JP4498232B2 - 光カチオン重合性エポキシ樹脂組成物、並びに、これを用いた微細構造体の製造方法及びインクジェットヘッドの製造方法 - Google Patents
光カチオン重合性エポキシ樹脂組成物、並びに、これを用いた微細構造体の製造方法及びインクジェットヘッドの製造方法 Download PDFInfo
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- JP4498232B2 JP4498232B2 JP2005188276A JP2005188276A JP4498232B2 JP 4498232 B2 JP4498232 B2 JP 4498232B2 JP 2005188276 A JP2005188276 A JP 2005188276A JP 2005188276 A JP2005188276 A JP 2005188276A JP 4498232 B2 JP4498232 B2 JP 4498232B2
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- Prior art keywords
- epoxy resin
- resin composition
- compound
- photocationically polymerizable
- polymerizable epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- YTJDSANDEZLYOU-UHFFFAOYSA-N OC(C(F)(F)F)(C(F)(F)F)c1ccc(C(C(F)(F)F)(C(F)(F)F)O)cc1 Chemical compound OC(C(F)(F)F)(C(F)(F)F)c1ccc(C(C(F)(F)F)(C(F)(F)F)O)cc1 YTJDSANDEZLYOU-UHFFFAOYSA-N 0.000 description 2
- NVUUXGRJNGEHQV-UHFFFAOYSA-N COc(cc1)ccc1[N](c(cc1)ccc1O)(NC=[U])N[U] Chemical compound COc(cc1)ccc1[N](c(cc1)ccc1O)(NC=[U])N[U] NVUUXGRJNGEHQV-UHFFFAOYSA-N 0.000 description 1
- PRBPSTYDUVSNOK-UHFFFAOYSA-N OC(C(F)(F)F)(C(F)(F)F)c(cc1)ccc1Oc1ccc(C(C(F)(F)F)(C(F)(F)F)O)cc1 Chemical compound OC(C(F)(F)F)(C(F)(F)F)c(cc1)ccc1Oc1ccc(C(C(F)(F)F)(C(F)(F)F)O)cc1 PRBPSTYDUVSNOK-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Micromachines (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005188276A JP4498232B2 (ja) | 2004-06-28 | 2005-06-28 | 光カチオン重合性エポキシ樹脂組成物、並びに、これを用いた微細構造体の製造方法及びインクジェットヘッドの製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004190478 | 2004-06-28 | ||
| JP2005188276A JP4498232B2 (ja) | 2004-06-28 | 2005-06-28 | 光カチオン重合性エポキシ樹脂組成物、並びに、これを用いた微細構造体の製造方法及びインクジェットヘッドの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006045523A JP2006045523A (ja) | 2006-02-16 |
| JP2006045523A5 JP2006045523A5 (enExample) | 2008-08-14 |
| JP4498232B2 true JP4498232B2 (ja) | 2010-07-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005188276A Expired - Fee Related JP4498232B2 (ja) | 2004-06-28 | 2005-06-28 | 光カチオン重合性エポキシ樹脂組成物、並びに、これを用いた微細構造体の製造方法及びインクジェットヘッドの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4498232B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005002960A1 (de) | 2005-01-21 | 2006-08-03 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Kompositzusammensetzung für mikrogemusterte Schichten mit hohem Relaxationsvermögen, hoher chemischer Beständigkeit und mechanischer Stabilität |
| JP2007307639A (ja) * | 2006-05-17 | 2007-11-29 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
| JP5110677B2 (ja) | 2006-05-17 | 2012-12-26 | 東洋ゴム工業株式会社 | 研磨パッド |
| US8119323B2 (en) | 2006-06-13 | 2012-02-21 | Sekisui Chemical Co., Ltd. | Process for producing patterned film and photosensitive resin composition |
| DE102006033280A1 (de) | 2006-07-18 | 2008-01-24 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Kompositzusammensetzung für mikrostrukturierte Schichten |
| US20080292993A1 (en) * | 2006-12-22 | 2008-11-27 | Canon Kabushiki Kaisha | Photo-cationic polymerizable epoxy resin composition, liquid discharge head, and manufacturing method thereof |
| JP2010210648A (ja) * | 2007-07-05 | 2010-09-24 | Sharp Corp | ガラス基板の修復方法、ガラス基板の製造方法、ガラス基板、およびフラットパネルディスプレイ |
| JP5787720B2 (ja) * | 2010-12-16 | 2015-09-30 | キヤノン株式会社 | 感光性ネガ型樹脂組成物 |
| JP5783854B2 (ja) * | 2011-09-01 | 2015-09-24 | キヤノン株式会社 | 液体吐出ヘッドの製造方法、および液体吐出ヘッド |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0570562A (ja) * | 1991-09-10 | 1993-03-23 | Toshiba Chem Corp | 封止用樹脂組成物および半導体封止装置 |
| JPH05127369A (ja) * | 1991-10-31 | 1993-05-25 | Nec Corp | レジスト材料 |
| JPH07109333A (ja) * | 1993-10-08 | 1995-04-25 | Three Bond Co Ltd | 光硬化性樹脂組成物 |
| JP3368094B2 (ja) * | 1995-04-21 | 2003-01-20 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
| JPH1129621A (ja) * | 1997-07-09 | 1999-02-02 | Hitachi Ltd | フェノール化合物,エポキシ化合物及び該化合物を含む樹脂組成物 |
| JP3824286B2 (ja) * | 1998-02-18 | 2006-09-20 | Jsr株式会社 | 光硬化性樹脂組成物 |
| JP2001089639A (ja) * | 1999-09-24 | 2001-04-03 | Mitsubishi Heavy Ind Ltd | エネルギー線硬化樹脂組成物 |
-
2005
- 2005-06-28 JP JP2005188276A patent/JP4498232B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006045523A (ja) | 2006-02-16 |
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