JP4438891B2 - 基板の搬送用キャリアおよびその製造方法 - Google Patents
基板の搬送用キャリアおよびその製造方法 Download PDFInfo
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- JP4438891B2 JP4438891B2 JP2009015539A JP2009015539A JP4438891B2 JP 4438891 B2 JP4438891 B2 JP 4438891B2 JP 2009015539 A JP2009015539 A JP 2009015539A JP 2009015539 A JP2009015539 A JP 2009015539A JP 4438891 B2 JP4438891 B2 JP 4438891B2
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- silicate
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- 239000000758 substrate Substances 0.000 title claims description 63
- 238000000034 method Methods 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229920005989 resin Polymers 0.000 claims description 59
- 239000011347 resin Substances 0.000 claims description 59
- -1 silicate compound Chemical class 0.000 claims description 49
- 239000000203 mixture Substances 0.000 claims description 45
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 30
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 17
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 12
- 238000006482 condensation reaction Methods 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 10
- 238000006460 hydrolysis reaction Methods 0.000 claims description 9
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 claims description 8
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 230000007062 hydrolysis Effects 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 description 23
- 239000004945 silicone rubber Substances 0.000 description 23
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 20
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 13
- 238000012360 testing method Methods 0.000 description 12
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 11
- 238000005259 measurement Methods 0.000 description 8
- 230000032258 transport Effects 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 230000001771 impaired effect Effects 0.000 description 6
- 230000009257 reactivity Effects 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000011068 loading method Methods 0.000 description 5
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000012050 conventional carrier Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 125000005372 silanol group Chemical group 0.000 description 4
- 150000004760 silicates Chemical class 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 150000004703 alkoxides Chemical class 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 3
- 239000013638 trimer Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 241000282376 Panthera tigris Species 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000004949 mass spectrometry Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- PQPVPZTVJLXQAS-UHFFFAOYSA-N hydroxy-methyl-phenylsilicon Chemical class C[Si](O)C1=CC=CC=C1 PQPVPZTVJLXQAS-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009015539A JP4438891B2 (ja) | 2009-01-27 | 2009-01-27 | 基板の搬送用キャリアおよびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009015539A JP4438891B2 (ja) | 2009-01-27 | 2009-01-27 | 基板の搬送用キャリアおよびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009147353A JP2009147353A (ja) | 2009-07-02 |
| JP2009147353A5 JP2009147353A5 (enExample) | 2010-02-04 |
| JP4438891B2 true JP4438891B2 (ja) | 2010-03-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009015539A Expired - Fee Related JP4438891B2 (ja) | 2009-01-27 | 2009-01-27 | 基板の搬送用キャリアおよびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4438891B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012049322A (ja) * | 2010-08-26 | 2012-03-08 | Fuji Xerox Co Ltd | 基板搬送用部材 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012160563A (ja) * | 2011-01-31 | 2012-08-23 | Fujifilm Corp | 基板搬送用キャリアの製造方法 |
| JP2013062496A (ja) * | 2011-08-23 | 2013-04-04 | Fujifilm Corp | 基板搬送用キャリアの製造方法および基板搬送用キャリア |
| JP2013077742A (ja) * | 2011-09-30 | 2013-04-25 | Fujifilm Corp | 基板搬送用キャリアおよびその製造方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0722795A (ja) * | 1993-06-30 | 1995-01-24 | Shin Etsu Chem Co Ltd | 薄型基板用固定治具 |
| US6919122B2 (en) * | 1999-07-08 | 2005-07-19 | Saint-Gobain Performance Plastics Corporation | Flexible composites with integral flights for use in high-temperature food processing equipment and methods for producing the same |
| JP2003119385A (ja) * | 2001-10-16 | 2003-04-23 | Ge Toshiba Silicones Co Ltd | 室温硬化性ポリオルガノシロキサン組成物 |
| JP3855879B2 (ja) * | 2002-08-07 | 2006-12-13 | 松下電器産業株式会社 | フレキシブルプリント基板の搬送用キャリアおよびフレキシブルプリント基板への電子部品実装方法 |
| JP3585904B2 (ja) * | 2002-11-01 | 2004-11-10 | 株式会社 大昌電子 | 保持搬送用治具 |
| JP2005072556A (ja) * | 2003-08-06 | 2005-03-17 | Kenseidou Kagaku Kogyo Kk | 配線基板キャリア |
| AU2005204368A1 (en) * | 2004-01-06 | 2005-07-28 | Aspen Aerogels, Inc. | Ormosil aerogels containing silicon bonded linear polymers |
| JP2005294579A (ja) * | 2004-03-31 | 2005-10-20 | Matsui Denki Sangyo Kk | 付着防止塗料を有する粘着面で配線基板を固定する治具 |
| JP2005294578A (ja) * | 2004-03-31 | 2005-10-20 | Matsui Denki Sangyo Kk | 網目状又は規則正しく配置された点状に付けられた粘着剤で配線基板を固定する粘着力を調節した治具 |
| JP4628760B2 (ja) * | 2004-11-30 | 2011-02-09 | 信越化学工業株式会社 | 球状疎水性ポリジオルガノシロキサン含有シリカ微粒子、静電荷像現像用トナー外添剤およびトナー |
| JP2007291324A (ja) * | 2006-03-31 | 2007-11-08 | Jsr Corp | 酸化物微粒子含有ポリシロキサン組成物およびその製造方法 |
| JP2007266558A (ja) * | 2006-03-30 | 2007-10-11 | Shin Etsu Polymer Co Ltd | 粘着シート、粘着シートの製造方法、及び配線板用固定治具 |
| JP2007270055A (ja) * | 2006-03-31 | 2007-10-18 | Jsr Corp | 多官能ポリシロキサンおよび金属酸化物微粒子含有ポリシロキサン組成物、ならびにそれらの製造方法 |
| JP2008069326A (ja) * | 2006-09-15 | 2008-03-27 | Suzuka Fuji Xerox Co Ltd | 有機−無機ハイブリッドポリマー及びその製造方法 |
| JP2008120054A (ja) * | 2006-11-16 | 2008-05-29 | Suzuka Fuji Xerox Co Ltd | 有機・無機ハイブリッド成形物の製造方法 |
| JP4255088B1 (ja) * | 2008-06-06 | 2009-04-15 | 鈴鹿富士ゼロックス株式会社 | ハイブリッド組成物 |
-
2009
- 2009-01-27 JP JP2009015539A patent/JP4438891B2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012049322A (ja) * | 2010-08-26 | 2012-03-08 | Fuji Xerox Co Ltd | 基板搬送用部材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009147353A (ja) | 2009-07-02 |
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