JP4473607B2 - 亜酸化銅粉末及びその製造方法 - Google Patents
亜酸化銅粉末及びその製造方法 Download PDFInfo
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- JP4473607B2 JP4473607B2 JP2004067990A JP2004067990A JP4473607B2 JP 4473607 B2 JP4473607 B2 JP 4473607B2 JP 2004067990 A JP2004067990 A JP 2004067990A JP 2004067990 A JP2004067990 A JP 2004067990A JP 4473607 B2 JP4473607 B2 JP 4473607B2
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- cuprous oxide
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- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 title claims description 133
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 title claims description 133
- 229940112669 cuprous oxide Drugs 0.000 title claims description 133
- 239000000843 powder Substances 0.000 title claims description 98
- 238000004519 manufacturing process Methods 0.000 title claims description 32
- 239000002245 particle Substances 0.000 claims description 90
- 239000000243 solution Substances 0.000 claims description 33
- 239000002002 slurry Substances 0.000 claims description 24
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 19
- 239000008103 glucose Substances 0.000 claims description 19
- 235000000346 sugar Nutrition 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 239000011164 primary particle Substances 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 claims description 9
- 239000012670 alkaline solution Substances 0.000 claims description 9
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 150000001879 copper Chemical class 0.000 claims description 7
- 239000003513 alkali Substances 0.000 claims description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 claims description 3
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 2
- 125000002791 glucosyl group Chemical group C1([C@H](O)[C@@H](O)[C@H](O)[C@H](O1)CO)* 0.000 claims description 2
- 238000004458 analytical method Methods 0.000 claims 1
- 238000004611 spectroscopical analysis Methods 0.000 claims 1
- 239000012776 electronic material Substances 0.000 description 10
- 238000009826 distribution Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000006722 reduction reaction Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000003985 ceramic capacitor Substances 0.000 description 5
- 239000000460 chlorine Substances 0.000 description 5
- 229910052801 chlorine Inorganic materials 0.000 description 5
- 238000012856 packing Methods 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- 230000003373 anti-fouling effect Effects 0.000 description 4
- -1 chlorine ions Chemical class 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- SRBFZHDQGSBBOR-IOVATXLUSA-N D-xylopyranose Chemical compound O[C@@H]1COC(O)[C@H](O)[C@H]1O SRBFZHDQGSBBOR-IOVATXLUSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000008163 sugars Chemical class 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OWEGMIWEEQEYGQ-UHFFFAOYSA-N 100676-05-9 Natural products OC1C(O)C(O)C(CO)OC1OCC1C(O)C(O)C(O)C(OC2C(OC(O)C(O)C2O)CO)O1 OWEGMIWEEQEYGQ-UHFFFAOYSA-N 0.000 description 1
- GUBGYTABKSRVRQ-XLOQQCSPSA-N Alpha-Lactose Chemical compound O[C@@H]1[C@@H](O)[C@@H](O)[C@@H](CO)O[C@H]1O[C@@H]1[C@@H](CO)O[C@H](O)[C@H](O)[C@H]1O GUBGYTABKSRVRQ-XLOQQCSPSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 241000238586 Cirripedia Species 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229930091371 Fructose Natural products 0.000 description 1
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 description 1
- 239000005715 Fructose Substances 0.000 description 1
- GUBGYTABKSRVRQ-QKKXKWKRSA-N Lactose Natural products OC[C@H]1O[C@@H](O[C@H]2[C@H](O)[C@@H](O)C(O)O[C@@H]2CO)[C@H](O)[C@@H](O)[C@H]1O GUBGYTABKSRVRQ-QKKXKWKRSA-N 0.000 description 1
- GUBGYTABKSRVRQ-PICCSMPSSA-N Maltose Natural products O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@@H]1O[C@@H]1[C@@H](CO)OC(O)[C@H](O)[C@H]1O GUBGYTABKSRVRQ-PICCSMPSSA-N 0.000 description 1
- 241000237536 Mytilus edulis Species 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- WQZGKKKJIJFFOK-PHYPRBDBSA-N alpha-D-galactose Chemical compound OC[C@H]1O[C@H](O)[C@H](O)[C@@H](O)[C@H]1O WQZGKKKJIJFFOK-PHYPRBDBSA-N 0.000 description 1
- PYMYPHUHKUWMLA-UHFFFAOYSA-N arabinose Natural products OCC(O)C(O)C(O)C=O PYMYPHUHKUWMLA-UHFFFAOYSA-N 0.000 description 1
- SRBFZHDQGSBBOR-UHFFFAOYSA-N beta-D-Pyranose-Lyxose Natural products OC1COC(O)C(O)C1O SRBFZHDQGSBBOR-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- GUBGYTABKSRVRQ-QUYVBRFLSA-N beta-maltose Chemical compound OC[C@H]1O[C@H](O[C@H]2[C@H](O)[C@@H](O)[C@H](O)O[C@@H]2CO)[C@H](O)[C@@H](O)[C@@H]1O GUBGYTABKSRVRQ-QUYVBRFLSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229930182830 galactose Natural products 0.000 description 1
- 239000008101 lactose Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 235000020638 mussel Nutrition 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002574 poison Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- Electrodes Of Semiconductors (AREA)
Description
以下に、まず本発明の特異な形状について述べ、さらに、本件発明に係る亜酸化銅粒子及び亜酸化銅粉末に関して述べることとする。
本発明者らは、検討の結果、銅塩含有溶液にアルカリ溶液を加え、濃度(酸化銅(CuO)換算)0.3モル/l〜1.8モル/lのスラリーを調製し、その後、該スラリーに還元糖を添加時間70分〜480分の条件で添加し撹拌することを特徴とする亜酸化銅粉末を提供するものである。
Claims (10)
- 角欠け立方体状の亜酸化銅粒子により構成される亜酸化銅粉末であって、
当該角欠け立方体状の亜酸化銅粒子の一辺の長さに対する角欠け部の長さの比が、0.3〜0.8であり、
前記角欠け立方体状の亜酸化銅粉末を構成する亜酸化銅粒子の一次粒子の平均粒径が、2μm〜15μmであることを特徴とする亜酸化銅粉末。 - レーザー回折散乱分析法により得られるD50が、2μm〜15μmであることを特徴とする請求項1に記載の亜酸化銅粉末。
- レーザー回折散乱分析法により得られる粒度比D90/D10が、1.4〜2.5であることを特徴とする請求項1又は請求項2に記載の亜酸化銅粉末。
- タップ充填密度:1.7g/cm3〜2.5g/cm3であることを特徴とする請求項1〜請求項3のいずれかに記載の亜酸化銅粉末。
- 請求項1〜請求項4のいずれかに記載の角欠け立方体状の亜酸化銅粒子を60%〜100%(体積%)含有することを特徴とする亜酸化銅粉末。
- 銅塩含有溶液にアルカリ溶液を加え、濃度(酸化銅(CuO)換算)0.3モル/l〜1.8モル/lのスラリーを調製し、その後、該スラリーに還元糖を添加時間70分〜480分の条件で添加し撹拌することを特徴とする角欠け立方体状の亜酸化銅粒子を含む亜酸化銅粉末の製造方法。
- 上記アルカリ溶液の添加量が上記スラリー中の銅元素に対して1.4当量〜1.6当量であり、上記還元糖の添加、攪拌時の液温が40℃〜80℃であることを特徴とする請求項6に記載の角欠け立方体状の亜酸化銅粒子を含む亜酸化銅粉末の製造方法。
- 上記還元糖がグルコース水溶液であって、グルコース濃度が0.1モル/l〜5モル/lであり、グルコース添加量は上記スラリー中の銅元素1モルに対してグルコース0.2モル〜2モルであることを特徴とする請求項6又は請求項7に記載の角欠け立方体状の亜酸化銅粉末の製造方法。
- 上記銅塩含有溶液は、硫酸銅であることを特徴とする請求項6〜請求項8のいずれかに記載の亜酸化銅粉末の製造方法。
- 上記アルカリ溶液が水酸化ナトリウム溶液、水酸化カリウム溶液、水酸化リチウム溶液、炭酸カリウム溶液又はこれらの混合溶液であることを特徴とする請求項6〜請求項9のいずれかに記載の角欠け立方体状の亜酸化銅粉末の製造方法。
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JP2005255446A JP2005255446A (ja) | 2005-09-22 |
JP4473607B2 true JP4473607B2 (ja) | 2010-06-02 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US8889164B2 (en) | 2011-10-12 | 2014-11-18 | Showa Denko K.K. | Antimicrobial and antiviral composition, and method of producing the same |
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JP5142891B2 (ja) * | 2008-09-02 | 2013-02-13 | Dowaエレクトロニクス株式会社 | 亜酸化銅粉末およびその製造方法 |
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- 2004-03-10 JP JP2004067990A patent/JP4473607B2/ja not_active Expired - Lifetime
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US8889164B2 (en) | 2011-10-12 | 2014-11-18 | Showa Denko K.K. | Antimicrobial and antiviral composition, and method of producing the same |
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