JP4496984B2 - レジンボンド砥石 - Google Patents
レジンボンド砥石 Download PDFInfo
- Publication number
- JP4496984B2 JP4496984B2 JP2005037315A JP2005037315A JP4496984B2 JP 4496984 B2 JP4496984 B2 JP 4496984B2 JP 2005037315 A JP2005037315 A JP 2005037315A JP 2005037315 A JP2005037315 A JP 2005037315A JP 4496984 B2 JP4496984 B2 JP 4496984B2
- Authority
- JP
- Japan
- Prior art keywords
- particles
- grinding
- vol
- bond
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Polishing Bodies And Polishing Tools (AREA)
Description
Claims (2)
- 樹脂をバインダーとするボンド相に超砥粒が分散された砥粒層を有するレジンボンド砥石であって、上記ボンド相には、粒径20μm以下の粉砕アモルファスカーボン粒子が8〜20vol%の範囲で、粒径30μm以下のCr2O3粒子が5〜25vol%の範囲で、粒径30μm以下のWA、SiC、およびSiO 2 のうちの少なくとも1種である硬質粒子が20vol%以下の範囲で、それぞれ含有され、かつ該ボンド相における上記バインダーの含有量が45〜60vol%の範囲である、両頭研削用砥石であることを特徴とするレジンボンド砥石。
- 上記砥粒層における上記超砥粒の含有量が10〜30vol%の範囲であることを特徴とする請求項1に記載のレジンボンド砥石。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005037315A JP4496984B2 (ja) | 2005-02-15 | 2005-02-15 | レジンボンド砥石 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005037315A JP4496984B2 (ja) | 2005-02-15 | 2005-02-15 | レジンボンド砥石 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006224195A JP2006224195A (ja) | 2006-08-31 |
JP4496984B2 true JP4496984B2 (ja) | 2010-07-07 |
Family
ID=36985997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005037315A Expired - Fee Related JP4496984B2 (ja) | 2005-02-15 | 2005-02-15 | レジンボンド砥石 |
Country Status (1)
Country | Link |
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JP (1) | JP4496984B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103567889B (zh) * | 2012-07-24 | 2016-06-29 | 沈阳中科超硬磨具磨削研究所 | 一种用于加工印制电路板钻头刃径外圆的砂轮 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001138244A (ja) * | 1999-08-17 | 2001-05-22 | Mitsubishi Materials Corp | レジンボンド砥石 |
JP2004034261A (ja) * | 2002-07-05 | 2004-02-05 | Asahi Diamond Industrial Co Ltd | 超砥粒ホイール |
JP2004090159A (ja) * | 2002-08-30 | 2004-03-25 | Ube Ind Ltd | 耐熱性樹脂結合砥石及びその製法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0632905B2 (ja) * | 1986-12-08 | 1994-05-02 | 住友電気工業株式会社 | ▲iii▼―v族化合物半導体ウエハ薄層化処理方法 |
JP3440818B2 (ja) * | 1998-04-20 | 2003-08-25 | 三菱マテリアル株式会社 | レジンボンド砥石 |
-
2005
- 2005-02-15 JP JP2005037315A patent/JP4496984B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001138244A (ja) * | 1999-08-17 | 2001-05-22 | Mitsubishi Materials Corp | レジンボンド砥石 |
JP2004034261A (ja) * | 2002-07-05 | 2004-02-05 | Asahi Diamond Industrial Co Ltd | 超砥粒ホイール |
JP2004090159A (ja) * | 2002-08-30 | 2004-03-25 | Ube Ind Ltd | 耐熱性樹脂結合砥石及びその製法 |
Also Published As
Publication number | Publication date |
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JP2006224195A (ja) | 2006-08-31 |
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