JP4429080B2 - 圧電振動子 - Google Patents
圧電振動子 Download PDFInfo
- Publication number
- JP4429080B2 JP4429080B2 JP2004162113A JP2004162113A JP4429080B2 JP 4429080 B2 JP4429080 B2 JP 4429080B2 JP 2004162113 A JP2004162113 A JP 2004162113A JP 2004162113 A JP2004162113 A JP 2004162113A JP 4429080 B2 JP4429080 B2 JP 4429080B2
- Authority
- JP
- Japan
- Prior art keywords
- container body
- lid
- bonding material
- recess
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims description 46
- 239000004020 conductor Substances 0.000 claims description 32
- 230000002093 peripheral effect Effects 0.000 claims description 19
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000013078 crystal Substances 0.000 description 47
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 238000005304 joining Methods 0.000 description 6
- 230000010355 oscillation Effects 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
1a・・・凹部
1b・・・接続パッド
2・・・蓋体
3・・・外部端子
4・・・導体パターン
5・・・水晶振動素子
6・・・接合材
Claims (3)
- 凹部が設けられている容器体と、該容器体の上面であって前記凹部の開口部を囲繞するように被着された導体パターンと、前記凹部内に収容された圧電振動素子と、前記容器体の凹部上に配置された金属製の蓋体と、前記導体パターンと前記蓋体との間に位置して前記導体パターンと前記蓋体と接合する接合材と、を備えた圧電振動子において、
前記導体パターンは、前記凹部の内壁面に延在する内周延在部と、前記容器体の外側面に延在する外周延在部と、を有し、
前記接合材は、前記内周延在部及び前記外周延在部と接合するとともに、前記内周延在部から前記蓋体の下面側に向かって形成されたフィレットを有し、
前記容器体の上面と平行な方向に係る前記接合材の幅寸法が、容器体側から蓋体側に向かって漸次広くなっていることを特徴とする圧電振動子。 - 前記接合材は、前記蓋体の外周部に沿って環状に介在していることを特徴とする請求項1に記載の圧電振動子。
- 前記蓋体の下面で、前記接合材の接合部位にNi層が被着されており、該Ni層に接合される前記接合材がAuSn合金を主成分とする接合材から成っていることを特徴とする請求項1または請求項2に記載の圧電振動子。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004162113A JP4429080B2 (ja) | 2004-05-31 | 2004-05-31 | 圧電振動子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004162113A JP4429080B2 (ja) | 2004-05-31 | 2004-05-31 | 圧電振動子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005347851A JP2005347851A (ja) | 2005-12-15 |
JP4429080B2 true JP4429080B2 (ja) | 2010-03-10 |
Family
ID=35499860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004162113A Expired - Fee Related JP4429080B2 (ja) | 2004-05-31 | 2004-05-31 | 圧電振動子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4429080B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101181579B1 (ko) | 2007-03-22 | 2012-09-10 | 다나까 홀딩스 가부시끼가이샤 | 봉지용 금속 페이스트, 압전소자의 기밀 봉지방법, 및 압전 디바이스 |
JP5396795B2 (ja) * | 2007-10-22 | 2014-01-22 | 株式会社大真空 | 圧電振動デバイス |
-
2004
- 2004-05-31 JP JP2004162113A patent/JP4429080B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005347851A (ja) | 2005-12-15 |
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