WO2001027978A1 - Substrate, stage device, method of driving stage, exposure system and exposure method - Google Patents

Substrate, stage device, method of driving stage, exposure system and exposure method Download PDF

Info

Publication number
WO2001027978A1
WO2001027978A1 PCT/JP1999/005539 JP9905539W WO0127978A1 WO 2001027978 A1 WO2001027978 A1 WO 2001027978A1 JP 9905539 W JP9905539 W JP 9905539W WO 0127978 A1 WO0127978 A1 WO 0127978A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
stage
direction
exposure
substrate
mask
Prior art date
Application number
PCT/JP1999/005539
Other languages
French (fr)
Japanese (ja)
Inventor
Masato Takahashi
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70766Reaction force control means, e.g. countermass
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709Vibration, e.g. vibration detection, compensation, suppression

Abstract

A stage device (4) comprises a support (8) isolated from a surface plate (3) in terms of vibration, and a reaction stage (17) that is allowed to move on the support (8) in one direction by the reaction force exerted when the stage body (2) is driven. Since yawing due to the reaction is eliminated, the setting time decreases and thus throughput improves. In addition, residual vibration is prevented from propagating from the support to the surface plate.

Description

Specification

Substrate stage device, a stage drive method and an exposure apparatus and exposure method art

The present invention is a glass substrate or a wafer or the like, and the substrate onto which the pattern of the mask is exposed, the stage device and a driving method of the stage main body moves platen in a plane holding the substrate of this, and in this stage device relates exposure apparatus and an exposure method for performing exposure processing by using the mask and the substrate which is held, particularly when manufacturing a device such as a semiconductor integrated circuit and a liquid crystal Display I, suitable substrate using at about lithographic Ye, stays di apparatus, and a stage driving method and an exposure apparatus and an exposure method. BACKGROUND

Conventionally, in which is one lithography step of a manufacturing process of a semiconductor device, a mask or a reticle circuit pattern formed on (hereinafter, referred to as a reticle) resist (photosensitive agent) wafer or glass plate coated various exposure apparatus for transferring onto a substrate is used. For example, as the exposure apparatus for the semiconductor device, in accordance with the miniaturization of the minimum line width of a pattern due to the higher integration of integrated circuits (device rule) in recent years, the pattern of the reticle by using the projection optical system wafer reduction projection exposure apparatus for reducing transfer above is mainly used.

As the reduction projection exposure apparatus, Ya static exposure light type reduction projection exposure apparatus of step 'and repeat system for sequentially transferring the pattern of a reticle onto a plurality of shots area on the wafer (exposure region) (the so-called Sutetsupa) , an improvement of this Sutetsupa, each shot area on the wafer to a reticle pattern the reticle and the wafer as disclosed in JP-a-8 1 6 6 0 4 3 No. etc. by synchronously moving the one-dimensional direction scanning exposure type exposure apparatus of the step 'and' scan method to transfer (the so-called Sukiya training 'Sutetsupa) are known.

In these reduction projection exposure apparatus, as a stage device, is installed base plate serves as a reference of the first device on the floor, the reticle stage via a vibration isolation platform for blocking floor vibration thereon, the wafer stage and the projection those main body column supporting the like optical system (projection lens) is placed is often used. In recent stage device, as the vibration isolation, internal pressure controllable air mount includes a Akuchiyue Isseki of the voice coil motor Isseki, mounted et been in the main body column (main frame), for example, six by control the like wherein voice coil Isseki based on the measurement values ​​of the accelerometer that has active vibration isolation is employed to control the vibration of the main body column.

However, in such the above Sutetsupa, after exposure to shot area on the wafer, since it is intended to repeat the sequential exposure to other shot areas (for Sutedzupa) Wehasu stage or reticle stage and the wafer stage acceleration (in the case of scanning 'Sutedzupa), the reaction force caused by the reduction movement becomes a vibration source of the main body column, there is a disadvantage that Ru cause relative positional error between the projection optical system and the wafer or the like. The relative position error during Araimento time Ya exposure, resulting in increase in image blur (pattern line width in the case of containing or being transferred pattern design values ​​and different positions on the wafer, a vibration component in its position erroneous difference ) there has been a disadvantage that the cause of or invited. Therefore, in order to suppress a disadvantage of, it is necessary to sufficiently attenuate the vibration of the main body column by an active vibration isolation table, etc. described above. For example if in the case of Sutetsuba needs to wafer stage begins Araimento operation and exposure operation waiting to be fully settling is positioned at a desired position. In the case of scanning Sutetsupa, it is necessary to perform exposure to the KiSeiJo between the reticle stage and the wafer stage while ensuring sufficient. For this reason, it has been a factor exacerbating the throughput (productivity).

Therefore, as to improve such an inconvenience, for example, as described in JP-A-8 1 6 6 4 7 5 No. Publication mechanically using a frame member reaction force generated by the movement of the wafer stage floor invention and released to the (ground), for example as described in JP-a 8-3 3 0 2 2 4 No. etc., the reaction force that occur by the movement of the reticle stage using a frame member mechanically invention released to the floor (ground) is known. However, the conventional stage apparatus and exposure apparatus as described above, there are the following problems.

As the size of the reticle and the wafer in recent years, both stages becomes large, the above-mentioned Japanese 閧平 8-1 6 6 4 7 5 and JP 閧平 8-3 3 0 2 2 4 No. issued described in even using bright, the reaction force that caused by the frame member itself to the reaction force escaping transmitted the frame member on the floor side ran away or, on the floor vibration holds the projection optical system via a vibration isolation transmitted to the body column (main body) to vibrate the this, there is a concern that so-called swing-back is arising. Therefore, perform high-precision exposure while certain degree throughput: or has become difficult.

Therefore, for example, in JP-A-8-6 3 2 3 1 discloses, a stage body and a drive frame which is levitated supported on a base provided, dynamic Hun one arm drive by the reaction force caused by the forward movement of the stage body backward It discloses a technique. According to this technique, work is the law of conservation of momentum between the stage main body and the drive frame, the position of the center of gravity of the device on the base is maintained, Ru it is possible to reduce the influence of vibration to the frame member . However, even if you adopt this technology, stage or large in size, could not or when you speed up to completely remove the influence of the reaction force.

The present invention has been made in view of the above, even if a large stage also is properly using a high-speed stage, stage apparatus which can maintain the position control of the stage, the stage drive method, and an exposure and to provide an apparatus and exposure method. Another object of the present invention, even when a large stage or high-speed stage, the throughput exposure apparatus capable of performing a certain exposure with high precision while ensuring to provide a exposure method. Furthermore, another object of the present invention is to provide a substrate on which a pattern is exposed with high accuracy. Disclosure of the Invention

The present invention in order to achieve the object of adopts the following constructions poppy pair 応付 in FIGS. 1 to 7 show an embodiment.

Stage device of the present invention is a surface plate (3, 6) a stage apparatus provided with at least a stage body that is driven in one direction (2, 5) to the top (4, 7), plate (3, 6 support portions that are independently arranged vibrationally relative) (8, 1 0) and stage main body (2, 5 support portion by the reaction force accompanying the drive of) (8, 1 0) the upper one it is characterized in further comprising a movement in a direction self standing reaction force stage (1 7, 3 7). The stage drive method of the present invention, the surface plate (3, 6) at least one direction driven Ru first stage (2, 5) stage drive method having a upper, first stage

(2.5) vibrationally separate support part (8, 10 second stage (17 by the reaction force accompanying the drive which is movable in the one direction, 37〗 against surface plate (3, 6) of) and is characterized in two and to be supported. Therefore, in the stage device and stearyl one di driving method of the present invention, the stage body is a first stage (2, 5) is plate (3, 6) on the when driven in one direction, the stage main body (2, 5) reaction forces stage is the second stage Ri by the reaction force accompanying the drive (17, 37) the stage main body (2, 5) and reverse since moving the stage main body (2, 5) and the reaction force stage (17, 37) the law of conservation of momentum between the works. reaction force stage (17, 37), the plate (3, 6) vibrationally separate support section for (8, 10) for moving the upper support portion

Vibration of (8, 10) can be prevented not transmitted to the surface plate (3, 6), affecting the position control of the stage main body (2, 5).

