JP4468115B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4468115B2
JP4468115B2 JP2004250474A JP2004250474A JP4468115B2 JP 4468115 B2 JP4468115 B2 JP 4468115B2 JP 2004250474 A JP2004250474 A JP 2004250474A JP 2004250474 A JP2004250474 A JP 2004250474A JP 4468115 B2 JP4468115 B2 JP 4468115B2
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JP
Japan
Prior art keywords
semiconductor chip
electrode
conductive member
semiconductor device
width
Prior art date
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Expired - Fee Related
Application number
JP2004250474A
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English (en)
Japanese (ja)
Other versions
JP2006066813A5 (enExample
JP2006066813A (ja
Inventor
喜章 芦田
晃 武藤
一男 清水
俊幸 波多
賢哉 河野
直敬 田中
奈柄 米田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2004250474A priority Critical patent/JP4468115B2/ja
Priority to US11/173,740 priority patent/US7432594B2/en
Publication of JP2006066813A publication Critical patent/JP2006066813A/ja
Publication of JP2006066813A5 publication Critical patent/JP2006066813A5/ja
Application granted granted Critical
Publication of JP4468115B2 publication Critical patent/JP4468115B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/621—Structures or relative sizes of strap connectors
    • H10W72/622—Multilayered strap connectors, e.g. having a coating on a lowermost surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2004250474A 2004-08-30 2004-08-30 半導体装置 Expired - Fee Related JP4468115B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004250474A JP4468115B2 (ja) 2004-08-30 2004-08-30 半導体装置
US11/173,740 US7432594B2 (en) 2004-08-30 2005-06-30 Semiconductor chip, electrically connections therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004250474A JP4468115B2 (ja) 2004-08-30 2004-08-30 半導体装置

Publications (3)

Publication Number Publication Date
JP2006066813A JP2006066813A (ja) 2006-03-09
JP2006066813A5 JP2006066813A5 (enExample) 2006-11-24
JP4468115B2 true JP4468115B2 (ja) 2010-05-26

Family

ID=35941953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004250474A Expired - Fee Related JP4468115B2 (ja) 2004-08-30 2004-08-30 半導体装置

Country Status (2)

Country Link
US (1) US7432594B2 (enExample)
JP (1) JP4468115B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12469816B2 (en) 2022-03-22 2025-11-11 Kabushiki Kaisha Toshiba Semiconductor device

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005049687B4 (de) * 2005-10-14 2008-09-25 Infineon Technologies Ag Leistungshalbleiterbauteil in Flachleitertechnik mit vertikalem Strompfad und Verfahren zur Herstellung
JP4615506B2 (ja) * 2006-12-18 2011-01-19 三菱電機株式会社 樹脂封止型半導体装置
JP4840165B2 (ja) * 2007-01-29 2011-12-21 株式会社デンソー 半導体装置
JP2009200338A (ja) * 2008-02-22 2009-09-03 Renesas Technology Corp 半導体装置の製造方法
JP5075890B2 (ja) * 2008-09-03 2012-11-21 株式会社東芝 半導体装置及び半導体装置の製造方法
KR100888236B1 (ko) 2008-11-18 2009-03-12 서울반도체 주식회사 발광 장치
JP5126278B2 (ja) 2010-02-04 2013-01-23 株式会社デンソー 半導体装置およびその製造方法
WO2012010942A2 (en) 2010-07-22 2012-01-26 Lupin Limited Novel pharmaceutical composition(s) of hiv protease inhibitor(s)
DE102011011861A1 (de) * 2011-02-21 2012-08-23 Osram Opto Semiconductors Gmbh Halbleiterchipgehäuseanordnung und Herstellungsverfahren
ITMI20112300A1 (it) 2011-12-19 2013-06-20 St Microelectronics Srl Realizzazione di dispositivi elettronici di tipo dsc tramite inserto distanziatore
US20140001480A1 (en) * 2012-07-02 2014-01-02 Infineon Technologies Ag Lead Frame Packages and Methods of Formation Thereof
US9478484B2 (en) * 2012-10-19 2016-10-25 Infineon Technologies Austria Ag Semiconductor packages and methods of formation thereof
US8906743B2 (en) * 2013-01-11 2014-12-09 Micron Technology, Inc. Semiconductor device with molded casing and package interconnect extending therethrough, and associated systems, devices, and methods
CN103531551A (zh) * 2013-09-26 2014-01-22 杰群电子科技（东莞）有限公司 一种半导体封装结构及其成型方法
JP6385234B2 (ja) * 2014-10-16 2018-09-05 三菱電機株式会社 半導体装置
JP6620037B2 (ja) * 2016-02-29 2019-12-11 新日本無線株式会社 半導体パッケージ及びその製造方法
JP6967335B2 (ja) * 2016-03-15 2021-11-17 ローム株式会社 半導体装置
JP2018056356A (ja) * 2016-09-29 2018-04-05 株式会社東芝 半導体装置
US10121742B2 (en) * 2017-03-15 2018-11-06 Amkor Technology, Inc. Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure
CN111316428B (zh) * 2017-10-26 2023-10-20 新电元工业株式会社 半导体装置以及半导体装置的制造方法
KR20190071111A (ko) * 2017-12-14 2019-06-24 삼성전자주식회사 엑스선 검사 장비 및 이를 이용하는 반도체 장치 제조 방법
JP6995674B2 (ja) * 2018-03-23 2022-01-14 株式会社東芝 半導体装置
JPWO2024029385A1 (enExample) * 2022-08-05 2024-02-08
JP2024118861A (ja) * 2023-02-21 2024-09-02 株式会社日立製作所 半導体装置およびその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3868777B2 (ja) 2001-09-11 2007-01-17 株式会社東芝 半導体装置
JP3627738B2 (ja) * 2001-12-27 2005-03-09 株式会社デンソー 半導体装置
JP3750680B2 (ja) * 2003-10-10 2006-03-01 株式会社デンソー パッケージ型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12469816B2 (en) 2022-03-22 2025-11-11 Kabushiki Kaisha Toshiba Semiconductor device

Also Published As

Publication number Publication date
JP2006066813A (ja) 2006-03-09
US20060043618A1 (en) 2006-03-02
US7432594B2 (en) 2008-10-07

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