WO2001027978A1

WO2001027978A1 - Substrate, stage device, method of driving stage, exposure system and exposure method

Info

Publication number: WO2001027978A1
Application number: PCT/JP1999/005539
Authority: WO
Inventors: Masato Takahashi
Original assignee: Nikon Corporation
Priority date: 1999-10-07
Filing date: 1999-10-07
Publication date: 2001-04-19
Also published as: CN1260772C; CN1373900A; KR20020038592A; KR100625625B1; AU6005499A

Abstract

A stage device (4) comprises a support (8) isolated from a surface plate (3) in terms of vibration, and a reaction stage (17) that is allowed to move on the support (8) in one direction by the reaction force exerted when the stage body (2) is driven. Since yawing due to the reaction is eliminated, the setting time decreases and thus throughput improves. In addition, residual vibration is prevented from propagating from the support to the surface plate.

Description

Specification

TECHNICAL FIELD The present invention relates to a substrate, a stage apparatus, a stage driving method, an exposure apparatus, and an exposure method.

The present invention relates to a substrate on which a mask pattern is exposed, such as a glass substrate or a wafer, a stage device in which a stage body holding the substrate moves in a plane on a surface plate, a driving method thereof, and a stage device. The present invention relates to an exposure apparatus and an exposure method for performing an exposure process using a held mask and a substrate. Particularly, when manufacturing a device such as a semiconductor integrated circuit or a liquid crystal display, a substrate and a stage suitable for use in a lithography process are used. The present invention relates to a laser device, a stage driving method, an exposure device, and an exposure method. Background art

2. Description of the Related Art Conventionally, in a lithography process, which is one of the semiconductor device manufacturing processes, a circuit pattern formed on a mask or reticle (hereinafter, referred to as a reticle) is formed on a wafer or glass plate coated with a resist (photosensitive agent). Various exposure apparatuses for transferring onto a substrate are used. For example, as an exposure apparatus for a semiconductor device, a pattern of a reticle is projected on a wafer using a projection optical system in accordance with the miniaturization of the minimum line width (device rule) of a pattern accompanying the high integration of an integrated circuit in recent years. A reduction projection exposure apparatus that performs reduction transfer on the top is mainly used.

This reduction projection exposure apparatus is a step-and-repeat type static exposure reduction projection exposure apparatus (so-called stepper) that sequentially transfers a reticle pattern to a plurality of shot areas (exposure areas) on a wafer. This stepper is an improvement on the reticle and wafer in a one-dimensional direction by synchronously moving the reticle and the wafer as disclosed in Japanese Patent Laid-Open No. 8-16643, etc. There is known a scanning exposure type exposure apparatus of the 'and' scan type (so-called scanning 'stepper').

In these reduction projection exposure apparatuses, a base plate serving as a reference for the apparatus is first installed on the floor as a stage apparatus, and a reticle stage, a wafer stage, and a projection apparatus are placed on the base plate via a vibration isolating table for isolating floor vibration. Optical system (projection lens) The one on which a main body column for supporting the like is mounted is often used. Recent stage devices are equipped with an air mount that can control the internal pressure and an actuator such as a voice coil motor as the vibration isolator, and are mounted on the main body column (main frame). An active anti-vibration table that controls the vibration of the main body column by controlling the voice coil module based on the measurement value of an accelerometer is employed.

However, in the above-described stepper and the like, after exposing a certain shot area on a wafer and then sequentially exposing the other shot areas, the wafer stage (in the case of a stepper), or a reticle stage and a wafer stage The reaction force generated by the acceleration and deceleration movement (in the case of scanning 'stepper') caused vibration of the main body column, causing a relative position error between the projection optical system and the wafer. The relative position error at the time of alignment and at the time of exposure may result in image blur (increase in pattern line width) when a pattern is transferred to a position different from the design value on the wafer as a result, or when the position error includes a vibration component. Or inconvenience). Therefore, in order to suppress such inconvenience, it is necessary to sufficiently attenuate the vibration of the main body column by the above-mentioned active vibration isolator. For example, in the case of a stepper, it is necessary to start an alignment operation or an exposure operation after the wafer stage is positioned at a desired position and sufficiently adjusted. Further, in the case of a scanning stepper, it was necessary to perform exposure while ensuring that the reticle stage and the wafer stage were set in synchronization. For this reason, it was a factor that worsened throughput (productivity).

In order to improve such inconvenience, for example, as described in Japanese Patent Application Laid-Open No. 8-166475, the reaction force generated by the movement of the wafer stage is mechanically reduced by using a frame member. In addition, as described in Japanese Patent Application Laid-Open No. H8-330224, for example, the invention in which the reticle stage is moved to the floor (ground), the reaction force generated by the movement of the reticle stage is mechanically controlled by using a frame member. The invention which escapes to the floor (ground) is known. However, the conventional stage apparatus and exposure apparatus as described above have the following problems.

With the recent increase in the size of reticles and wafers, both stages have become larger. Even if the invention described in Japanese Patent Publication No. 8—1 6 6 4 75 or Japanese Patent Publication No. 8-3330202 is used, the reaction force transmitted to the frame member and escaping to the floor side can be reduced. As a result, the frame member itself vibrates, or the reaction force escaping to the floor is transmitted to the main column (main body) that holds the projection optical system via the anti-vibration table, and excites it. May occur. Therefore, it is difficult to perform high-precision exposure while securing a certain level of throughput.

Therefore, for example, in Japanese Patent Application Laid-Open No. H08-632321, a stage body and a drive frame which are levitated and supported on a base are provided, and the driving fan is retracted by a reaction force accompanying the forward movement of the stage body. A technique for performing this is disclosed. According to this technology, the law of conservation of momentum acts between the stage body and the drive frame, and the position of the center of gravity of the device on the base is maintained, so that the influence of vibration on the frame member can be reduced. . However, even when this technology was adopted, the effects of the above-mentioned reaction force could not be completely eliminated if the stage was enlarged or speeded up.

The present invention has been made in consideration of the above points, and has a stage device, a stage driving method, and an exposure method capable of maintaining the position controllability of a stage even when a large stage or a high-speed stage is used. It is an object to provide an apparatus and an exposure method. Another object of the present invention is to provide an exposure apparatus and an exposure method that can perform high-precision exposure while securing a certain level of throughput even when a large stage or a high-speed stage is used. Still another object of the present invention is to provide a substrate on which a pattern has been exposed with high precision. Disclosure of the invention

In order to achieve the above object, the present invention employs the following configuration corresponding to FIGS. 1 to 7 showing the embodiment.

The stage device of the present invention is a stage device (4, 7) including a stage body (2, 5) driven at least in one direction on a surface plate (3, 6), ), And a supporting portion (8, 10) which is arranged independently in vibration, and a reaction force generated by driving the stage body (2, 5) on the supporting portion (8, 10). And a reaction force stage (17, 37) that is movable in the direction. Also, The stage driving method of the present invention is a stage driving method including a first stage (2, 5) driven in at least one direction on a surface plate (3, 6), wherein the first stage

The second stage (17, 37〗), which is movable in one direction by the reaction force accompanying the driving of (2.5), makes the supporting parts (8, 10) that are vibrationally independent of the platen (3, 6) Therefore, in the stage apparatus and the stage driving method of the present invention, the stage body (2, 5) as the first stage is provided on the surface plate (3, 6). When the stage is driven in one direction, the reaction force (17, 37), which is the second stage, is in the opposite direction to the stage body (2, 5) due to the reaction force accompanying the drive of the stage body (2, 5). Therefore, the law of conservation of momentum works between the stage body (2, 5) and the reaction force stage (17, 37). The reaction force stage (17, 37) is connected to the surface plate (3, 6). In order to move on the vibration independent support parts (8, 10),

The vibration of (8, 10) is not transmitted to the surface plate (3, 6), and can prevent the position controllability of the stage body (2, 5) from being affected.

Further, the exposure apparatus of the present invention exposes a pattern of a mask (R) held on a mask stage (2) to a substrate (W) held on a substrate stage (5).

In (1), as at least one of the mask stage (2) and the substrate stage (5), the stage device (4, 7) according to any one of claims 1 to 9 is provided. ) Is used. The exposure method of the present invention is a method of exposing a pattern of a mask (R) held on a mask stage (2) to a substrate (W) held on a substrate stage (5). 21. A method for driving at least one of the stage (2) and the substrate stage (5), wherein the stage driving method described in any one of claims 17 to 20 is used. It is. Therefore, in the exposure apparatus and the exposure method of the present invention, the stage body holding the mask (R) or the substrate (W)

Performs high-precision exposure because the settling time of (2, 5) is shortened, throughput is improved, and the position controllability can be maintained by suppressing the influence of vibration applied to the stage body (2, 5). be able to. Also, mask stage (2), substrate stage

By making the projection optical system (PL) and the projection optical system (PL) vibrationally independent of each other, the vibration caused by the drive of the mask stage (2) and the substrate stage (5) is reduced to the projection optical system (P). L) Since transmission can also be prevented, the imaging characteristics of the pattern of the mask (R) can be improved. Then, the pattern of the mask (R) is transferred with high precision onto the substrate (W) exposed by these exposure methods. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a view showing a first embodiment of the present invention, and is a schematic configuration diagram of an exposure apparatus in which a reticle stage, a wafer stage, and a projection optical system are independently arranged with respect to vibration.

FIG. 2 is an external perspective view of a stage device having the reticle stage. FIG. 3 is a view showing the first embodiment of the present invention, and is a side view of a stator having springs connected to both sides.

: 114 is a partially enlarged view of a stage device having a wafer stage.

Fig. 5 is an enlarged view of the main part of the linear motor that drives the wafer stage. FIG. 6 is a view showing the second embodiment of the present invention, and is a schematic configuration diagram of an exposure apparatus in which a reticle stage, a wafer stage, and a projection optical system are independently arranged with respect to vibration.

FIG. 7 is an external perspective view showing another embodiment of the stage device having the wafer stage.

FIG. 8 is a flowchart illustrating an example of a semiconductor device manufacturing process. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of a substrate, a stage apparatus, a stage driving method, an exposure apparatus, and an exposure method according to the present invention will be described with reference to FIGS. 1 to 7. Here, a description will be given using an example in which a scanning stepper is used as an exposure apparatus that transfers a circuit pattern of a semiconductor device formed on a reticle onto a wafer while simultaneously moving the reticle and the wafer. I do. In this exposure apparatus, the stage apparatus of the present invention is applied to both a reticle stage and a wafer stage.

[First Embodiment] First, a first embodiment will be described with reference to FIGS. The exposure apparatus 1 shown in FIG. 1 includes an illumination optical system IU that illuminates a rectangular (or circular) illumination area on a reticle (mask) R with uniform illumination by exposure illumination light from a light source (not shown). A reticle stage (stage body, first stage) 2 as a mask stage for holding reticle R, and a reticle surface plate (surface plate) 3 for supporting reticle stage 2, a stage device 4 including a reticle R, which is ejected from reticle R Projection optical system PL that projects illumination light onto wafer (substrate) W, wafer stage (stage body, first stage) 5 as a substrate stage that holds wafer W, and wafer surface plate that holds wafer stage 5 ( A stage device 7 including a surface plate 6, a stage device 4, and a reaction frame (support portion) 8 for supporting the projection optical system PL. Here, the direction of the optical axis of the projection optical system PL is defined as the Z direction, the direction of the synchronous movement of the reticle R and the wafer W in the direction perpendicular to the Z direction is defined as the Y direction, and the direction of the asynchronous movement is defined as the X direction. Also, the rotation directions around each axis are Θ Ζ, 6> Υ, 6> Χ.

The illumination optical system I U is supported by a support column 9 fixed to the upper surface of the reaction frame 8. The illumination light for exposure includes, for example, ultraviolet bright lines (g-line, i-line) and KrF excimer laser light (wavelength) emitted from an ultra-high pressure mercury lamp.

Deep ultraviolet light (DUV light) such as 248 nm) or ArF excimer laser light (wavelength 19

3 nm) and F ₂ laser beam (wavelength: 1 5 7 nm) vacuum ultraviolet light such as (VUV) and the like. The reaction frame 8 is installed on a base plate 10 placed horizontally on the floor surface, and the upper and lower sides thereof have stepped portions 8a and 8b protruding inward. Each is formed.

In the stage device 4, the reticle surface plate 3 is supported substantially horizontally by a step portion 8a of the reaction frame 8 at each corner via a vibration isolating unit (vibration isolating mechanism) 11 (see FIG. 1). The anti-vibration unit on the back side of the drawing is not shown), and an opening 3a through which the pattern image formed on the reticle R passes is formed at the center. The vibration proof unit 11 is configured such that an air mount 12 whose internal pressure is adjustable and a voice coil motor 13 are arranged in series on the step 8a. These anti-vibration units 11 allow reticulation via the base plate 10 and the reaction frame 8. Micro vibration transmitted to the surface plate 3 is insulated at the micro G level. A reticle stage 2 is supported on the reticle base 3 so as to be two-dimensionally movable along the reticle base 3. A plurality of air bearings (air pads) 14 which are non-contact bearings are fixed to the bottom surface of the reticle stage 2, and the reticle stage 2 is mounted on the reticle surface plate 3 by the air bearings 14. It is levitated and supported through the clearance of about Kron. At the center of the reticle stage 2, there is formed an opening 2a which communicates with the opening 3a of the reticle surface plate 3 and through which the pattern image of the reticle R passes. The reticle stage 2 is driven by a pair of linear motors (driving mechanisms) 15 on the reticle surface plate 3 in the scanning direction in the Y direction within a predetermined stroke range. The reticle stage 2 includes a reticle fine movement stage (not shown) that sucks and holds the reticle R and minutely drives the reticle R in the non-scanning direction (X direction) and 6> Z direction, and is connected to the fine movement stage and moves in the X and Y directions. It has a movable coarse movement stage, but these are shown here as one stage. Therefore, the reticle stage 2 is configured to be linearly driven with a long stroke in the Y direction and to be capable of minutely driving in the X and directions.

As shown in FIG. 2, a pair of Y movable mirrors 18a and 18b each composed of a corner cube are fixed to one end of the reticle stage 2 in the Y direction, and the + X direction of the reticle stage 2 in the + X direction is fixed. An X movable mirror 19 composed of a flat mirror extending in the Y direction is fixed to the end. Then, three laser interferometers (all not shown) that irradiate these movable mirrors 18a, 18b, and 19 with measuring beams measure the distance to each movable mirror, and the reticle stage The position in the X, Y, and (rotation around the Ζ axis) direction of 2 is measured with high accuracy.

As shown in FIG. 1, a movable element 16 having a built-in coil and extending in the Υ direction is provided integrally with the reticle stage 2 at approximately the center in the Ζ direction on both sides in the X direction of the reticle stage 2. A pair of stators 17 having a U-shaped cross section as reaction force stages (second stages) are arranged opposite to the mover 16. The stator 17 is composed of a stator yoke and a large number of permanent magnets that generate an alternating magnetic field arranged at predetermined intervals along the extending direction of the stator yoke. That is, mover A moving coil type linear motor 15 is constituted by 16 and the stator 1 、, and the mover 16 is driven in the Υ direction (one direction) by electromagnetic interaction with the stator 17. It is supposed to be. The weight ratio of the reticle stage 2 side including the mover 1 6 etc. and the stator 1 7 side is approximately 1: _c that is set to 4

As shown in FIG. 2, a rolling guide 20 is interposed between each stator 1 Ί and the upper surface of the reaction frame 8. The rolling guide 20 has a configuration in which a plurality of rollers (rolling elements) 21 whose axis extends in the X direction and rotates around each axis are arranged at a certain interval in the Y direction. The stator 17 is movable in the Y direction with respect to the reaction frame 8 by the rotation of the roller 21. Also, as shown in FIG. 3, a pair of springs (biasing portions) 2 2, 2 2 constituting a return device for returning the stator 17 to the initial position are provided on both sides in the Y direction of each stator 17. One end of each is connected to T1. The other ends of these springs 22 are fixed to the reaction frame 8, and urge (for example, pull) the stators 17 with substantially the same force in directions opposite to each other along the Y direction. It is. In addition, each spring 22 has a sufficient amount of flexure to be deformed within the elastic range even when the stator 17 moves. As is apparent from FIGS. 1 and 2, the reticle stage 2 is a guideless stage having no guide member for guiding the movement of the reticle stage 2 in the X and Y directions.

Returning to Fig. 1, as the projection optical system PL, here, both the object plane (reticle R) side and the image plane (wafer W) side are telecentric and have a circular projection field, and quartz or fluorite is used as the optical glass material. A 1/4 (or 1/5) refractive optical system composed of a refractive optical element (lens element) is used. For this reason, when illumination light is irradiated on reticle R, of the circuit pattern on reticle R, an image forming light beam from a portion illuminated by the illumination light is incident on projection optical system PL, and the circuit pattern is partially inverted. The image is limited to a slit at the center of the circular field on the image plane side of the projection optical system PL and is formed. As a result, the partial inverted image of the projected circuit pattern is reduced and transferred to the resist layer on one of the shot areas out of a plurality of shot areas on the wafer W arranged on the imaging plane of the projection optical system PL. Is done.

FIG. 4 shows an enlarged view below the projection optical system PL of the exposure apparatus 1. This As shown in the figure, a flange 23 integrated with the lens barrel is provided on the outer periphery of the lens barrel of the projection optical system PL. The projection optical system PL is mounted on a barrel base 25 composed of an object or the like that is supported substantially horizontally on a step 8 b of the reaction frame 8 via a vibration isolating unit 24. Is inserted from above in the Z direction, and the flanges 23 are engaged. The material of the flange 23 is a material having a low thermal expansion, such as Invar (reduced by Invar; nickel 36%, manganese 0.25%, and iron containing trace amounts of carbon and other elements). Expansion alloy) is used. The flange 23 constitutes a so-called kinematic support mount that supports the projection optical system PL at three points with respect to the barrel base 25 via points, surfaces, and V-grooves. By adopting such a kinematic support structure, it is easy to assemble the projection optical system PL to the barrel base 25, and vibration, temperature change, etc. of the assembled barrel base 25 and the projection optical system PL. It has the advantage that the stresses caused by stress can be reduced most effectively:

The anti-vibration unit 24 is arranged at each corner of the lens barrel base 25 (the anti-vibration unit on the back side of the drawing is not shown), and the air mount 26 and the voice coil module whose internal pressure can be adjusted. The configuration is such that overnight 27 is arranged in series on step 8b. These vibration isolation units 24 insulate the micro-vibrations transmitted to the lens barrel base 25 (and, consequently, the projection optical system PL) via the base plate 10 and the reaction frame 8 at the microphone opening G level. ing.

The stage device 7 mainly includes a wafer stage 5 for holding a wafer W, and a wafer surface plate 6 for supporting the wafer stage 5 movably in a two-dimensional direction along the XY plane. As shown in FIG. 4, a plurality of air bearings (air pads) 28, which are non-contact bearings, are fixed to the bottom surface of the wafer stage 5, and the wafer stage 5 is fixed by the air bearings 28. On the board 6, for example, it is levitated and supported by a clearance of about several microns.

The wafer surface plate 6 is supported substantially horizontally above a base plate (support portion) 10 via a vibration isolating unit (vibration isolating mechanism) 29. The anti-vibration units 29 are arranged at each corner of the wafer surface plate 6 (the anti-vibration unit on the back side of the drawing is not shown), and the air mount 30 and the voice coil motor 3 whose internal pressure can be adjusted. 1 and 1 It is configured to be arranged in parallel on the subnote 10. By these vibration isolating units 29, the micro vibration transmitted to the wafer surface plate 6 via the base plate 10 is insulated by the microphone opening G bell.

The wafer stage 5 includes a pair of linear motors 32 that drive the wafer stage 5 in the X direction (a linear motor closer to the paper than the wafer stage 5 is not shown) and the wafer stage 5 that drives the wafer stage 5 in the Y direction. The pair of linear motors (drive mechanisms) 33 makes it possible to freely move in the XY two-dimensional direction on the wafer surface plate 6. The stator of the linear motor 32 is extended along the X direction on both outer sides of the wafer stage 5 in the Y direction, and both ends are connected to each other by a pair of connecting members 34. Body 35 is composed. The movers of the linear motor 32 project from both sides in the Y direction of the wafer stage 5 so as to face the stator.

Further, on the lower end surfaces of the pair of connecting members 34 or the linear motors 32 constituting the frame 35, movers 36 and 36 composed of armature units are provided, respectively. The stators (reaction force stages) 37, 37 as the second stage having magnet units corresponding to the stators 36, 36 extend in the Y direction. As shown in FIG. 5, a rolling guide 38 is interposed between each stator 37 and the base plate 10. The rolling guide 38 has a configuration in which a plurality of rollers (rolling elements) 39 whose axes extend in the X direction and rotate around each axis are arranged at regular intervals in the Y direction. The stator 37 is movable in the Y direction with respect to the base plate 10 as a support by the rotation of the roller 39.

As shown in FIG. 3, similarly to the stator 17, on both sides in the Y direction of each of the stators 37, a pair of springs (biasing members) constituting a return device for returning the stator 37 to the initial position is provided. Part) One end of 40, 40 is connected to each. The other ends of these springs 40 are fixed to the base plate 10, and urge (eg, pull) the stators 37 with substantially the same force in opposite directions along the Y direction. It is. In addition, each spring 40 is set to have a sufficient radius so as to be deformed within the elastic range even when the stator 37 moves.

A moving coil type linear motor 33 is constituted by the mover 36 and the stator 3 7, and the mover 36 has an electromagnetic phase between the mover 36 and the stator 37. It is driven in the Y direction (one direction) by interaction. That is, the linear stage 33 drives the wafer stage 5 integrally with the frame 35 in the Υ direction. As is apparent from FIG. 4, the wafer stage 5 is a guided stage having no guide member for the movement in the vertical direction. It should be noted that the movement of the wafer stage 5 in the X direction can be appropriately set as a guide stage.

The wafer W is fixed on the upper surface of the wafer stage 5 via a wafer holder 41 by vacuum suction or the like. In addition, the position of the wafer stage 5 in the X direction is based on the reference mirror 42 fixed to the lower end of the barrel of the projection optical system PL, and the position change of the movable mirror 43 fixed to a part of the wafer stage 5 is used as a reference. Laser interferometer 44, which is a position measuring device for measurement, whereby measurement is performed in real time with a predetermined resolution, for example, a resolution of about 0.5 to 1 nm. Note that the position of the wafer stage 5 in the Y direction is determined by a reference mirror, a moving mirror, and a laser interferometer (not shown) arranged so as to be substantially orthogonal to the reference mirror 42, the moving mirror 43, and the laser interferometer 44. Measured. At least one of these laser interferometers is a multi-axis interferometer having two or more measuring axes. Based on the measurement values of these laser interferometers, the XY of the wafer stage 5 (and thus the wafer W) is determined. Not only the position, but also 9 rotations or the leveling amount in addition to them can be obtained.

The reticle surface plate 3, the wafer surface plate 6, and the lens barrel surface plate 25 include three vibration sensors (for example, an accelerometer; not shown) for measuring the vibration in the Z direction of each surface plate, and an XY plane. Three vibration sensors (for example, accelerometers; not shown) that measure inward vibration are attached to each. Two of the latter vibration sensors measure the vibration of each surface plate in the Y direction, and the remaining vibration sensors measure the vibration in the X direction (hereinafter referred to as the vibration sensor group for convenience). ). Then, based on the measured values of these vibration sensors, the vibrations of the six degrees of freedom (Χ, Υ, Ζ, 0Χ, Θ Ύ Θ の) of the reticle surface plate 3, the wafer surface plate 6, and the lens barrel surface plate 25 are obtained. It can be sought.

Further, as shown in FIG. 4, three laser interferometers 45, which are position detecting devices, are fixed to the flanges 23 of the projection optical system PL at three different places (however, in FIG. One of the laser interferometers is typically shown). Each —Apertures 25a are formed in the part of the barrel base 25 facing the interferometer 45, and each laser interferometer 45 is moved in the Z direction through these openings 25a. The measurement beam is applied to the wafer surface plate 6. Reflection surfaces are formed on the upper surface of the wafer surface plate 6 at positions facing the respective measurement beams. For this reason, three different Z positions of the wafer surface plate 6 are measured by the three laser interferometers 45 with reference to the flange 23 (however, in FIG. Since the shot area at the center of the wafer W is shown immediately below the optical axis of the projection optical system PL, the measurement beam is blocked by the wafer stage 5). A reflection surface may be formed on the upper surface of the wafer stage 5 and an interferometer for measuring three different Z-direction positions on the reflection surface with reference to the projection optical system PL or the flange 23 may be provided.

Next, among the stage devices 4 and 7 having the above configuration, first, the operation of the stage device 4 will be described.

When the reticle stage 2 moves in the scanning direction (for example, in the + Y direction) by driving the linear motor 15, the stator 17 rolls due to the reaction force of the driving, and moves in the opposite direction on the reaction frame 8 by the rolling guide 20. (Y direction). At this time, in the rolling guide 20, since the roller 21 rotates, the stator 17 moves smoothly.

Here, when the friction between the reticle stage 2 and the stator 1 Ί and the reticle surface plate 3 is zero, the law of conservation of momentum works, and the stator 1 7 associated with the movement of the reticle stage 2 7 Is determined by the weight ratio of the reticle stage 2 side (including Y movable mirrors 18a and 18b, X movable mirror 19, mover 16 and reticle R) to the stator 17 side Is done. Specifically, since the weight ratio between the reticle stage 2 side and the stator 17 side is about 1: 4, for example, a movement of 30 cm in the + Y direction of the reticle stage 2 causes the stator 17 to move one Y Move 7.5 cm in the direction.

Therefore, the reaction force of the reticle stage 2 during acceleration / deceleration in the scanning direction is absorbed by the movement of the stator 17, and the position of the center of gravity of the stage device 4 is substantially determined in the Y direction. Also, the reaction frame 8 on which the stator 17 is supported supports the reticle surface plate 3 via the vibration isolation unit 11, so that these reaction The frame 8 and the reticle platen 3 are vibrationally independent. Therefore, even when the reticle stage 2 is driven, it is possible to effectively suppress the reticle surface plate 3 from vibrating due to the reaction force. When the stator 17 moves in the −Y direction, the urging force of the urging portion 22 shown in FIG. 3 with respect to the stator 17 is lost, and the stator 17 is urged in the + Y direction. The power to do increases. Therefore, the stator 17 promptly returns to the position where the above-mentioned biasing force is balanced, that is, the initial position (initial position).

The anti-vibration unit 11 feeds a force (counter force) to cancel the influence of the change in the center of gravity due to the movement of the reticle stage 2 based on the measurement value of the laser interferometer, and generates this force. The air mount 12 and the voice coil motor 13 are driven in such a manner as to operate. Also, the friction between the notch stage 2 and the '. SI constant 17 and the reticle surface 3 is not zero, or the moving direction between the reticle stage 2 and the stator 17 is slightly different. Therefore, even if minute vibrations of the reticle surface plate 3 in the directions of six degrees of freedom remain, the air mount 12 and the voice coil module 13 are used to remove the residual vibrations based on the measurement values of the vibration sensors. Feedback control.

On the other hand, in the stage device 7, the same operation as in the stage device 4 occurs.

When the wafer stage 5 is moved in the scanning direction (+ Y direction) by the driving of the linear motor 33, the stator 37 is rolled by the reaction force of the driving, and the guide 37 guides the stator 38 in the opposite direction on the base plate 10. (Y direction). At this time, in the rolling guide 38, since the roller 39 rotates, the stator 37 moves smoothly. When the friction between the wafer stage 5, the stator 37, and the wafer surface plate 6 is zero, the law of conservation of momentum works, and the movement of the stator 37 with the movement of the wafer stage 5 is performed. The momentum is determined by the weight ratio between the wafer stage 5 side and the stator 37 side. For this reason, the reaction force of the wafer stage 5 during acceleration / deceleration in the scanning direction is absorbed by the movement of the stator 37, and the position of the center of gravity of the stage device 7 is substantially fixed in the Y direction. Since the base plate 10 on which the base plate 37 is supported supports the wafer base plate 6 through the vibration isolating unit 29, the base plate 10 and the wafer base plate 6 vibrate. Become independent independently. Therefore, when the wafer stage 5 is driven, In addition, it is possible to effectively suppress the wafer surface plate 6 from vibrating due to the reaction force. When the stator 37 moves in the −Y direction, the balance of the urging force of the urging portion 40 shown in FIG. 3 with respect to the stator 37 is broken, and the stator 37 is urged in the + Y direction. Power increases. Therefore, the stator 37 quickly returns to the position where the urging force is balanced, that is, the initial position (initial position).

Then, in the anti-vibration unit 29, a count force for canceling the influence of the change in the center of gravity due to the movement of the wafer stage 5 is given in feed feed based on the measurement value of the laser interferometer 44, etc. The air mount 33 and the voice coil motor 31 are driven to generate this force. In addition, the friction between the three members of the wafer stage 5, the stator 37, and the wafer surface plate 6 is not zero, or the movement direction of the wafer stage 5 and the stator 37 is slightly different. Even if minute vibrations in the 6-DOF direction of the surface plate 6 remain, the air mount 30 and the voice coil motor 31 are fixed to remove the above-mentioned residual vibrations based on the measurement values of the vibration sensors. Control back.

Also, in the lens barrel base 25, even if the stators 17 and 37 move due to the reaction force due to the movement of the reticle stage 2 and the wafer stage 5, even if slight vibrations occur in the reaction frame 8, the reaction frame A vibration proof unit 24 is interposed between the vibration control unit 8 and the vibration control unit 8 to be independent with respect to vibration. Also, even if a slight vibration occurs in the lens barrel base 25, vibration in six degrees of freedom is obtained based on the measurement values of the vibration sensors provided in the lens barrel base 25, and the air mount 26 and By performing feedback control on the voice coil motor 27, this minute vibration can be canceled, and the lens barrel base 25 can be constantly maintained at a stable position. Therefore, the projection optical system PL supported by the barrel base 25 can be maintained at a stable position, and the occurrence of displacement of the pattern transfer standing position and image blur due to the vibration of the projection optical system PL can be prevented. Exposure can be effectively prevented to improve exposure accuracy.

Subsequently, the exposure operation in the exposure apparatus 1 having the above configuration will be described below. It is assumed that various exposure conditions for scanning and exposing a shot area on the wafer W with an appropriate exposure amount (target exposure amount) are set in advance. Each of them uses a reticle microscope (not shown) and an optics alignment sensor. Preparations such as alignment and baseline measurement are performed, and then the alignment of the wafer W using alignment sensors (EGA; Enhanced Global) is completed, and multiple shots on the wafer W are completed. The array coordinates of the area can be determined.

In this way, when the preparatory operation for exposure of the wafer W is completed, the linear motors 32 and 33 are controlled while monitoring the measurement values of the laser interferometer 44 based on the alignment results. The wafer stage 5 is moved to the scanning start position for the exposure of the first shot of W. Then, the reticle stage 2 and the wafer stage 5 start scanning in the Y direction via the linear motors 15 and 33, and when both stages 2 and 5 reach their respective target scanning speeds, they are exposed. The pattern area of reticle パターン is illuminated by the illumination light, and scanning exposure is started.

During this scanning exposure, the moving speed of the reticle stage 2 in the Y direction and the moving speed of the wafer stage 5 in the Y direction depend on the projection magnification (1/5 or 1 / 4ι 咅) of the projection optical system PL. The reticle stage 2 and the wafer stage 5 are synchronously controlled via the linear motors 15 and 33 so that the speed ratio is maintained. Then, different areas of the pattern area of the reticle R are sequentially illuminated with illumination light, and the illumination of the entire pattern area is completed, whereby the scanning exposure of the first shot on the wafer W is completed. Thus, the pattern of the reticle R is reduced and transferred to the first shot area on the wafer W via the projection optical system PL.

In this way, when the scanning exposure of the first shot is completed, the wafer stage 5 is stepped in the X and Y directions via the linear motors 32 and 33, and is moved to the scanning start position for the exposure of the second shot. Is done. During this step movement, the position of the wafer stage 5 in the X, Y, and direction is measured in real time based on the measurement value of the laser interferometer 44 that detects the position of the wafer stage 5 (the position of the wafer W). . Then, based on the measurement results, the linear motors 32 and 33 are controlled to control the position of the wafer stage 5 so that the XΥ position displacement of the wafer stage 5 is in a predetermined state. Further, with respect to the displacement of the wafer stage 5 in the direction 6> Ζ, the rotation of the reticle stage 2 is controlled so as to correct the error of the rotational displacement on the wafer W side based on this displacement information. Then, like the first shot area, the second shot area Scanning exposure.

In this manner, the scanning exposure of the short area on the wafer W and the step movement for the next short exposure are repeatedly performed, and the pattern of the notch R is sequentially transferred to the entire exposure target shot area on the wafer W. You.

In the stage apparatus and the exposure apparatus of the present embodiment, the stators 17 and 37 move in opposite directions by the reaction force when the reticle stage 2 and the wafer stage 5 are driven. The law works, and it is possible to prevent these reaction forces from being transmitted to the reaction frame 8, the base plate 10, and even the floor, and to avoid problems such as swinging back, so that the reticle R or wafer W becomes larger, Even when moving at high speed, the settling time is shortened, and the throughput and exposure accuracy can be improved. In addition, the reaction frame 8 supports the reticle surface plate 3 via the vibration isolation unit 11 and the base plate 10 supports the wafer surface plate 6 via the vibration isolation unit 29. The transmission of the residual vibration of the sample 10 to the reticle platen 3 and the wafer platen 6 can be suppressed, and the standing controllability of each of the stages 2 and 5 can be maintained.

In the present embodiment, a part of the linear motors 15 and 33 for driving each of the stages 2 and 5 is replaced with a stator 17 and 37 for forming each of the stages 2 and 5. Since it is moved by the reaction force, there is no need to separately provide a mechanism for eliminating the reaction force, and it is possible to realize a reduction in size and cost of the device. When the stators 17 and 37 move by the above-described reaction force, the rollers 21 and 39 are rotated by a simple operation of rotating around the axis, so that the device can be simplified.

Further, in the present embodiment, since the springs 22 and 40 urge the stators 17 and 37 in directions opposite to each other, the stators 17 and 37 move by the reaction force. In this case, it can be easily returned to the initial position by a simple mechanism.

Further, in the exposure apparatus of the present embodiment, reticle stage 2, wafer stage 5, and projection optical system PL are vibrationally independent by anti-vibration units 11, 29, and 24. It is possible to prevent the vibration caused by the drive of the wafer stage 5 from being transmitted to the projection optical system PL, and to effectively prevent the displacement of the pattern transfer position and the occurrence of image blur due to the vibration of the projection optical system PL for exposure. Improve accuracy You can also plan.

[Second embodiment]

FIG. 6 is a diagram showing a second embodiment of the stage apparatus and the exposure apparatus of the present invention. In this figure, the same elements as those of the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and description thereof will be omitted. The difference between the second embodiment and the first embodiment is the configuration of the stage device 7, which will be described below.

As shown in this figure, the stage device 7 mainly includes a wafer stage 5, a wafer surface plate 6, and a support plate (reaction stage) 46 for supporting these from below. The stator 37 is configured to move in the Y direction with respect to the support plate 46 by a rolling guide 38 interposed between the stator 37 and the support plate 46. Further, the wafer surface plate 6 also has a configuration independent of the vibration with respect to the support plate 46 by the vibration isolating unit 29 disposed between the wafer platen 6 and the support plate 46. Therefore, the support plate 46 plays a role as a support portion with respect to the reaction force movement of the stator 37.

A rolling guide 48 including a plurality of rollers (rolling elements) 47 is interposed between the support plate 46 and the base plate 10. The rollers 47 are respectively rotated around an axis extending in the Y direction, and are arranged at regular intervals in the X direction. The support plate 46 is movable around the axis of the roller 47 in the X direction relative to the base plate 10. Other configurations are the same as those of the first embodiment.

In the stage apparatus and the exposure apparatus of the present embodiment, the same operation and effect as those of the first embodiment can be obtained, and in addition, when the wafer stage 5 moves in the + X direction, The supporting plate 46 moves in the X direction due to the reaction force accompanying the movement of stage 5, and the law of conservation of momentum works. Therefore, not only when the wafer stage 5 is moved for scanning exposure, but also when the wafer stage 5 is step-moved to change the shot area, the wafer stage 5 may be rejected due to the reaction force caused by the step movement. Since the problem can be avoided, the settling time becomes shorter, and the throughput and the exposure accuracy can be further improved. Also in this embodiment, the base spray G and the residual vibration of the support plate 46 can be suppressed from being transmitted to the wafer surface plate 6, and the position controllability of the stage 5 and the stage 5 can be maintained.

[Third Embodiment]

FIG. 7 is a view showing a third embodiment of the stage apparatus and the exposure apparatus of the present invention. In this figure, the same elements as those of the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and description thereof will be omitted. The difference between the third embodiment and the first embodiment is the configuration of the wafer stage 5, which will be described below.

As shown in the figure, on both sides of the projection optical system PL in the Y direction, there are provided, at predetermined intervals, the opacity alignment sensors 49a and 49b, and the alignment sensors 49a are provided. , 49b are provided along the direction in which the wafer stages are arranged. Each wafer stage 5 is provided with a magnet unit (not shown) that forms a moving coil type linear motor mover. The wafer stage 5 is independently movable along a wafer platen 6 along a linear guide 50 extending in the X direction as a stator having an armature unit. . At both ends of the linear guide 50, the above-mentioned mover 36 composed of an armature unit is provided so as to protrude downward, and is fixed to both the movers 36, 36 of both wafer stages 5, 5. The child 37 extends in the Υ direction. Accordingly, each wafer stage 5 is configured to move in the X direction along the linear guide 50 and to independently move in the Υ direction along the stator 37. Note that, in FIG. 7, illustration of a movable mirror, an index member, and the like installed on the wafer stage 5 is omitted.

In the exposure apparatus having the above configuration, as shown in FIG. 7, the wafer W on the wafer stage 5 located on the −Υ side is moved to the + Y side during the exposure operation through the projection optical system PL. Alignment is performed on the wafer W on the wafer stage 5 located. More specifically, first, an alignment mark (not shown) formed on the index member and the wafer W is measured using the + Y-side alignment sensor 49a, and the wafer W is determined based on the measurement result. Pre-alignment. Next, the alignment of each shot area on the wafer W, for example, by using the EGA, is performed while moving the wafer stage 5. And the wafer stage after the exposure sequence 5 is moved in the Y direction, the wafer is replaced immediately below the alignment sensor 49b, and then the above alignment sequence is executed. The wafer stage 5 that has been aligned by the alignment sensor 49a also moves in the Y direction, and the exposure sequence is executed immediately below the projection optical system PL.

In the present embodiment, in addition to obtaining the same effects as those of the first embodiment, the two wafer stages 5, 5 are moved independently, and wafer exchange and alignment are performed on one of the stages. The operation is performed, and the exposure operation is performed in parallel on the other stage, so that the throughput can be greatly improved. In addition, since the stator 37 used when each stage moves in the Y direction is shared by the movers 36 of both stages, the number of parts is reduced, that is, the equipment is simplified and the price is reduced. Can be realized.

In the above embodiment, the cocoons 21, 39, 47 are provided as means for moving the stators 17, 37 in the Y direction. However, the present invention is not limited to this. A non-contact bearing such as an air bearing may be provided. In this case, in addition to obtaining the same action and effect as using the rollers, the stators 17 and 37 move without halving the friction, so the reaction frame 8 and the base plate 1 Disturbance due to friction, such as zero vibration, can be eliminated, and more accurate exposure processing can be performed. The roller air bearing may be provided on the stator, or may be provided on the reaction frame 8 or the base plate 10 supporting the stator. Although not shown, the reticle stage 2 may have a mechanism capable of supporting a plurality of reticles R as in the third embodiment. In this case, the reticle stage 2 may be provided with a common coarse movement stage and a plurality of fine movement stages holding the reticle R may be provided independently. Thus, the entire stage 2 can be made compact.

Further, in the above embodiment, the stators 17 and 37 are configured to move by the reaction force in both the reticle stage 2 and the wafer stage 5, but the stator is configured to move in only one of the stages. It goes without saying that the reaction force may be moved. Further, in the above-described embodiment, all of the vibration isolating units are configured to actively perform vibration isolation. All of these, any one of them, or any plural of them passively perform vibration isolation. Such a configuration may be adopted. In addition, the reticle stage 2 has a two-stage configuration of a coarse movement stage and a fine movement stage, and one or both of them is provided with a member (for example, a stator) that moves by a reaction force accompanying the movement of the stage. There may be. In the above embodiment, the stage apparatus of the present invention is configured to be applied to the exposure apparatus 1. However, the present invention is not limited to this, and other than the exposure apparatus 1, a transfer mask drawing apparatus, a mask The present invention is also applicable to precision measuring devices such as a pattern position coordinate measuring device.

The substrate of the present embodiment includes not only a semiconductor wafer W for a semiconductor device, but also a glass substrate for a liquid crystal display device, a ceramic wafer for a thin-film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) etc. are applied. The exposure apparatus 1 includes a step of scanning and exposing a pattern of the reticle R by synchronously moving the reticle R and the wafers W and PW. • An AND scan type scanning exposure apparatus (scanning stepper; USP5, 473, 4i0) In addition, a step-and-repeat type projection exposure apparatus (stepper) that exposes the pattern of the reticle R while the reticle R and the wafer W are stationary and sequentially moves the wafer W and the PW step by step. Can be applied. The type of the exposure apparatus 1 is not limited to an exposure apparatus for manufacturing a semiconductor device that exposes a semiconductor device pattern onto a wafer W, but may be an exposure apparatus for manufacturing a liquid crystal display element, a thin-film magnetic head, an image sensor (CCD), or the like. It can be widely applied to exposure equipment for manufacturing reticles and the like.

In addition, the emission lines (g-line (436 nm), h-line (404.7 nm), i-line (365 nm) :), KrF excimer laser ( 248 nm), a r F excimer one the (193 nm), not only the F ₂ laser (157 nm) only, Ru can be uses charged particle beams such as X-ray or electron beam. If it is cool, thermionic emission type lanthanum hexaborite (LaB, tantalum (Ta)) can be used as an electron gun when using an electron beam, and a reticle R is used when using an electron beam. A configuration may be used, or a pattern may be directly formed on the wafer without using reticle R. A high frequency such as a YAG laser or a semiconductor laser may be used.

The magnification of the projection optical system PL is not limited to the reduction system, but can be either the same magnification system or the magnification system. Good. In addition, as the projection optical system PL, when a far ultraviolet ray such as an excimer laser is used, a material that transmits the far ultraviolet ray such as quartz or fluorite is used as a glass material, and when a F2 laser or X-ray is used, a catadioptric system is used. Alternatively, a refraction-type optical system may be used (the reticle R may be of a reflection type). When an electron beam is used, an electron optical system including an electron lens and a deflector may be used as the optical system. It goes without saying that the optical path through which the electron beam passes is in a vacuum state. Also, the present invention can be applied to an aperture exposure apparatus that exposes a reticle R pattern by bringing a reticle R and a wafer W into close contact with each other without using a projection optical system PL.

If a linear stage (see USP5,623,853 or USP5,528,118) is used for the wafer stage 5 ゃ reticle stage 2, an air levitation type using an air bearing and a magnetic levitation type using a lone or reactance force Either one may be used. Each of the stages 2 and 5 may be of a type that moves along a guide or a guideless type that does not have a guide. The drive mechanism for each of the stages 2 and 5 is such that a magnet unit (permanent magnet) having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil are opposed to each other, and each stage 2 and 5 is driven by electromagnetic force. A driven flat motor may be used. In this case, one of the magnet unit and the armature unit may be connected to the stages 2 and 5, and the other of the magnet unit and the armature unit may be provided on the moving surface side (base) of the stages 2 and 5. .

As described above, the exposure apparatus 1 according to the embodiment of the present invention controls various subsystems including the respective components listed in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. Before and after this assembly, adjustments to achieve optical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, and various electrical systems before and after assembly Are adjusted to achieve electrical accuracy. The process of assembling the exposure apparatus from various subsystems includes mechanical connection, wiring connection of electric circuits, and piping connection of pneumatic circuits among the various subsystems. It goes without saying that there is an assembly process for each subsystem before the assembly process from these various subsystems to the exposure device. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustments are made to ensure various precisions of the entire exposure apparatus. Exposure equipment It is desirable to manufacture the equipment in a clean room where temperature and cleanliness are controlled.

As shown in Fig. 8, a semiconductor device has a step 201 for designing the function and performance of the device, a step 202 for fabricating a mask (reticle) based on the design step, and a wafer made of silicon material. Manufacturing step 203, wafer processing step 204 for exposing a reticle pattern to a wafer by exposure apparatus 1 of the above-described embodiment, device assembling step (including dicing step, bonding step, package step) 2 0 5, inspection step 206, etc. Industrial applicability

The present invention relates to a substrate on which a mask pattern is exposed, such as a glass substrate or a wafer, a stage device in which a stage body holding the substrate moves in a plane on a surface plate, a driving method thereof, and a stage device. Exposure processing using the held mask and substrate: (1) Exposure apparatus and exposure method, particularly when manufacturing devices such as semiconductor integrated circuits and liquid crystal displays, suitable substrates for use in the lithographic process. TECHNICAL FIELD The present invention relates to a stage device, a stage driving method, an exposure device, and an exposure method.

According to the stage device and the stage driving method of the present invention, the support unit is provided independently and vibratingly with respect to the surface plate, and the reaction force stage moves on the support unit by the reaction force accompanying the driving of the stage body. Because of this, problems such as swing back can be avoided, the settling time can be shortened, the throughput can be improved, and the residual vibration of the support can be suppressed from being transmitted to the surface plate. Position controllability can be maintained. Further, since the surface plate is supported by the support portion via the vibration isolating mechanism, it is possible to suppress the transmission of the residual vibration of the support portion to the surface plate, and to maintain the position controllability of the stage body. Furthermore, since the reaction stage forms at least a part of the driving mechanism for driving the stage body in the negative direction, there is no need to provide a separate mechanism for eliminating the reaction force, and the device can be made smaller and less expensive. Pricing is realized. A rolling element that rotates around the axis and moves the reaction force stage relative to the support portion is interposed between the reaction force stage and the support portion, so that when the reaction force stage moves, The rolling element rotates around the axis in a simple operation, which simplifies the equipment. In addition, since the non-contact bearing is interposed between the reaction stage and the support, the reaction stage moves without friction, so that disturbance due to friction such as vibration of the support can be eliminated. . Further, by using a return device such as an urging unit for urging the reaction force stages in directions opposite to each other, it is possible to easily return the reaction force stage to the initial position with a simple mechanism. In addition, the stage body is movable in a direction substantially perpendicular to the direction in which it moves, and the reaction force stage is provided in each direction substantially perpendicular to the stage. Since it is possible to avoid problems such as swaying due to the accompanying reaction force, the settling time becomes shorter, and the throughput can be further improved.

According to the exposure apparatus and the exposure method of the present invention, the stage apparatus according to any one of claims 1 to 9 is used as at least one of a mask stage and a substrate stage. In addition, since the stage driving method described in any one of claims 17 to 20 is used, the settling time is shortened, and throughput and exposure accuracy can be improved. In addition, the residual vibration of the support part can be suppressed from being transmitted to the surface plate, and the position controllability of the stage body can be maintained.The mask stage, substrate stage, and projection optical system are arranged so as to be vibrationally independent of each other. As a result, it is possible to prevent the vibration caused by the drive of the stage from being transmitted to the projection optical system, so that the displacement of the pattern transfer position due to the vibration of the projection optical system and the occurrence of image blur etc. can be prevented. Exposure can be improved by effectively preventing exposure. Furthermore, since the mask stage holds a plurality of masks and the substrate stage holds a plurality of substrates, the exchange, alignment, and exposure operations can be performed in parallel, so that the throughput can be significantly improved. In addition, if the stator is shared by a plurality of movers, it is possible to reduce the number of parts, that is, to simplify the device and reduce the cost. On the other hand, according to the substrate of the present invention, since the pattern is exposed using the above-described exposure method, the pattern overlap, the line width, and the like are maintained with high accuracy, and the predetermined device characteristics are exhibited. It becomes possible to do.

Claims

The scope of the claims

1. A stage device having a stage body driven in at least one direction on a surface plate,

A support portion that is arranged independently vibrationally with respect to the surface plate,

A stage device, comprising: a reaction force stage which is movable in the one direction on the support portion by a reaction force accompanying the driving of the stage body.

2. The stage device according to claim 1, wherein the surface plate is supported by the support portion via a vibration isolation mechanism.

3. The stage device according to claim 1, wherein the reaction force stage forms at least a part of a driving mechanism that drives the stage body in the one direction.

4. The drive mechanism includes: a mover provided on the stage main body; and a stator that drives the mover in the one direction by electromagnetic interaction between the mover and the mover. The stage device according to claim 3, wherein the force stage has the stator.

5. A rolling element that rotates around an axis to move the reaction stage in the one direction with respect to the support portion is interposed between the reaction stage and the support portion. 2. The stage device according to claim 1, wherein:

6. The stage device according to claim 1, wherein a non-contact bearing is interposed between the reaction force stage and the support portion.

7. The stage device according to claim 1, further comprising a return device that returns the reaction force stage to an initial position.

8. The stage device according to claim 7, wherein the return device includes an urging portion for urging the reaction force stage in directions opposite to each other along the one direction. .

9. The stage according to claim 1, wherein the stage main body is movable in directions substantially orthogonal to each other, and the reaction force stage is provided in each of the orthogonal directions. Stage equipment.

10. In an exposure apparatus for exposing a substrate pattern held on a substrate stage by a mask pattern held on a mask stage,

10. An exposure apparatus, wherein the stage apparatus according to any one of claims 1 to 9 is used as at least one of the self-mask stage and the substrate stage.

11. The exposure according to claim 10, further comprising a projection optical system disposed between said mask stage and said substrate stage, said projection optical system projecting said mask pattern onto said substrate. apparatus.

12. The exposure according to claim 11, wherein the mask stage, the substrate stage, and the projection optical system are vibrationally independent of each other.

13. The mask stage has a fine movement stage that holds the mask and can move in a first direction, and a coarse movement stage that is connected to the fine movement stage and that can move in a second direction different from the first direction. The exposure apparatus according to claim 10, wherein the exposure apparatus is configured to:

14. At least one of the mask stage and the substrate stage is a guide The exposure apparatus _{c according} to claim 10, wherein the exposure apparatus _c is a dress stage.

15. The exposure apparatus according to claim 10, wherein the mask stage is capable of holding a plurality of masks.

16. The exposure apparatus according to claim 10, wherein the substrate stage is capable of holding a plurality of substrates.

17. A stage driving method including a first stage driven in at least one direction on a surface plate,

A stage driving method comprising: supporting a second stage that is movable in one direction by a reaction force accompanying the driving of the first stage on a support that is vibrationally independent of the surface plate. .

18. The stage driving method according to claim 17, wherein the second stage moves in a direction opposite to the first stage.

19. The stage driving method according to claim 17, further comprising a step of returning the second stage to an initial position.

20. The stage driving method according to claim 17, wherein the weight of the second stage is heavier than the weight of the first stage.

21. In an exposure method for exposing a pattern of a mask held on a mask stage to a substrate held on a substrate stage,

The stage driving method according to any one of claims 17 to 20 is used as a driving method of at least one of the mask stage and the substrate stage. Exposure method.

22. The exposure method according to claim 21, further comprising a step of exposing said pattern during movement of said mask stage and said substrate stage.

23. The exposure method according to claim 21, further comprising a step of holding a plurality of masks on the mask stage.

24. The exposure method according to claim 21, further comprising a step of holding a plurality of substrates on the substrate stage.

25. A substrate whose pattern is exposed using the exposure method according to claim 21.