The exposure apparatus of the present invention, an exposure apparatus for exposing a pattern of a mask held by a mask stage (2) (R) on a substrate (W) held by the substrate stage (5)

In (1), at least as hand stage of the mask stage and (2) a substrate stage (5), a stage device according to any one of paragraph 9 from claim 1, wherein (4, 7 ) it is characterized in that is used. The exposure method of the present onset Ming, an exposure method for exposing a pattern of a mask held by a mask stage (2) (R) on a substrate (W) held by the substrate stage (5), mask stage ( 2) it shall be characterized in that the stage drive method described from the scope 17 the preceding claims as a drive how at least one of the stages in any one of paragraph 20 of the substrate stage (5) is used it is. Accordingly, in the exposure apparatus and the exposure method of the present invention, the stage main body for holding a mask (R) or the substrate (W)

(2, 5) with the settling time is improved throughput shortened in, since the stage the body (2, 5) to suppress the influence of vibration applied to the positional controllability can be maintained, for light exposure for high precision be able to. In addition, the mask stage (2), the substrate stage

(5) and the projection optical system (PL) by causing vibration independent from each other, Masques stage (2) and the substrate stage (5) Vibration projection optical system due to the driving of the (PL) for can be prevented from being transmitted , imaging characteristics of the pattern of the mask (R) can be improved. Then, the substrate exposed by these exposure method (W), the pattern of the mask (R) is transferred with high accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

Figure 1 is a diagram showing a first embodiment of the present invention, the reticle stage is a schematic configuration diagram of an exposure apparatus in which the wafer stage and the projection optical system is arranged independently with respect to vibration.

Figure 2 is an external perspective view of the stage device having the same reticle stage. Figure 3 is a diagram showing a first embodiment of the present invention, is a side view of a stator spring on both sides are connected.

: 114 is a partial enlarged view of the stage device having the wafer stage.

Figure 5 is an enlarged view of Riniamo evening main unit for driving the wafer stage. Figure 6 is a diagram showing a second embodiment of the present invention, the reticle stage is a schematic configuration diagram of an exposure apparatus in which the wafer stage and the projection optical system is arranged independently with respect to vibration.

Figure 7 is a appearance perspective view showing another embodiment of a stage device having the same wafer stage.

Figure 8 is a flowchart showing an example of a manufacturing process of a semiconductor device. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the substrate of the present invention, a stage device, an embodiment of a stage driving method and an exposure apparatus and exposure method will be described with reference to FIGS. Here, though if the exposure apparatus, while synchronously moving the reticle and the wafer, by using an example in which a circuit pattern of a semiconductor device formed on a reticle is transferred onto a wafer, using a scanning Sutetsu Pas Description to. Further, in the exposure apparatus, also of that to apply the stage device of this onset light to both the reticle stage and the wafer stage.

First Embodiment First, referring to FIG. 1 to FIG. 5, a description will be given of a first embodiment. Shown to the exposure apparatus in FIG. 1 1, the light source illumination optical system IU for illuminating an illumination area with a uniform illuminance of the reticle by the exposure illumination light (not shown) emitted from a (mask) R on the rectangular (or arcuate) the reticle stage (Step one di body, the first stage) as a mask stage for holding the reticle R 2 and stage 4 which includes a reticle surface plate (platen) 3 which supports the reticle stage 2, and is emitted from the reticle R projection optical system PL that the illumination light is projected onto the wafer (substrate) W, a wafer stage (stage body, the first stage) of the substrate stage for holding a wafer W 5 and the wafer platen for holding the wafer stage 5 ( stage apparatus 7 includes a base plate) 6, is schematically composed of reaction frame (support portion) 8 which supports the stage device 4 and the projection optical system PL. Here, the optical axis of the projection optical system PL is a Z direction, the synchronous movement direction of the reticle R and the wafer W in the direction perpendicular to the Z-direction and Y-direction, the asynchronous movement direction and X direction. It also the direction of rotation theta Zeta around its axis, 6> Upsilon, and 6> chi.

The illumination optical system IU is supported by a support column 9 fixed to the upper surface of the reaction frame 8. As the illumination light for exposure, for example, ultra-high pressure mercury lamp or we injected the ultraviolet region of the emission line (g-line, i-line) and K r F excimer one laser light (wavelength

2 4 8 nm) far ultraviolet light (DUV light beam) such as and, A r F excimer laser beam (wavelength 1 9

3 nm) and F 2 laser beam (wavelength: 1 5 7 nm) vacuum ultraviolet light such as (VUV) and the like. Reaction frame 8 is mounted on Besupure one sheet 1 0, which is horizontally placed on a floor, on its upper side and lower side, it is stepped portions 8 a and 8 b that protrudes toward the inside It is that it formed.

Among the stage device 4, the reticle surface plate 3 is substantially horizontally supported via a vibration isolating unit (anti-vibration mechanism) 1 1 in the stepped portion 8 a of the reaction frame 8 at each corner one (Note , not shown for image-stabilizing unit of the depth of the page surface), the opening 3 a is formed of a pattern image formed on the reticle R passes through the center thereof. Vibration isolating Yuni' sheet 1 1 is configured such that the internal pressure is placed in series with the possible air mount 1 2 and a voice coil motor evening 1 3 Togadan portion on 8 a adjustment. These anti-vibration Yunitto 1 1, the fine vibration transmitted to Rechiku Le platen 3 through the base plate 1 0 and the reaction frame 8 is adapted to be insulated by a micro G level. On the reticle surface plate 3, the reticle stage 2 is supported movably along the reticle surface plate 3 two-dimensional manner. The bottom surface of the reticle stage 2, the contactless plurality of air bearings (air pads) 1 4 is fixed a bare ring, these Eabe Aringu 1 4 by Sumi reticle stage 2 on the reticle surface plate 3 It has been supported by levitation through about Klong of clearance. The central portion of the reticle stage 2, through the opening 3 a and the communicating of the reticle surface plate 3, the opening 2 a of the pattern image of the reticle R passes is formed. Further, the reticle stage 2, two sets of Riniamo evening (driving mechanism) 1 5 has an upper reticle surface plate 3 to be driven at a predetermined stroke range in the Y Direction is the scanning direction by. Incidentally, Rechikurusute one di 2, the reticle fine movement stage (not shown) for fine drives the reticle R adsorbed and held in the non-scanning direction (X direction) and 6> Z-direction, is connected to the fine stage X, the Y-direction and a movable coarse movement stage, but here these one stearyl - illustrated as di. Accordingly, the reticle stage 2, while being linearly driven in a long stroke in the Y direction, to One Do to fine driving is configurable in the X direction and the direction Ru

As shown in FIG. 2, the end portion of one Y-direction of the reticle stage 2, a pair of Y movable mirror 1 8 a, 1 8 b is fixed consisting of a corner cube, also of the reticle stage 2 + X direction At the end, X movable mirror 1 9 consisting of a plane mirror one extending in the Y direction is fixed. By these movement mirror 1 8 a, 1 8 b, 1 the three laser interferometers for irradiating a measurement beam to 9 (all not shown) measures the distance to each mobile mirrors, a reticle stage 2 of X, Y, (Ζ rotation about the axis) direction of the position is measured with high precision.

As shown in FIG. 1, the Ζ direction substantially central position in the X-direction side surfaces of the reticle stage 2, Irutsu and mover 1 6 extending built-in coil Υ direction it it integrally provided, these it it opposite to the reaction force stage mover 1 6 (second stearyl - di) U-shaped cross section of the pair of the stator 1 7 as are arranged. The stator 1 7 is composed of a number of permanent magnets to generate an alternating magnetic field which is arranged at a predetermined distance along the extending direction of the stator yoke and the stator yoke. That is, Riniamo evening 1 5 of beam one Bing coil is constituted by the mover 1 6 and the stator 1 I, the mover 1 6 Υ direction (one direction by electromagnetic interaction with the stator 1 7 It is adapted to be driving dynamic to). The weight ratio of the reticle stage 2 side including the mover 1 6 etc. and the stator 1 7 side is approximately 1: c that is set to 4

As shown in FIG. 2, between the upper surface of each stator 1 I and reaction frame 8, the guide 2 0 rolling is it that interposed. Rolling guides 2 0 is adapted to the configuration in which a plurality of rollers (rolling elements) 2 1 axis rotates the respective axes around extending in the X Direction are arranged at regular intervals in the Y direction, the stator 1 7 is in a movable relative re action frame 8 in the Y direction by the rotation of the roller 2 1. Further, as shown in Figure 3, the Y-direction on both sides of the stator 1 7, a pair of springs which constitute a return device for returning the stator 1 7 to the initial position (biasing portion) 2 2, 2 2 one end is it that the connection T1 of. These springs 2 2 has the other end being fixed to the reaction frame 8, stator 1 7 in mutually opposite directions along the Y-direction, substantially the same force Desolation to it energizing (pulling for example) those it is. Each spring 2 2, sufficient amount of deflection is set so that even when the stator 1 7 has moved deforms elastic range. Incidentally, the reticle stage 2, as is clear from FIG. 1, 2, X, and has a guide dress stage without a guide member for guiding the movement of the reticle stage 2 to move in the Y direction.

Returning to Figure 1, as the projection optical system PL, where both the object plane (reticle R) side and the image plane (wafer W) side has a circular projection field telecentric and the quartz and fluorite and optical glass material refractive optical element (lens element) becomes 1/4 (or 1 Bruno 5) dioptric system of the reduction ratio is used. Therefore, when illumination light is irradiated on the reticle R, of the circuit pattern on the reticle R, imaging light beam from the illuminated portion with the illumination light is incident on the projection optical system PL, the inverted portion of the circuit pattern image is imaged it is limited to a slit shape in the middle of a circular field of view of the image plane side of the projection optical system PL. More This part inverted image of the projected circuit pattern, among the plurality of shot areas on the wafer W disposed on the imaging plane of projection optical system PL, reduced transfer to the registration list layer of one shot area surface It is.

Figure 4 is lower than the projection optical system PL of the exposure apparatus 1 is shown enlarged. As shown in FIG. This, on the outer periphery of the barrel portion of the projection optical system PL, a flange 2 3 is provided integral with the lens barrel portion. Then, the projection optical system PL, the lens barrel base plate 2 5 constituted by 錶物 or the like which is substantially horizontally supported via the stepped portion 8 b antivibration Yunitto 2 4 of the reaction frame 8, the optical axis direction to together when inserted from above as a Z direction, the flange 2 3 is engaged. The flange 2 3 materials, low thermal expansion of Material, 'Kiyoshie if Inba (I nver;. Ni 3 6%, manganese 0 2 5%, the low of iron containing carbon and other elements and trace expansion of the alloy) is used. Flanges 2 3 This is to through the point and the surface and V-grooves projection optical system PL with respect to the barrel surface plate 2 5 supported at three points, constitute a so-called kinematic support mounts. Employing kinematic support structure such as this, is easily assembled with respect to the lens barrel surface plate 2 5 of the projection optical system PL, yet vibration of the lens barrel base 2 5 and the projection optical system PL after assembly, temperature change there is an advantage that most effectively can be reduced due to stress to:

Antivibration Yuni' DOO 2 4 is arranged in each corner of the lens barrel base 2 5 (Note that is not shown antivibration Yuni' bets verso side), the internal pressure is adjustable air mount 2 6 and ball Isukoirumo It has become arranged in series in Isseki 2 7 Togadan portion on 8 b. By these anti-vibration Yunitto 2 4, fine vibrations transmitted to the lens barrel base 2 5 through the base plate 1 0 and the reaction frame 8 (and thus the projection optical system PL) is adapted to be insulated by the microphone port G level ing.

Stage apparatus 7 is constructed wafer stage 5 for holding a wafer is W, the wafer base plate 6 for movably supporting the Wehasute di 5 in a two-dimensional direction along the XY plane mainly. As shown in FIG. 4, on the bottom surface of the wafer stage 5, the non-contact bearings plurality of air bearings (air pads) 2 8 is fixed is, these wafer stage 5 is a wafer constant by an air bearing 2 8 on board 6, for example, it is supported by levitation via a clearance of several microns.

Wafer base plate 6 is above the base plate (supporting portion) 1 0, is supported substantially horizontally through the vibration isolating unit (vibration isolation mechanism) 2 9. Anti-vibration unit 2 9 is arranged in each corner of the wafer base plate 6 (Note that is not shown rear side of the plane of vibration isolation Yuni' Bok), air mount pressure is adjustable 3 0 and the voice coil motor 3 It has become arranged configured in parallel on 1 Togabe one Subunoto 1 0. These anti-vibration Yunitto 2 9, micro vibrations transmitted to the wafer base plate 6 via the base one scan plate 1 0 is adapted to be insulated by the microphone port G Nberu.

Wafer stage 5, the wafer stage 5 and the pair of Riniamo Isseki 3 2 for driving in the X direction (not Riniamo evening the illustrated front side than the wafer stage 5), drives the wafer stage 5 in the Y-direction a pair of Riniamo evening have become movable in the (drive mechanism) 3 3 Therefore the upper wafer surface plate 6 in XY 2-dimensional direction. Riniamo Isseki 3 2 of the stator is extended along the X direction in the Y-direction outer sides of the wafer stage 5, are connected is between the ends together by a pair of connecting members 3 4,. Rectangular frame body 35 is formed. Riniamo evening 3 2 of the movable element is protruded so as to face the stator in the Y-direction both sides of the wafer stage 5.

Further, the lower end surface of the frame body 3 the coupling members 3 4 5 constituting or Riniamo Isseki 3 2: Also, the movable element 3 6, 3 6 consisting of the armature unit is provided each of these movable child 3 6, 3 the stator of the second stage having a magnet Yunitto corresponding to 6 (reaction force stage) 3 7, 3 7 is extended in the Y direction. This opens the interface shown in FIG. 5, between each stator 3 7 Tobe one scan plate 1 0, Guide 3 8 rolling is it that interposed. Guide 3 8 rolling is adapted to a plurality of rollers (rolling elements) configuring the 3 9 are arranged at regular intervals in the Y direction axis to rotate about respective axes extending in the X direction, the stator 3 7 Besupure as a support portion by the rotation of the roller 3 9 - have become movable in the Y direction with respect to the sheet 1 0.

Further, as shown in FIG. 3, as with the stator 1 7, in the Y direction on both sides of the stator 3 7, a pair of springs (biasing constituting a return device for returning the stator 3 7 to its initial position part) 4 0, 4 0 end is it it connected. These springs 4 0, the other end is fixed to the base plate 1 0, the stator 3 7 in opposite directions to each other was 沿Tsu in the Y direction, it is it biased (pulled for example) at approximately the same force also than is. Each spring 4 0, sufficient oar seen amount is set as the stator 3 7 is deformed by an elastic range even when moving.

And these movable element 3 6 and the stator 3 7 Li two § mode Isseki 3 3 of arm one Bing coil is constituted by, electromagnetic mutual between the movable element 3. 6 stator 3 7 It is driven in the Y direction (one direction) by the action. That is, the summer so that the frame body 35 integrally with the wafer stage 5 is driven in the Υ direction by the Riniamo evening 3 3. As it is apparent from FIG. 4, the wafer stage 5, the movement of the Υ direction and has a guide dress stage without a guide member. Incidentally, it is possible to appropriately guide dress stage regard the movement in the X direction of the wafer stage 5.

On the upper surface of the wafer stage 5, the wafer W is fixed by vacuum suction or the like via a wafer holder 4 1. The position of the X direction of the wafer stage 5, as the reference mirror 4 2 reference that is fixed to the lens barrel lower end of the projection optical system PL, and the positional change of the moving mirror 4 3 fixed to a portion of the wafer stage 5 laser interferometer 4 4 is a position measuring device for measuring: predetermined resolution I child stranded, is measured in real time, for example 0 5 resolution of about 1 nm.. Incidentally, the reference mirror 4 2, the movable mirror 4 3, the laser interferometer 4 4 and an unillustrated reference mirror arranged in substantially straight intersect each movable mirror, the position in the Y direction of the wafer stage 5 by a laser interferometer It is measured. Incidentally, in these laser interferometers, least one is a multi-axis interferometer having length measuring axis two or more axes, XY wafer stage 5 based on the measurement values ​​of these laser interferometers (hence the wafer W) not only the position but, 9 the rotation amount or in addition to these, so that it is possible to obtain also a leveling amount.

Further, the reticle surface plate 3, the wafer base plate 6, the lens barrel base plate 2 5, three vibration sensors for measuring the vibration in the Z Direction of each platen (e.g. accelerometers; not shown) and, XY plane three vibration sensors (e.g., accelerometers; not shown) for measuring the vibration of the inner direction thereof and are mounted is it it. Two of the latter vibration sensor measures the vibration in the Y direction of the surface plate, the remaining vibration sensor is to measure the vibration in the X direction (hereinafter, for convenience the vibration sensor group these vibration sensors referred to as). The vibration of the reticle surface plate 3 based on the measurement values ​​of these vibration sensors, the wafer base plate 6, 6 degrees of freedom of the lens barrel base 2 5 (Χ, Υ, Ζ, 0 Χ, Θ Ύ Θ Ζ) it is possible to obtain it it.

Furthermore, as shown in FIG. 4, the flange 2 3 of the projection optical system PL, and the three laser interferometers 4 5 is a position detecting device in three different forces plants are fixed (however, they in FIG one of the laser interferometer are representatively shown in). Each record - the portion of the lens barrel base 2 5 facing to The interferometer 4 5, the opening 2 5 a are then it formed, from the laser interferometer 4 5 via these openings 2 5 a measurement beams in the Z direction is irradiated toward the wafer base plate 6. A position facing each measurement beams of the upper surface of the wafer base plate 6, the reflection surface is that it formed. Therefore, Z position of the three different points of the wafer base plate 6 by the three lasers interferometer 4 5 it is then measured relative to the flange 2 3 (where, in FIG. 4, © on the wafer stage 5 since the center of the shot area E wafer W is shown a state immediately below the optical axis of the projection optical system PL, measurement beam is in the state of being shielded by the wafer stage 5). Na us, to form a reflective surface on the upper surface of the wafer stage 5 may be provided an interferometer for measuring the Z-direction position of the three different points on the the reflective surface of the projection optical system PL or flange 2 3 as a reference.

Next two stage device 4 of the above configuration, 7 out firstly describes the operation Nitsu of the stage device 4.

When the reticle stage 2 is moved in the scanning direction by driving the Riniamo evening 1 5 (e.g. + Y Direction), rolling the stator 1 7 by the reaction force by the drive guide 2 0 Reverse on re action frame 8 by the direction (one relatively moved in the Y direction). At this time, in the Rolling interests de 2 0, since the roller 2 1 rotates, the stator 1 7 move smoothly

Here, when the friction between the three parties of the reticle stage 2 and the stator 1 I and the reticle surface plate 3 is zero, the law of conservation of momentum acts, cormorants accompanied the movement of the reticle stage 2 stator 1 7 moving amount determined by the weight ratio of the reticle stage 2 side (Y movable mirror 1 8 a, 1 8 b, X transfer Dokyo 1 9, the movable element 1 6, includes a reticle R, etc.) and the stator 1 7 side It is. Specifically, the weight ratio of the reticle stage 2 side and the stator 1 7 side is from about 1: since it is 4, for example 3 0 cm movement stator 1 7 in the + Y direction of the reticle stage 2 one Y direction 7. applicator 5 to cm moved.

Therefore, the reaction force at the time the scanning direction of the acceleration and deceleration of the reticle stage 2, the movement of the stator 1 7 ', is Koyori absorbed, position of the center of gravity in the stage device 4 is substantially a constant in the Y direction. Also, reaction frame 8 the stator 1 7 is supported, so supports the record chicle surface plate 3 via the vibration isolating Yunidzu sheet 1 1, oscillatory to these Riakusho down frame 8 and the reticle surface plate 3 become an independent state in. Therefore, even when the retinyl cycle stage 2 is driven, it is possible to reticle surface plate 3 by the reaction force is effectively suppressed that you vibration. Note that biasing at Rukoto move the stator 1 7 gar Y direction, collapsed balance of the urging force relative to the stator 1 7 urging portion 2 2 shown in FIG. 3, the stator 1 7 + Y direction a force that is increased. Therefore, the stator 1 7, the position where the urging force is balanced, i.e. the initial position to return quickly to the (initial position). Konaru.

Then, the vibration isolating unit 1 1, based on the measurement values ​​of the laser interferometer, a force to cancel the influence of variation of the center of gravity caused by the movement of the reticle stage 2 (counter force) is applied in a feed-forward, generating the force Eamau cement 1 2 and the voice coil motor evening 1 3 to are driven. Further, the Bruno chicle stage 2 '. SI stator 1 7 and may not friction is zero among three parties of the reticle surface plate 3, reasons such as the moving direction is slightly different between the reticle stage 2 and the stator 1 7 in, 6 even when the minute vibration of the optional direction has remained in the reticle surface plate 3, in order to remove the residual vibration based on the measurement value of the vibration sensors, air mount 1 2 and the voice coil Isseki 1 3 a feedback-control.

On the other hand, it produces the same operation as the stage device 4 even in the stage device 7.

When the wafer stage 5 is moved in the scanning direction (+ Y direction) by the driving of Riniamo evening 3 3, Besupure over sheet 1 0 over reverse direction by guide 3 8 rolling the stator 3 7 by the reaction force by the drive (- relatively moved in the Y direction). At this time, in the guide 3 8 rolling, since the roller 3 9 rotates, the stator 3 7 moves smoothly. When the friction between the three parties of the wafer stage 5 and the stator 3 7 and the wafer base plate 6 is zero, the law of conservation of momentum acts, moves the stator 3 7 caused by the movement of the wafer stage 5 momentum is determined by the weight ratio of the wafer stage 5 side and the stator 3 7 side. Therefore, the reaction force at the time the scanning direction of the acceleration and deceleration of the wafer stage 5 is absorbed by the movement of the stator 3 7, also c position of the center of gravity in the stage device 7 is substantially fixed in the Y direction, the stator 3 7 one scan plate 1 0 base is supported is, since supported via the vibration isolating Interview two Tsu DOO 2 9 wafer base plate 6, and these Besupure Ichito 1 0 and the wafer base plate 6 vibrating It becomes independent state. Therefore, even when the wafer stage 5 is driven, as possible out to effectively prevent the wafer base plate 6 is vibrated by the reaction force. Incidentally, the stator 3 7 - by moving in the Y direction, collapsed balance of the urging force for urging portion 4 0 of the stator 3 7 shown in FIG. 3, to urge the stator 3 7 + Y direction force is increased. Therefore, the stator 3 7, the position where the urging force is balanced, i.e. promptly returns to the initial position (initial position).

Their, in the anti-vibration unit 2 9, based on the measurement values, such as a laser interferometer 4 4, © Ehasuteji 5 counter evening one force to cancel the influence of variation of the center of gravity caused by the movement of given Fidofowa one de, Eamaun DOO 3 3 and the voice coil motor evening 3 1 is driven to generate this force. Also, or not a friction zero three-way between the wafer stage 5 and the stator 3 7 and the wafer base plate 6, for reasons such as the moving direction is slightly different between the wafer stage 5 and the stator 3 7, the wafer when the minute vibration directions of six degrees of freedom of the platen 6 has remained even to remove the residual vibration based on the measurement value of the vibration sensors, air mount 3 0 and a voice coil motor evening 3 1 Ficoll one to Dobakku control.

In the lens barrel base plate 2 5, the reticle stage 2, the stator 1 7, 3 7 moves by the reaction force by the moving of the wafer stage 5, even slight vibration occurs in the reaction frame 8, reaction frame antivibration Yunidzuto 2 4 are independent with respect to vibration is interposed between the 8. Moreover, even slight vibration to the lens barrel base 2 5 occurs ^, obtains the vibration directions of six degrees of freedom based on the measurement values ​​of the lens barrel base 2 5 two provided vibration sensors, air mount 2 6 and to cancel this micro-vibration by Fidobadzuku controls the voice coil motor evening 2 7, it is possible to maintain the lens barrel base 2 5 steady stable position. Therefore, it is possible to maintain the projection optical system PL which is supported by the barrel surface plate 2 5 in a stable ^ was located, the occurrence of deviation and image blurring of a pattern transfer elevational location caused by vibration of the projection optical system PL effectively prevent to thereby improving the exposure accuracy.

Next, described below exposure operation in the exposure apparatus 1 of the above configuration. Previously, it is assumed that various exposure conditions order to scanning exposure shot area on the wafer W with proper exposure amount (target exposure amount) is set. Then, both Rechikuruara Imento with Les chicle microscope and Ofakushisu-§ Lai Instruments sensor (not shown) or the like, preparatory operations of the base line measurement, etc. are performed, full Ain § Rye placement of the wafer W used then the § Lai placement sensor (EGA ; Enhansuto Gros one Val 'Araimento etc.) is completed, the arrangement coordinates of a plurality of shot areas on the wafer W is Ru determined Mera Tauiota.

In this way, the preparation operations for exposing the wafer W is completed, while monitoring the measurement values ​​of the laser interferometer 4 4 based on Araimen bets result, by controlling the Riniamo Isseki 3 2, 3 3 wafer the scan start position for the first shot Bok exposure of W to move Wehasu te temporary 5. Then, to start the scan in the Y direction of the reticle stage 2 and the wafer stage 5 through the Riniamo Isseki 1 5, 3 3, when both stages 2, 5 reaches the target scanning speed of Re it its, exposure pattern area GaTeru the reticle Ϊ illumination light. is bright, and scanning exposure begins.

During this scanning exposure, the moving speed of the Y direction of the reticle stage 2, Wehasute - a moving speed of the Y-direction of the di 5 corresponding to the projection magnification of the projection optical system PL (1/5-fold or 1/4 iota 咅) as will be maintained in the speed ratio, synchronously controls reticle stage 2 and the wafer stage 5 through the Riniamo evening 1 5, 3 3. Then, different areas in the pattern area of ​​reticle R are sequentially illuminated with illumination light, by illuminating the pair to the entire pattern area is complete, you complete the first scanning exposure of shot Bok on the wafer W. Thus, the pattern of reticle R is reduced and transferred onto the first shot area on the wafer W Te via the projection optical system PL.

In this way the movement, the scanning exposure of the first shot is completed, Riniamo evening 3 2, 3 3 is the wafer stage 5 through the X, is step-moved in the Y direction, the scanning start position for exposure of the second shot It is. During this step movement, the position of Wehasute over di 5 based on the measurement values ​​of the laser interferometer 4 4 for detecting the (position of the wafer W), measuring X of the wafer stage 5, Y, in the direction of the position in real time . Their to .. Based on this measurement result, that controls the position of the wafer stage 5 as X Upsilon positional displacement of Wehasute di 5 controls the Riniamo Isseki 3 2, 3 3 is in a predetermined state. As for the 6> Zeta direction of displacement of the wafer stage 5, so as to correct an error of the rotational displacement of the wafer W side based on the information of the displacement, the reticle stage 2 rotary control. Thereafter, as in the first shot region, it performs scanning exposure for the second shot area.

In this manner, the step movement of Me other scanning exposure and the next Shodzuto exposure Shodzuto area on the wafer W is repeatedly performed, the pattern of Nochikuru R is sequentially transferred to all the hands of the exposure target shot region on the wafer W that.

In the stage apparatus and exposure apparatus of this embodiment, the reticle stage 2, © E c stage 5 the stator 1 7 by the reaction force when driven, 3 7 opposite direction to its storage it to move momentum law works, these reaction forces reaction frame 8 and the base plate 1 0, further prevented from being transmitted to the floor, it is possible to avoid the problem of shaking-back or the like, or large-sized reticle R and the wafer W is, even if you fast moving, settling time can be improved short becomes throughput and exposure precision. Further, since the reaction frame 8 supports the reticle surface plate 3 via the vibration isolating unit 1 1, the base plate 1 0 supports the wafer base plate 6 Te via the anti-vibration Yunitto 2 9, reaction frame 8 and base one spray residual vibration of Bok 1 0 can be suppressed from being transmitted to the reticle surface plate 3 and the wafer base plate 6, it is possible to maintain the Tatsu置 control of each stage 2, 5.

Further, in the present embodiment, the stator 1 7, 3 7 it it forms part of Riniamo Isseki 1 5, 3 3 for driving the respective stages 2, 5 accompanied the drive of each stage 2, 5 to move cormorants reaction force, there is no need to separately provide a mechanism for eliminating this reaction force, it is possible to reduce the size and cost of the apparatus. And these stators 1 7, 3 7 when moving in the reaction force, since the roller 2 1, 3 9 is performed by a simple operation referred to rotate around the axis, which achieves simplification of the device.

Further, in this embodiment, the spring 2 2, 4 0 stator 1 7 in opposite directions to each other, 3 7 since the it it biased, moving the stator 1 7, 3 7 by the reaction force when the well, can be restored easily initial position by a simple mechanism.

Further, in the exposure apparatus of this embodiment, the reticle stage 2, since the wafer stage 5 and the projection optical system PL is independent oscillatory by anti-vibration unit 1 1, 2 9, 2 4, the reticle stage 2 and the upper vibration caused by the driving of the wafer stage 5 can be prevented from being transmitted to the projection optical system PL, effectively prevent to expose the occurrence of deviation and image blurring of the pattern transfer position due to vibration of the projection optical system PL it is also possible to improve the accuracy of.

Second Embodiment

Figure 6 is a diagram showing a second embodiment of the stage apparatus and exposure apparatus of the present invention. In this figure, the same reference numerals for components with the same elements of the first embodiment shown in FIGS. 1 to 5, description thereof will be omitted. The second embodiment and the first embodiment and is different from the, since the structure of the stage device 7 will be described which follows.

As shown in this figure, the stage device 7 is mainly composed of a support plate (reaction force stage) 4 6 supporting the wafer stage 5, the wafer base plate 6 and these from below. Then, the stator 3 7, the guide 3 8 rolling interposed between the support plate 4 6, are I the configuration that moves in the Y direction relative to the support plate 4 6. Further, the wafer base plate 6 by vibration isolating Yunitto 2 9 disposed between the support plate 4 6, and is configured independently vibrationally relative to the support plate 4 6. Thus, the support plate 4 6 plays a role as a support with respect to the reaction force movement of the stator 3 7.

Between the support plate 4 6 and the base plate 1 0, guide 4 8 rolling comprising a plurality of rollers (rolling elements) 4 7 is interposed. Roller 4 7 It was then rotated around the axis extending in the Y direction, are arranged at regular intervals in the X direction. And, the support plate 4 6 by rotation about the axis of the roller 4 7, and is movable in the X direction with respect to the base one scan plate 1 0. Other configurations are the same as those of the first embodiment.

In the stage device and the exposure device of the present embodiment, in addition to operations and effects of the first embodiment and the same as can be obtained, even when the wafer stage 5 is moved in the + X direction, the wafer the law of conservation of momentum moving ^ Te by the reaction force accompanying the movement of the stage 5 to support Bureto 4 6 gar X direction acts. Therefore, not only when the wafer stage 5 is moved for scanning exposure, even the wafer stage 5 when moving step for changing the shot area, shaking barbs like due to the reaction force caused by the step movement it is possible to avoid the problem, it is possible to further improve the settling time shorter becomes throughput and eXPOSURE accuracy. Also in this embodiment, the residual vibration of the base one spray sheet 1 0 and the support plate 4 6 can be suppressed from being transmitted to the wafer base plate 6, © E ', it is possible to maintain the position control of the stage 5 .

Third Embodiment

Figure 7 is a diagram showing a third embodiment of the stage apparatus and the exposure apparatus of the present invention. In this figure, the same reference numerals for components with the same elements of the first embodiment shown in FIGS. 1 to 5, description thereof will be omitted. The third embodiment and the above-described first embodiment and is different, since the configuration of the wafer stage 5, the following this will be described.

As shown in this figure, the Y-direction on both sides of the projection optical system PL, and with a predetermined interval Ofakushisu '§ Lai instrument sensor 4 9 a, 4 9 b is disposed, this § La Imentosensa 4 9 a , 4 9 b are two wafer stages 5, 5 along the direction in which line up is provided. Each wafer stage 5, the magnet unit composing the Riniamo evening mover arm one Bing coil type (with shown) are furnished. Then, © E c stage 5 has a movable on the wafer platen 6 independently along the linear § moth ί de 5 0 that extends in the X direction as a stator having armature Yunitto . At both ends of Riniagai de 5 0, the movable element 3 6 consisting armature Yuni' Bok are projected downward, Ozuru pair mover 3 6, 3 6 both of the two wafer stages 5, 5 fixed child 3 7 is extended in the Υ direction. Therefore, the wafer stage 5 as well as movement in the X direction along the Li Niagai de 5 0 has a structure to move it it independently for Υ along the stator 3 7. In FIG. 7, are omitted moving mirror installed on the wafer stage 5, the illustration of such reference member.

In the exposure apparatus of the above configuration, as shown in FIG. 7, while the wafer W on Wehasute over di 5 positioned -Υ side via the projection optical system PL is performed exposure operation, + Y side Araimen Bok is performed on the wafer W on the wafer stage 5 is located. Specifically, first indicator member, measured using the § Lai instrument sensor 4 9 a of the wafer W § Rye placement mark formed on (not Figure shown) + Y side, the wafer W based on the result of the measurement performing a pre-alignment. Next, the arrangement of the shot areas on the wafer W, for example, full Ain § Rye member Bok found using EGA is performed while moving the wafer stage 5. Then, after the wafer exchange is made directly under § Lai instrument sensor 4 9 b wafer stage 5 which exposure sequence has been completed is moved to an Y-direction, the § Lai instrument sequence is executed. Also move in § Lai instrument sensor 4 9 wafer stage 5 is also one Y direction Araimento is performed in a, the exposure sequence is performed just below the projection optical science system PL.

In this embodiment, the addition to the same effect as the first embodiment can be obtained, the two wafer stages 5, 5 are moved independently, © E c exchange and Araimento on one of the stages performs an operation, the row Tsuteharu since concurrently an exposure operation on the other stage, it is possible to greatly improve the throughput. Moreover, the stator 3 7 for use in the stearyl over di moves in the Y direction, the movable element 3 to 6 both stages are sharing, reduction of component, i.e., simplification of the device, cost reduction allowing you to achieve.

In the above embodiment, the stator 1 7, 3 7 Coco 2 1 as a moving means in the Y-direction, 3 9, 4 is set to 7 to provide configuration is not limited thereto, for example : or it may be provided with a non-contact bearing such as an air bearing. In this case, in addition to the same actions and effects as Γ Kotoki using rollers is obtained, since the stator 1 7, 3 7 moves not I '' half the friction milling, reaction frame 8 and the base plate 1 vibration of 0, it is possible to eliminate the disturbance caused by the friction, can you to implement more accurate exposure processing. Incidentally, the rollers Ya air bearing be provided in the stator, may be in either configuration be provided to the reaction frame 8 Yabe one scan plate 1 0 supporting the stator. Incidentally, although not shown, as in the third embodiment is also the reticle stage 2, it may be mechanisms capable of supporting a plurality of reticles R. In this case, coarse movement stage constituting the reticle stage 2 is commonly, the reticle R may be provided a plurality independently fine movement stage that holds. This makes it possible to the whole emission chicle stage 2 to compact Bok configuration.

In the above embodiment, the reticle stage 2, but Oite stator 1 7, 3 7 to both of the wafer stage 5 is configured to move by the reaction force, the stator in either stearyl one Jinomi is it is needless to say that it may be moved counter force. Furthermore, in the embodiment above Symbol embodiment, all all antivibration Yuni' Bok force thereof was configured to perform image stabilization active, these either, or any plurality of a configuration shown performing image stabilization in passive it may be. Further, the reticle stage 2 coarse movement stage, a two-stage configuration of the fine scan Te temporarily, in either or both, a member (e.g., stators) as provided structure to move by the reaction force accompanying the movement of the stage it may be. Further, in the embodiment above Symbol embodiment, but the stage device of the present invention is configured to be applied to the exposure apparatus 1, which: not intended to be this limitation, drawing device of transfer mask in addition to the exposure apparatus 1, mask to precision measurement instruments coordinates measuring apparatus or the like of the pattern can be applied.

As the substrate of the present embodiment, Narazu only the semiconductor wafer W for a semiconductor device, or a glass substrate for a liquid crystal display device, the original plate of a mask or reticle used in the canceller Mikkuweha or exposure for a thin film magnetic head, (synthetic quartz, silicon wafer) used by an exposure apparatus. The exposure apparatus 1, a scanning exposure apparatus by a step • and 'scan type reticle R and the wafer W, by synchronously moving the PW that scans and exposes the pattern of the reticle R (scanning stepper; USP5,4 73,4i0) in addition to, exposing a pattern of the reticle R in a stationary state the reticle R and the wafer W, the wafer W, in a projection exposure apparatus by a step-and-repeater over preparative method of sequentially step move the PW (stepper) it is possible to apply. The type of exposure apparatus 1 is not limited to the exposure apparatus for manufacturing semiconductor devices for exposing a semiconductor device pattern the wafer W, exposure apparatus for liquid crystal display device manufacturing, thin-film magnetic head, the image pickup device (CCD) or widely applicable to an exposure apparatus for manufacturing such as a reticle.

Further, as the light source of the exposure illumination light, bright line generated from ultra-high pressure mercury lamp (g-rays (436 nm), h-ray (404. 7 nm), i-ray (365 nm) :), KrF E key Shimare one The ( 248 nm), a r F excimer one the (193 nm), not only the F 2 laser (157 nm) only, Ru can be uses charged particle beams such as X-ray or electron beam. In Kiyoshie, as the electron gun in the case of using an electron beam, Kisaborai preparative to thermionic emission type lanthanum (LaB, can be used tantalum (Ta). Furthermore, when using the electron beam is used reticle R a configuration may be provided, Izu use the reticle R;:. this directly may be provided with a pattern on a wafer may also be used, such as radio frequency, such as YAG lasers and semiconductor lasers.

Magnification of the projection optical system PL may be either equal magnification system and the magnifying system not only a reduction system. Further, As the projection optical system PL, using a material which transmits far ultraviolet rays such as quartz and fluorite as the glass material when using far ultraviolet rays such as excimer one The catadioptric system when using the F 2 laser or X-ray or the refractive based optical system (also reticle R used as a reflective type), or may be used an electron optical system comprising an electron lens and a deflector as an optical system in the case of using an electron beam. The optical path through which an electron beam passes, it is needless to say that the vacuum state. Further, without using the projection optical system PL,. Reticle R and intimately bringing the wafer W it can be applied to flop port Kishimiti exposure apparatus that exposes a pattern of the reticle R.

Wafer stage 5 Ya reticle stage 2 in Riniamo Isseki (USP5,623,853 or USP5, see 528,118) in the case of using a magnetic levitation type that uses an air levitation type Ron'n' force or reactance force using air bearings it may be used either. Also. Each stage 2, 5 may be of a type moving along a guide, or may be a guide dress type provided with no guide. The stages 2, 5 of the driving mechanism, a magnet unit in which magnets are two-dimensional (permanent magnets), each stage 2, 5 by the electromagnetic force is opposed to the armature Yunitto the coil was placed in a two-dimensional it may be used flat surface motor for driving. In this case, to connect either one of the magnet unit and the armature unit to the stage 2, 5, may be provided and the other of the magnet unit and the armature unit Stage 2, 5 moving surface side of the (base) .

As described above, the exposure apparatus 1 of the present application embodiment, the various subsystems, including each element listed in the claims of the present application so that the predetermined mechanical accuracy, the optical accuracy , it is manufactured by assembling. To ensure these respective precisions, performed before and after the assembling include the adjustment for achieving the optical accuracy for various optical systems, an adjustment to achieve mechanical accuracy for various mechanical systems, the various electrical systems adjustment for achieving the electrical accuracy is performed. The process of assembling the various sub-system to the exposure apparatus, the various sub-systems, the mechanical interconnection, electrical circuitry wiring connections, and the piping connection of the air pressure circuit. Before the assembly process from the various subsystems to the exposure light device, there are also the processes of assembling each individual subsystem. After completion of the assembling the various subsystems into the exposure apparatus, overall adjustment is performed and various kinds of accuracy as the entire exposure apparatus are secured. The manufacture of exposure equipment is better Nozomu be carried out in a clean room in which the temperature and chestnut Ichin level are controlled, ',.

The semiconductor device, as shown in FIG. 8, stearyl Uz flop 2 0 1 that designs the functions and performance of the device, Sutetsu flop 2 0 2 of manufacturing a mask (reticle) based on this design step, a wafer from a silicon material step 2 0 3 to be manufactured, wafer processing Sutedzu flop 2 0 4 for exposing the wafer to the pattern of the reticle by the exposure apparatus 1 of the embodiment type condition described above, a device assembly step (dicing, bonding, including Pas Dzukeji step) 2 0 5, an inspection step 2 0 6 or the like. Industrial Applicability

The present invention is a glass substrate or a wafer or the like, and the substrate onto which the pattern of the mask is exposed, the stage device and a driving method of the stage main body moves platen in a plane holding the substrate of this, and in this stage device holding mask and the exposure processing by using the substrate: relates 亍 U exposure apparatus and exposure method, particularly when manufacturing a device such as a semiconductor integrated circuit and a liquid crystal Display I, suitable for use in higher lithographic Ye substrate , stage device, a stage drive method and an exposure apparatus and an exposure method.

According to the stage device and the stage drive method of the present invention, a supporting portion arranged vibrationally independently with respect to the surface plate, and a reaction force stage that moves on the supporting portion by the reaction force accompanying the drive of the stage body since comprises, Ki out to avoid the problem of shaking-back or the like, it is possible to improve the throughput becomes shorter settling time, the residual vibration of the support portion can be suppressed from being transmitted to the surface plate, the stage body the position controllability can be maintained. Further, since the platen is supported by the support portion via a vibration isolation mechanism, the residual vibration of the support portion can be suppressed from being transmitted to the base, there is also an effect called can maintain the position control of the stage main body. Further, the reaction force stage stage body - so has a configuration which forms at least part of the driving mechanism for driving in the direction, there is no need to separately provide a mechanism for eliminating the reaction force, the size of the apparatus and low price reduction is realized. Then, between the support portion and the reaction force stage, since the rolling element to rotate around the axis moves against the reaction force stage the support portion is interposed, when the reaction force stage moves, rolling elements is performed by a simple operation of rotating around the axis, which achieves simplification of the device in addition, the non-contact bearing between. reaction force stage and the support portion is interposed, the reaction force since the stage is moved in without friction, vibration, etc. of the support portion, the disturbance caused by the friction can be eliminated. Further, by the return device biasing portion such that it it biases the reaction force stage in opposite directions to each other, there is also an effect that a readily reaction force stage with a simple mechanism can be returned to the initial position. Also, is movable in the Ryakujika direction orthogonal to the main stage member is moved, since the reaction force stage is turned arrangements et provided for each direction of the substantially perpendicular, to the movement even when the main stage member is moved two-dimensionally reaction force it is possible to avoid the problem of shaking-back such as caused by, it is possible to further improve the shorter becomes throughput I settling time with.

Then, according to the exposure apparatus and the exposure method of the present invention, as at least one stage of the mask stage and the substrate stages, the stage device described in Section 9 of have Zureka 1 paragraphs claim 1, wherein and, since the stage drive method described in the first 7 second 0 term in have Zureka 1 paragraphs claims is used, it is possible to improve the throughput and exposure precision Ri a short settling time together, residual vibration of the support portion can be suppressed from being transmitted to the base and can maintain the position control of the stage main body, the mask stage, the substrate stage and the projection optical system is arranged vibrationally independently of one another it is, the vibration caused by the driving of the stage can be prevented from being transmitted to the projection optical system, generation of Zureyazobo Ke like pattern transfer position due to vibration of the projection optical system Effectively prevent to thereby improving the exposure accuracy. Furthermore, the mask stage is a plurality mask by the substrate stage for holding a plurality of substrates, since performed in parallel exchange Contact and Araimento operation and the exposure operation, it is possible to greatly improve the throughput. Moreover, if shared stator with a plurality of movable elements, reduction of component, i.e., simplification of the apparatus, it is possible to realize a low cost. On the other hand, according to the substrate of the present invention, than the pattern using the above exposure method is an exposure, superimposition of patterns, will be the line width or the like is maintained with high accuracy, express a given device characteristics it becomes possible to.

Claims

The scope of the claims
1. A stage apparatus which includes a stage body that is driven at least in one direction platen,
A support portion disposed vibrationally independently with respect to the surface plate,
Stage apparatus characterized by comprising a mobile self-standing reaction force stages on the support portion in the one direction by a reaction force caused by the driving of the stage main body.
2. The surface plate, the stage device of the range first claim of claim, characterized in that it is supported by the support portion via a vibration isolation mechanism.
3. The reaction force stage, the stage device of at least the claims part and wherein the configuring the first term or the second claim of the drive Organization for driving the stage main body in the one direction.
4. The drive mechanism includes a movable element provided on the stage body, and a stator for driving the movable piece in the one direction by electromagnetic interaction with the mover, before Ϊ himself anti power stage, the stage apparatus in the range 3 claim of claim, characterized in that it comprises the stator.
5. The Between the reaction force stage and the support portion, characterized that you rolling elements for moving the reaction force stage rotates around an axis in the one direction relative to the support portion is interposed stage apparatus ranging first claim of claim to.
6 wherein between the reaction force stage and the support portion, a stage device in the range first claim of claim, wherein the non-contact bearing is interposed.
7. The stage apparatus ranging first claim of claim, characterized in that it comprises a return device for the reaction force stage to return to the initial position.
8. The return device, the range seventh Kouki mounting the stage apparatus according to, characterized in that it comprises a biasing portion that the reaction force stage to which it biased in the direction you mutually exclusive along said one direction .
9. The stage body is movable in a direction substantially orthogonal to each other, the reaction force stage Claims claim 1 wherein the feature that provided for each direction in the direction the perpendicular of the stage device.
In 1 0. Exposure apparatus that exposes a pattern of a mask held by the mask stage to the substrate held by the substrate stage,
Front "as at least one stage of his own mask stage and said substrate stage, the exposure, characterized in that the stage device is found using according to any one of Claims first paragraphs paragraph 9 device.
1 1. The disposed between the mask stage and said substrate stage, the exposure of the claims first 0 claim of which is characterized by comprising a projection optical system for projecting a pattern of the mask on the substrate apparatus.
1 2. The mask stage, vibrationally independently exposure range of the first one of claims claims characterized in that it is disposed the substrate stage and the projection optical system to each other
1 3. The mask stage includes a fine movement stage movable in a first direction while holding the mask, have a and possible coarse movement stage movable in a second direction is connected to the fine stage different from said first direction to which it ranges first 0 Kouki mounting of the exposure apparatus according to according to claim.
1 4. The at least one of the mask stage and said substrate stage, the exposure apparatus c ranging first 0 claim of claim, which is a Guy dress stage
1 5. The mask stage, the exposure apparatus in the range first 0 claim of claim, characterized in that is capable of holding a plurality of masks.
1 6. The substrate stage, the exposure apparatus in the range first 0 claim of claim you characterized in that it is holding a plurality of substrates.
1 7. A stearyl one di driving method includes a first stage that is driving the platen in at least one direction,
Scan Te temporary driving method characterized in that to support the second stage which is movable the one direction by the reaction force accompanying the drive of the first stage to vibrationally separate the support portion relative to said platen .
1 8. The second stage is a stage drive method in the range first 7 claim of claim, characterized in that the first stage moves in the opposite direction.
1 9. The stage drive method of the range first 7 claim of claim the second stage characterized in that it comprises a step for returning to the initial position.
2 0. The weight of the second stage, a stage drive method in the range first 7 claim of claim, wherein the heavier than the weight of the first stage.
In 2 1. Exposure method a pattern of mask held by the mask stage exposed to a substrate held on a substrate stage,
Wherein the stage driving method is used as described in any one of the mask stage and at least one stage of Claims first from 7 Section 2 0 term as a driving method of the substrate stage exposure method.
2 2. The exposure method according to the range the second 1, wherein said further comprising the step of exposing the pattern during the movement of the mask stage and the substrate stage.
2 3. The exposure method ranges second one of claims claims, characterized in that it comprises a step of holding a plurality of masks to the mask stage.
2 4. The exposure method in the range second one of claims claims including the step of holding a plurality of substrates on the substrate stage and feature.
Substrate characterized that you pattern is exposed using a 2 5. The exposure method ranges second one of claims claims.
PCT/JP1999/005539 1999-10-07 1999-10-07 Substrate, stage device, method of driving stage, exposure system and exposure method WO2001027978A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP1999/005539 WO2001027978A1 (en) 1999-10-07 1999-10-07 Substrate, stage device, method of driving stage, exposure system and exposure method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
AU6005499A AU6005499A (en) 1999-10-07 1999-10-07 Substrate, stage device, method of driving stage, exposure system and exposure method
CN 99816934 CN1260772C (en) 1999-10-07 1999-10-07 Stage device, method of driving stage, exposure device and exposure method
PCT/JP1999/005539 WO2001027978A1 (en) 1999-10-07 1999-10-07 Substrate, stage device, method of driving stage, exposure system and exposure method

Publications (1)

Publication Number Publication Date
WO2001027978A1 true true WO2001027978A1 (en) 2001-04-19

Family

ID=14236940

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1999/005539 WO2001027978A1 (en) 1999-10-07 1999-10-07 Substrate, stage device, method of driving stage, exposure system and exposure method

Country Status (2)

Country Link
CN (1) CN1260772C (en)
WO (1) WO2001027978A1 (en)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059797A (en) * 2001-08-09 2003-02-28 Canon Inc Movement apparatus, stage device, and exposure system
US6686991B1 (en) 2000-11-06 2004-02-03 Nikon Corporation Wafer stage assembly, servo control system, and method for operating the same
WO2004032212A1 (en) * 2002-10-04 2004-04-15 Nikon Corporation Stage device and exposure device
US6741332B2 (en) 2001-08-08 2004-05-25 Nikon Corporation Stage system, exposure apparatus, and device manufacturing method
JP2005286321A (en) * 2004-03-04 2005-10-13 Asml Netherlands Bv Movable object carrier, lithographic apparatus including movable object carrier, and device manufacturing method
US7453550B2 (en) 2003-02-26 2008-11-18 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2009135507A (en) * 1999-12-21 2009-06-18 Asml Netherlands Bv Balanced positioning system for use in lithography projection equipment
US7696653B2 (en) 2006-03-30 2010-04-13 Nikon Corporation Movable-body apparatus, exposure apparatus and methods comprising same, and device-manufacturing methods
US7855777B2 (en) 2003-07-09 2010-12-21 Nikon Corporation Exposure apparatus and method for manufacturing device
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US8446579B2 (en) 2008-05-28 2013-05-21 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US8462317B2 (en) 2007-10-16 2013-06-11 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8520291B2 (en) 2007-10-16 2013-08-27 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8547519B2 (en) 2003-11-14 2013-10-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8675177B2 (en) 2003-04-09 2014-03-18 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in first and second pairs of areas
US8854601B2 (en) 2005-05-12 2014-10-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9097981B2 (en) 2007-10-12 2015-08-04 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9140993B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9140990B2 (en) 2004-02-06 2015-09-22 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US9164209B2 (en) 2003-11-20 2015-10-20 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power having different thicknesses to rotate linear polarization direction
CN106873316A (en) * 2003-02-26 2017-06-20 株式会社尼康 Exposure apparatus, exposure method, and method for producing device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101825847B (en) * 2003-04-11 2013-10-16 株式会社尼康 Cleanup method for optics in immersion lithography
EP1475668A1 (en) 2003-05-09 2004-11-10 ASML Netherlands B.V. Method of preparing components for a lithographic apparatus
US20050128449A1 (en) 2003-12-12 2005-06-16 Nikon Corporation, A Japanese Corporation Utilities transfer system in a lithography system
JP2005331402A (en) 2004-05-20 2005-12-02 Sumitomo Heavy Ind Ltd Stage device
US8544317B2 (en) * 2009-10-09 2013-10-01 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor processing apparatus with simultaneously movable stages
CN102880013B (en) * 2012-09-28 2015-02-18 清华大学 Reticle stage worktable
CN103543612B (en) * 2013-09-25 2015-09-30 清华大学 A tape moving iron vacuum enclosure cable-DOF motion platform Maglev
CN107450284A (en) * 2017-09-27 2017-12-08 武汉华星光电技术有限公司 Exposure equipment and exposure method for transparent substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0917004A2 (en) * 1997-11-11 1999-05-19 Canon Kabushiki Kaisha Stage system and exposure apparatus with the same
US5909272A (en) * 1996-08-02 1999-06-01 Canon Kabushiki Kaisha Stage and exposure apparatus using same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5909272A (en) * 1996-08-02 1999-06-01 Canon Kabushiki Kaisha Stage and exposure apparatus using same
EP0917004A2 (en) * 1997-11-11 1999-05-19 Canon Kabushiki Kaisha Stage system and exposure apparatus with the same

Cited By (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009135507A (en) * 1999-12-21 2009-06-18 Asml Netherlands Bv Balanced positioning system for use in lithography projection equipment
JP4621765B2 (en) * 1999-12-21 2011-01-26 エーエスエムエル ネザーランズ ビー.ブイ. Equilibrium positioning system for use in a lithographic projection apparatus
JP2009141371A (en) * 1999-12-21 2009-06-25 Asml Netherlands Bv Balanced positioning system for use in lithographic apparatus
US6686991B1 (en) 2000-11-06 2004-02-03 Nikon Corporation Wafer stage assembly, servo control system, and method for operating the same
US6741332B2 (en) 2001-08-08 2004-05-25 Nikon Corporation Stage system, exposure apparatus, and device manufacturing method
JP2003059797A (en) * 2001-08-09 2003-02-28 Canon Inc Movement apparatus, stage device, and exposure system
WO2004032212A1 (en) * 2002-10-04 2004-04-15 Nikon Corporation Stage device and exposure device
CN106873316A (en) * 2003-02-26 2017-06-20 株式会社尼康 Exposure apparatus, exposure method, and method for producing device
US7542128B2 (en) 2003-02-26 2009-06-02 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US9182684B2 (en) 2003-02-26 2015-11-10 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US9766555B2 (en) 2003-02-26 2017-09-19 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8736809B2 (en) 2003-02-26 2014-05-27 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7453550B2 (en) 2003-02-26 2008-11-18 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7907253B2 (en) 2003-02-26 2011-03-15 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7907254B2 (en) 2003-02-26 2011-03-15 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7911583B2 (en) 2003-02-26 2011-03-22 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7932991B2 (en) 2003-02-26 2011-04-26 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8102504B2 (en) 2003-02-26 2012-01-24 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US9348239B2 (en) 2003-02-26 2016-05-24 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US9164393B2 (en) 2003-04-09 2015-10-20 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in four areas
US9678437B2 (en) 2003-04-09 2017-06-13 Nikon Corporation Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction
US9146474B2 (en) 2003-04-09 2015-09-29 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger and different linear polarization states in an on-axis area and a plurality of off-axis areas
US9885959B2 (en) 2003-04-09 2018-02-06 Nikon Corporation Illumination optical apparatus having deflecting member, lens, polarization member to set polarization in circumference direction, and optical integrator
US8675177B2 (en) 2003-04-09 2014-03-18 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in first and second pairs of areas
US8879043B2 (en) 2003-07-09 2014-11-04 Nikon Corporation Exposure apparatus and method for manufacturing device
US7855777B2 (en) 2003-07-09 2010-12-21 Nikon Corporation Exposure apparatus and method for manufacturing device
US9140993B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9140992B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9244359B2 (en) 2003-10-28 2016-01-26 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9423697B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9423698B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9146476B2 (en) 2003-10-28 2015-09-29 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9760014B2 (en) 2003-10-28 2017-09-12 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US8547519B2 (en) 2003-11-14 2013-10-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9952515B2 (en) 2003-11-14 2018-04-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9134622B2 (en) 2003-11-14 2015-09-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9134623B2 (en) 2003-11-14 2015-09-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8634056B2 (en) 2003-11-14 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9164209B2 (en) 2003-11-20 2015-10-20 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power having different thicknesses to rotate linear polarization direction
US9885872B2 (en) 2003-11-20 2018-02-06 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light
US10007194B2 (en) 2004-02-06 2018-06-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US9429848B2 (en) 2004-02-06 2016-08-30 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US9140990B2 (en) 2004-02-06 2015-09-22 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US9423694B2 (en) 2004-02-06 2016-08-23 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
JP4560426B2 (en) * 2004-03-04 2010-10-13 エーエスエムエル ネザーランズ ビー.ブイ. Movable article carrying apparatus, lithographic apparatus including a movable article carrying apparatus, and device manufacturing method
JP2005286321A (en) * 2004-03-04 2005-10-13 Asml Netherlands Bv Movable object carrier, lithographic apparatus including movable object carrier, and device manufacturing method
US9891539B2 (en) 2005-05-12 2018-02-13 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US8854601B2 (en) 2005-05-12 2014-10-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9310696B2 (en) 2005-05-12 2016-04-12 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9360763B2 (en) 2005-05-12 2016-06-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9429851B2 (en) 2005-05-12 2016-08-30 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US7696653B2 (en) 2006-03-30 2010-04-13 Nikon Corporation Movable-body apparatus, exposure apparatus and methods comprising same, and device-manufacturing methods
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US9366970B2 (en) 2007-09-14 2016-06-14 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US9057963B2 (en) 2007-09-14 2015-06-16 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US10101666B2 (en) 2007-10-12 2018-10-16 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9097981B2 (en) 2007-10-12 2015-08-04 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US8462317B2 (en) 2007-10-16 2013-06-11 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8508717B2 (en) 2007-10-16 2013-08-13 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8520291B2 (en) 2007-10-16 2013-08-27 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9341954B2 (en) 2007-10-24 2016-05-17 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9857599B2 (en) 2007-10-24 2018-01-02 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9057877B2 (en) 2007-10-24 2015-06-16 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9678332B2 (en) 2007-11-06 2017-06-13 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US8446579B2 (en) 2008-05-28 2013-05-21 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method
US8456624B2 (en) 2008-05-28 2013-06-04 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method

Also Published As

Publication number Publication date Type
CN1373900A (en) 2002-10-09 application
CN1260772C (en) 2006-06-21 grant

Similar Documents

Publication Publication Date Title
US6788385B2 (en) Stage device, exposure apparatus and method
US6525803B2 (en) Balanced positioning system for use in lithographic apparatus
US20070081136A1 (en) Exposure apparatus and device fabrication method
US20100157276A1 (en) Exposure apparatus, exposure method, device manufacturing method, and carrier method
US20080012511A1 (en) Planar Motor Device, Stage Device, Exposure Device and Device Manufacturing Method
US6879375B1 (en) Exposure apparatus and method that exposes a pattern onto a substrate
US6320645B1 (en) Stage system and exposure apparatus, and device manufacturing method using the same
US20020080339A1 (en) Stage apparatus, vibration control method and exposure apparatus
US20090225288A1 (en) Exposure apparatus, exposure method, and device manufacturing method
US6252314B1 (en) Linear motor and stage system, and scanning exposure apparatus using the same
US7301607B2 (en) Wafer table for immersion lithography
US6885430B2 (en) System and method for resetting a reaction mass assembly of a stage assembly
JP2005203483A (en) Stage equipment and exposure apparatus
US20040080730A1 (en) System and method for clamping a device holder with reduced deformation
WO2002080185A1 (en) Stage device, exposure device, and method of manufacturing device
WO2003063212A1 (en) Stage device and exposure device
US20040051854A1 (en) System and method for resetting a reaction mass assembly of a stage assembly
US6842248B1 (en) System and method for calibrating mirrors of a stage assembly
JP2002198284A (en) Stage device and projection aligner
WO2007018127A1 (en) Stage apparatus and exposure apparatus
EP1111469A2 (en) Lithographic apparatus with a balanced positioning system
JP2002043213A (en) Stage device and exposure system
US6917412B2 (en) Modular stage with reaction force cancellation
WO2005048325A1 (en) Stage drive method, stage apparatus, and exposure apparatus
US20030128350A1 (en) Stage device and exposure apparatus

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AL AM AT AU AZ BA BB BG BR BY CA CH CN CR CU CZ DE DK DM EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 1020017016269

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 99816934X

Country of ref document: CN

ENP Entry into the national phase in:

Ref country code: JP

Ref document number: 2001 530901

Kind code of ref document: A

Format of ref document f/p: F

WWP Wipo information: published in national office

Ref document number: 1020017016269

Country of ref document: KR

122 Ep: pct application non-entry in european phase
WWG Wipo information: grant in national office

Ref document number: 1020017016269

Country of ref document: KR