE (1) DE112006001230B4 (https=)
WO (1) WO2006123835A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4054330B2 (ja) * 2002-09-27 2008-02-27 キヤノンマシナリー株式会社 周期構造作成方法および表面処理方法
JP5439738B2 (ja) * 2008-05-07 2014-03-12 東洋製罐株式会社 構造体、レーザ加工方法及び真贋判定方法
PT2414131E (pt) * 2009-03-30 2015-09-04 Boegli Gravures Sa Método e dispositivo para a estruturação de uma superfície de um corpo sólido com um revestimento duro com o auxílio de um laser utilizando máscara e diafragma
JP5414884B2 (ja) 2009-03-30 2014-02-12 ボエグリ − グラビュル ソシエテ アノニム 硬質材料をコーティングした物体の表面をレーザーによって構造化する方法及び装置
EP2532470A1 (en) * 2010-02-05 2012-12-12 Fujikura Ltd. Formation method for microstructure, and substrate having microstructure
US9455105B2 (en) * 2010-09-27 2016-09-27 Kulite Semiconductor Products, Inc. Carbon nanotube or graphene based pressure switch
CN102566057B (zh) * 2012-01-15 2013-06-12 中国人民解放军国防科学技术大学 具有光程调节能力的多光束合束器
US11242284B2 (en) 2012-07-26 2022-02-08 Dexerials Corporation Microfabrication method
EP3759529B8 (en) 2018-02-28 2023-10-11 Biomimetic Private Company Using lasers to reduce reflection of transparent solids, coatings and devices employing transparent solids

Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2000252610A (ja) * 1999-03-03 2000-09-14 Nec Corp 印刷配線板の製造方法および基板表面粗化装置
US6169631B1 (en) * 1998-05-19 2001-01-02 Seagate Technology Llc Laser-texturing data zone on a magnetic disk surface by using degenerative two wave mixing
JP2001236002A (ja) * 1999-12-17 2001-08-31 Japan Science & Technology Corp ホログラムの製造方法および装置

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IT1179063B (it) * 1984-08-20 1987-09-16 Fiat Auto Spa Apparecchiatura per effettuare trattamenti su pezzi metallici mediante laser di potenza
JPS62220919A (ja) * 1986-03-24 1987-09-29 Toshiba Corp 光量制御装置
CN1034530C (zh) * 1992-05-16 1997-04-09 中国科学院长春光学精密机械研究所 激光外差共路干涉光学系统
JPH11170073A (ja) * 1997-12-09 1999-06-29 Fuji Elelctrochem Co Ltd レーザビーム描画装置
CN2432001Y (zh) 2000-06-21 2001-05-30 中国科学院光电技术研究所 一种激光干涉光刻系统
TW523791B (en) * 2000-09-01 2003-03-11 Semiconductor Energy Lab Method of processing beam, laser irradiation apparatus, and method of manufacturing semiconductor device
JP4190812B2 (ja) * 2002-07-05 2008-12-03 古河電気工業株式会社 ファイバグレーティングの製造方法及びその製造装置
CN1228663C (zh) * 2003-02-27 2005-11-23 上海交通大学 基于导波共振的偏振方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6169631B1 (en) * 1998-05-19 2001-01-02 Seagate Technology Llc Laser-texturing data zone on a magnetic disk surface by using degenerative two wave mixing
JP2000252610A (ja) * 1999-03-03 2000-09-14 Nec Corp 印刷配線板の製造方法および基板表面粗化装置
JP2001236002A (ja) * 1999-12-17 2001-08-31 Japan Science & Technology Corp ホログラムの製造方法および装置

Non-Patent Citations (6)

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Title
KAMIOKA,H. [u.a.]: Fine-Pitched Microgratings Encoded by Interference of UV Femtosecond Laser Pulses. In: Journal of Nanoscience and Nanotechnology, 2002, Vol.2, Nr.3-4, S.321-323 *
KAMIOKA,H. [u.a.]: Fine-Pitched Microgratings Encoded by Interference of UV Femtosecond Laser Pulses. In: Journal of Nanoscience and Nanotechnology, 2002, Vol.2, Nr.3-4, S.321-323 KUMAGAI,H. [u.a.]: Spatial Controllability of Periodic Ripple Structures Generated in Laser Etching of n-GaAs. In: Jpn. J. Appl. Phys., 1992, Vol.31, S.4433-4436 WU,Q. [u.a.]: Femtosecond laser-induced periodic surface structure on diamond film. In: Appl. Phys. Lett., 2003, Vol.82, Nr.11, S.1703-1705.03 SAWADA,H. [u.a.]: Precise Periodic Structuring with Femtosecond-laser. In: Journal of the Japan Society for Precision Engineering, 2003, Vol.69, Nr.4, S.554-558 REIF,J. [u.a.]: Ripples revisited: non-classical morphology at the bottom of femtosecond laser ablation craters in transparent dielectrics. In: Applies Surface Science, 2002, Vol.197-198, S.891-895
KUMAGAI,H. [u.a.]: Spatial Controllability of Periodic Ripple Structures Generated in Laser Etching of n-GaAs. In: Jpn. J. Appl. Phys., 1992, Vol.31, S.4433-4436 *
REIF,J. [u.a.]: Ripples revisited: non-classical morphology at the bottom of femtosecond laser ablation craters in transparent dielectrics. In: Applies Surface Science, 2002, Vol.197-198, S.891-895 *
SAWADA,H. [u.a.]: Precise Periodic Structuring with Femtosecond-laser. In: Journal of the Japan Society for Precision Engineering, 2003, Vol.69, Nr.4, S.554-558 *
WU,Q. [u.a.]: Femtosecond laser-induced periodic surface structure on diamond film. In: Appl. Phys. Lett., 2003, Vol.82, Nr.11, S.1703-1705.03 *

Also Published As

Publication number Publication date
JP4498309B2 (ja) 2010-07-07
US20090103181A1 (en) 2009-04-23
CN101175599B (zh) 2010-09-01
JP2006346748A (ja) 2006-12-28
US7939782B2 (en) 2011-05-10
US20100301025A1 (en) 2010-12-02
CN101175599A (zh) 2008-05-07
US7796317B2 (en) 2010-09-14
DE112006001230T5 (de) 2008-04-17
WO2006123835A1 (en) 2006-11-23

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OP8 Request for examination as to paragraph 44 patent law
8364 No opposition during term of opposition
R020 Patent grant now final

Effective date: 20110204

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee