JP4447872B2 - ステージ装置、該ステージ装置を用いた露光装置および該露光装置を用いたデバイス製造方法 - Google Patents

ステージ装置、該ステージ装置を用いた露光装置および該露光装置を用いたデバイス製造方法 Download PDF

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Publication number
JP4447872B2
JP4447872B2 JP2003324214A JP2003324214A JP4447872B2 JP 4447872 B2 JP4447872 B2 JP 4447872B2 JP 2003324214 A JP2003324214 A JP 2003324214A JP 2003324214 A JP2003324214 A JP 2003324214A JP 4447872 B2 JP4447872 B2 JP 4447872B2
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JP
Japan
Prior art keywords
stage
mask
chuck
holding member
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003324214A
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English (en)
Japanese (ja)
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JP2005093654A (ja
JP2005093654A5 (enExample
Inventor
義一 宮島
英雄 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2003324214A priority Critical patent/JP4447872B2/ja
Priority to US10/941,962 priority patent/US7212277B2/en
Publication of JP2005093654A publication Critical patent/JP2005093654A/ja
Publication of JP2005093654A5 publication Critical patent/JP2005093654A5/ja
Priority to US11/675,868 priority patent/US7999919B2/en
Application granted granted Critical
Publication of JP4447872B2 publication Critical patent/JP4447872B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/06—Electromagnets; Actuators including electromagnets
    • H01F7/20—Electromagnets; Actuators including electromagnets without armatures
    • H01F7/206—Electromagnets for lifting, handling or transporting of magnetic pieces or material

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2003324214A 2003-09-17 2003-09-17 ステージ装置、該ステージ装置を用いた露光装置および該露光装置を用いたデバイス製造方法 Expired - Fee Related JP4447872B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003324214A JP4447872B2 (ja) 2003-09-17 2003-09-17 ステージ装置、該ステージ装置を用いた露光装置および該露光装置を用いたデバイス製造方法
US10/941,962 US7212277B2 (en) 2003-09-17 2004-09-16 Substrate holding technique
US11/675,868 US7999919B2 (en) 2003-09-17 2007-02-16 Substrate holding technique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003324214A JP4447872B2 (ja) 2003-09-17 2003-09-17 ステージ装置、該ステージ装置を用いた露光装置および該露光装置を用いたデバイス製造方法

Publications (3)

Publication Number Publication Date
JP2005093654A JP2005093654A (ja) 2005-04-07
JP2005093654A5 JP2005093654A5 (enExample) 2006-11-02
JP4447872B2 true JP4447872B2 (ja) 2010-04-07

Family

ID=34455024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003324214A Expired - Fee Related JP4447872B2 (ja) 2003-09-17 2003-09-17 ステージ装置、該ステージ装置を用いた露光装置および該露光装置を用いたデバイス製造方法

Country Status (2)

Country Link
US (2) US7212277B2 (enExample)
JP (1) JP4447872B2 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100697273B1 (ko) * 2004-09-21 2007-03-21 삼성전자주식회사 설비 유지 보수에 소요되는 로스 타임을 줄일 수 있는반도체 설비의 유닛
JP2006120798A (ja) * 2004-10-20 2006-05-11 Canon Inc 露光装置
JP2006303156A (ja) * 2005-04-20 2006-11-02 Nikon Corp 静電チャック装置および露光装置
US20070157835A1 (en) * 2005-12-29 2007-07-12 Tracy Kucaba Method for mounting a printing plate on a mounting plate
KR101229020B1 (ko) * 2006-06-22 2013-02-01 엘지디스플레이 주식회사 쉐도우 마스크의 자성제거 방법 및 그 장치
JP5013941B2 (ja) * 2007-04-19 2012-08-29 キヤノン株式会社 ステージ装置、露光装置、及びデバイス製造方法
US8490955B2 (en) * 2008-09-19 2013-07-23 The Boeing Company Electromagnetic clamping device
US20110027463A1 (en) * 2009-06-16 2011-02-03 Varian Semiconductor Equipment Associates, Inc. Workpiece handling system
US8864120B2 (en) * 2009-07-24 2014-10-21 The Boeing Company Electromagnetic clamping system for manufacturing large structures
CN102566336B (zh) * 2010-12-30 2015-08-26 上海微电子装备有限公司 掩模版的固定装置及其固定方法
DE202011110339U1 (de) * 2011-07-29 2013-08-29 Ceramtec Gmbh Elektromagnetisches Relais
US8950054B2 (en) * 2012-10-10 2015-02-10 The Boeing Company Manufacturing method and robotic assembly system
US9607907B2 (en) * 2014-12-01 2017-03-28 Industrial Technology Research Institute Electric-programmable magnetic module and picking-up and placement process for electronic devices
CN105014874B (zh) * 2015-08-07 2017-06-16 湖南千豪机电技术开发有限公司 蜂房阵列结构贴装式双面强磁电控永磁模板
DE202017107536U1 (de) * 2017-12-11 2018-01-15 Bystronic Laser Ag Befestigungsvorrichtung für Werkzeugmaschinen und Werkzeugmaschine mit einer Befestigungsvorrichtung
CN108983120B (zh) * 2018-05-30 2020-05-12 东北大学 一种方向可控的均匀磁场装置
CN111244012A (zh) * 2018-11-29 2020-06-05 昆山工研院新型平板显示技术中心有限公司 转移装置以及微元件的转移方法
KR102731926B1 (ko) * 2021-12-28 2024-11-20 세메스 주식회사 가열 플레이트의 전력 단자 접합 장치 및 방법
US20230255098A1 (en) * 2022-02-09 2023-08-10 Universal Display Corporation Organic vapor jet printing system

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4963921A (en) * 1985-06-24 1990-10-16 Canon Kabushiki Kaisha Device for holding a mask
DE69023186T2 (de) * 1989-08-07 1996-03-28 Canon K.K., Tokio/Tokyo Belichtungsvorrichtung.
JPH0737098B2 (ja) 1989-08-17 1995-04-26 東レ株式会社 積層白色ポリエステルフィルム
US6246204B1 (en) * 1994-06-27 2001-06-12 Nikon Corporation Electromagnetic alignment and scanning apparatus
JP3076727B2 (ja) 1994-10-19 2000-08-14 東芝機械株式会社 試料ホルダの固定装置
JP3483452B2 (ja) * 1998-02-04 2004-01-06 キヤノン株式会社 ステージ装置および露光装置、ならびにデバイス製造方法
JP4048593B2 (ja) 1998-04-03 2008-02-20 ソニー株式会社 露光装置
JP3810039B2 (ja) * 1998-05-06 2006-08-16 キヤノン株式会社 ステージ装置
JP2003059797A (ja) * 2001-08-09 2003-02-28 Canon Inc 移動装置、ステージ装置及び露光装置
JP2003142393A (ja) 2001-11-07 2003-05-16 Tokyo Seimitsu Co Ltd 電子ビーム露光装置

Also Published As

Publication number Publication date
US20050093666A1 (en) 2005-05-05
JP2005093654A (ja) 2005-04-07
US7999919B2 (en) 2011-08-16
US20070139851A1 (en) 2007-06-21
US7212277B2 (en) 2007-05-01

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