JP4435663B2 - はんだ材料、電子部品、及び電子部品の製造方法 - Google Patents

はんだ材料、電子部品、及び電子部品の製造方法 Download PDF

Info

Publication number
JP4435663B2
JP4435663B2 JP2004291979A JP2004291979A JP4435663B2 JP 4435663 B2 JP4435663 B2 JP 4435663B2 JP 2004291979 A JP2004291979 A JP 2004291979A JP 2004291979 A JP2004291979 A JP 2004291979A JP 4435663 B2 JP4435663 B2 JP 4435663B2
Authority
JP
Japan
Prior art keywords
solder
electronic component
solder material
component
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004291979A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006102769A5 (enExample
JP2006102769A (ja
Inventor
稔正 津田
夏彦 坂入
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2004291979A priority Critical patent/JP4435663B2/ja
Publication of JP2006102769A publication Critical patent/JP2006102769A/ja
Publication of JP2006102769A5 publication Critical patent/JP2006102769A5/ja
Application granted granted Critical
Publication of JP4435663B2 publication Critical patent/JP4435663B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2004291979A 2004-10-04 2004-10-04 はんだ材料、電子部品、及び電子部品の製造方法 Expired - Fee Related JP4435663B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004291979A JP4435663B2 (ja) 2004-10-04 2004-10-04 はんだ材料、電子部品、及び電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004291979A JP4435663B2 (ja) 2004-10-04 2004-10-04 はんだ材料、電子部品、及び電子部品の製造方法

Publications (3)

Publication Number Publication Date
JP2006102769A JP2006102769A (ja) 2006-04-20
JP2006102769A5 JP2006102769A5 (enExample) 2009-08-06
JP4435663B2 true JP4435663B2 (ja) 2010-03-24

Family

ID=36373061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004291979A Expired - Fee Related JP4435663B2 (ja) 2004-10-04 2004-10-04 はんだ材料、電子部品、及び電子部品の製造方法

Country Status (1)

Country Link
JP (1) JP4435663B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012174332A (ja) 2011-02-17 2012-09-10 Fujitsu Ltd 導電性接合材料、導体の接合方法、及び半導体装置の製造方法
JP2013119089A (ja) * 2011-12-06 2013-06-17 Fujitsu Ltd 導電性接合材料、並びに電子部品及び電子機器
KR102156373B1 (ko) * 2013-05-10 2020-09-16 엘지이노텍 주식회사 솔더 페이스트
CN114055008B (zh) * 2021-11-18 2023-09-05 陕西众森电能科技有限公司 一种制备超细焊锡膏的金属粉、焊锡膏及其制备方法

Also Published As

Publication number Publication date
JP2006102769A (ja) 2006-04-20

Similar Documents

Publication Publication Date Title
JP3476464B2 (ja) すずビスマス半田ペーストと，このペーストを利用して，高温特性の改良された接続を形成する方法
JP5045673B2 (ja) 機能部品用リッドとその製造方法
US6360939B1 (en) Lead-free electrical solder and method of manufacturing
CN1914001B (zh) 软钎焊用的助焊剂和软钎焊方法
JP2008510620A (ja) 半田組成物および半田接合方法ならびに半田接合構造
KR100776114B1 (ko) 땜납 접합용 페이스트 및 이를 이용한 땜납 접합 방법
JP4356581B2 (ja) 電子部品実装方法
WO2010098357A1 (ja) 金属フィラー、低温接続鉛フリーはんだ、及び接続構造体
JP4063271B2 (ja) 半田ペーストおよび半田付け方法
CN100586258C (zh) 用于焊接电子元件的方法和电子元件的焊接结构
JP2011147982A (ja) はんだ、電子部品、及び電子部品の製造方法
JP2008006499A (ja) 半田ペースト
JP2013132654A (ja) ソルダペースト
JP2004274000A (ja) 半田付け方法
JP5724088B2 (ja) 金属フィラー及びこれを含む鉛フリーはんだ
JP4435663B2 (ja) はんだ材料、電子部品、及び電子部品の製造方法
JP4471825B2 (ja) 電子部品、及び電子部品の製造方法
JP4134976B2 (ja) 半田接合方法
CN101119827A (zh) 用于具有不同基板的热可靠封装的方法和配置
JP5652689B2 (ja) 電子部品接合構造体の製造方法及び該製造方法により得られた電子部品接合構造体
JP4259431B2 (ja) 半田ペーストおよび半田接合方法
JPH0417994A (ja) はんだ組成物
JP2004095907A (ja) ハンダ接合構造およびハンダペースト
JP2004001030A (ja) はんだペーストおよび半導体装置の製造方法
JP2000135557A (ja) 鉛フリ−耐熱性はんだ及びはんだ付け方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070823

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090624

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20090624

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20090710

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090811

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091013

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20091215

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20091224

R150 Certificate of patent or registration of utility model

Ref document number: 4435663

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130108

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130108

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130108

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140108

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees